Abstract: A displaceable rotating shaft structure and a foldable device having the rotating shaft structure are disclosed. The displaceable rotating shaft structure comprises a support, a rotating shaft, a connecting rod assembly, a guide assembly, and a torsion assembly. The support has a supporting portion. The connecting rod assembly has a first outer end that is rotatably connected to the linking section of the rotating shaft and a second outer end that is pivotally connected to the supporting portion. The guide assembly has a guide rod. The guide rod is configured to displace relative to the supporting portion. When the rotating shaft is rotated, the rotating shaft drives the connecting rod assembly to adjust the angle and the total length of a joint of connecting rods of the connecting rod assembly, a distance between the rotating shaft and the support is changed through the guide assembly.

Abstract: A method of exposing a wafer to a high-tilt angle ion beam and an apparatus for performing the same are disclosed. In an embodiment, a method includes forming a patterned mask layer over a wafer, the patterned mask layer including a patterned mask feature; exposing the wafer to an ion beam, a surface of the wafer being tilted at a tilt angle with respect to the ion beam; and moving the wafer along a scan line with respect to the ion beam, a scan angle being defined between the scan line and an axis perpendicular to an axis of the ion beam, a difference between the tilt angle and the scan angle being less than 50°.

Abstract: A light guiding plate includes a light emitting surface, a structural surface, a light incident surface and a plurality of trench structures. The structural surface is opposite to the light emitting surface. The light incident surface connects between the light emitting surface and the structural surface. The trench structures are formed at intervals on the structural surface. Each of the trench structures includes a first surface and a second surface. The first surface connects with the structural surface. A first angle included between the first surface and the structural surface ranges from 110 degrees to 130 degrees. The second surface connects with the structural surface. The second surface connects with the first surface to form a trench axis. The first surface of each of the trench structures is closer to the light incident surface relative to the corresponding second surface.

Abstract: An optical film includes a first substrate and a second substrate. A plurality of first particles are doped and dispersed in the first substrate, and a plurality of second particles are doped and dispersed in the second substrate. The first substrate has a top surface and a bottom surface, wherein the top surface is a flat surface and the bottom surface is a rough surface. The second substrate is attached to the bottom surface of the first substrate and the second substrate has flat surfaces.