Abstract: The disclosure provides a method for fabricating a heat pipe, and an instrument of the method. The method for fabricating a heat pipe includes providing a hollow tube, wherein the hollow tube has an open end and a closed end; disposing a mandril into the hollow tube from the open end, wherein the inside wall of the hollow tube is separated from the mandril by a space, and wherein the mandril comprises a first portion and a second portion and the first portion has a thermal expansion coefficient larger than that of the second portion; filling up the space between the mandril and the hollow tube with a powder; performing a sintering process to the hollow tube, forming a first agglomeration region and a second agglomeration region; removing the mandril; injecting a working fluid into the hollow tube; and sealing the open end of the hollow tube.

Abstract: An electronic device includes a housing unit, a first electronic component, a heat-dissipating module, and an air-guide passage. The first electronic component, the heat-dissipating module, and the air-guide passage are disposed in the housing unit. The heat-dissipating module includes a fan unit and a heat-dissipating sink. The fan unit has a first air outlet zone and a second air outlet zone. The heat-dissipating sink is for dissipating heat generated by the first electronic component. The heat-dissipating sink is substantially aligned with the first air outlet zone. The air-guide passage is in spatial communication with the second air outlet zone and is formed with a passage air outlet. Air through the first air outlet zone flows in a first direction. Air through the passage air outlet is directed into the housing unit and flows in a second direction different from the first direction.

Abstract: This specification discloses a device of controlling temperature gain and the method thereof. The invention detects the temperature of work environment and uses it to generate a control signal and a PWM signal for dynamically controlling the heaters around electronic elements to heat up. When the temperature of work environment is too low, the invention can increase the stability of the electronic elements.

Abstract: A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measured through by a temperature measuring circuit. When the operating temperature of at least one electronic component is lower than a default temperature, the heating circuits corresponding to the electronic components are enabled respectively to heat the electronic components through corresponding heat conduction elements. When the operating temperature of at least one electronic component is higher than another default temperature, the heating circuits corresponding to the electronic components are disabled to transfer the heat from the electronic components to the heat conduction elements automatically.

Abstract: The disclosure provides a method for fabricating a heat pipe, and an instrument of the method. The method for fabricating a heat pipe includes providing a hollow tube, wherein the hollow tube has an open end and a closed end; disposing a mandril into the hollow tube from the open end, wherein the inside wall of the hollow tube is separated from the mandril by a space, and wherein the mandril comprises a first portion and a second portion and the first portion has a thermal expansion coefficient larger than that of the second portion; filling up the space between the mandril and the hollow tube with a powder; performing a sintering process to the hollow tube, forming a first agglomeration region and a second agglomeration region; removing the mandril; injecting a working fluid into the hollow tube; and sealing the open end of the hollow tube.

Abstract: A fan control system and a fan controlling method thereof are disclosed. The fan control system is used to an electronic apparatus for controlling an air pump fan device. The fan controlling method includes following steps: setting a plurality of vibrating working periods of the air pump fan device; setting a plurality of vibrating frequencies of the air pump fan device, wherein each vibrating frequency has a different vibrating frequency value; detecting a temperature of the electronic apparatus; determining whether the temperature of the electronic apparatus exceeding a first setting temperature; and if yes, controlling the air pump fan device to vibrate according to the plurality of vibrating frequencies during the plurality of vibrating working periods, wherein adjacent vibrating working periods of the plurality of vibrating working periods correspond to different vibrating frequency values.

Abstract: The method of manufacturing heat pipe is disclosed to insert a center bar into a metal tube such that the center bar contacts a clearance area of the inner sidewall of the metal tube. Then, the method is to fill the interval between the center bar and the metal tube with powder for sintering. At last, the method is to perform a sintering, extract the center bar, inject working fluid, and close the metal tube. A heat pipe is therefore formed. Because of no sintered powder on the clearance area, the heat pipe can be bent at the clearance area without damaging the capillary structure formed by the sintered powder. The flow path of the working fluid is not interrupted or influenced, so the heat transfer efficiency can be maintained, which overcomes the decrement of the heat transfer efficiency of a bent heat pipe in the prior art.

Abstract: A thermal module includes a fan device having a fan and a fan housing for covering the fan. A vent is disposed on the fan housing. The thermal module further includes an airflow guiding device installed on the fan housing and disposed on a side of the vent for guiding airflow into the vent.

Abstract: The disclosure provides a method for fabricating a heat pipe, and an instrument of the method. The method for fabricating a heat pipe includes providing a hollow tube, wherein the hollow tube has an open end and a closed end; disposing a mandril into the hollow tube from the open end, wherein the inside wall of the hollow tube is separated from the mandril by a space, and wherein the mandril comprises a first portion and a second portion and the first portion has a thermal expansion coefficient larger than that of the second portion; filling up the space between the mandril and the hollow tube with a powder; performing a sintering process to the hollow tube, forming a first agglomeration region and a second agglomeration region; removing the mandril; injecting a working fluid into the hollow tube; and sealing the open end of the hollow tube.

Abstract: A housing for a centrifugal fan includes a surrounding wall extending upwardly from a periphery of a bottom wall with an air inlet, and including a surrounding wall body defining an opening, a protruding wall body extending outwardly from the surrounding wall body, corresponding to the opening, and having a dust-discharging hole, and a shielding plate disposed on the protruding wall body. The surrounding wall body and the bottom wall cooperatively define an accommodation space communicated with the air inlet, and an air outlet communicated with the accommodation space. The protruding wall body, the shielding plate, and the bottom wall cooperatively define a turbulence space communicated with the accommodation space. The shielding plate is movable between a closed position to close the dust-discharging hole, and an open position to open the dust-discharging hole so as to permit fluid communication between the turbulence space and the outside environment.

Abstract: This specification discloses a device of controlling temperature gain and the method thereof. The invention detects the temperature of work environment and uses it to generate a control signal and a PWM signal for dynamically controlling the heaters around electronic elements to heat up. When the temperature of work environment is too low, the invention can increase the stability of the electronic elements.

Abstract: A heat-dissipating hole mechanism includes a vent structure and an adjusting pad. An opening is formed on the vent structure. The vent structure is used for guiding airflow from a fan to pass through the opening. The adjusting pad is removably disposed on the opening of the vent structure. A railing structure is formed on the adjusting pad. The railing structure is used for covering the opening so as to adjust a flow rate of the airflow.

Abstract: A housing for a centrifugal fan includes a surrounding wall extending upwardly from a periphery of a bottom wall with an air inlet, and including a surrounding wall body defining an opening, a protruding wall body extending outwardly from the surrounding wall body, corresponding to the opening, and having a dust-discharging hole, and a shielding plate disposed on the protruding wall body. The surrounding wall body and the bottom wall cooperatively define an accommodation space communicated with the air inlet, and an air outlet communicated with the accommodation space. The protruding wall body, the shielding plate, and the bottom wall cooperatively define a turbulence space communicated with the accommodation space. The shielding plate is movable between a closed position to close the dust-discharging hole, and an open position to open the dust-discharging hole so as to permit fluid communication between the turbulence space and the outside environment.

Abstract: A thermal module includes a fan device having a fan and a fan housing for covering the fan. A vent is disposed on the fan housing. The thermal module further includes an airflow guiding device installed on the fan housing and disposed on a side of the vent for guiding airflow into the vent.

Abstract: A barrette includes an arched base member, an upper clamping member, which has one end pivoted to one end of the base member and a longitudinal rail at one side, and a lower clamping member, which has a first end pivoted to the base member adjacent to the pivot joint between the base member and the upper clamping member, a second end slidably coupled to the longitudinal rail of the upper clamping member, a longitudinal sliding slot, and an arched clamping strip that has one end fixedly connected to one end of the longitudinal sliding slot and the other end inserted through and movable along the longitudinal sliding slot.

Abstract: A barrette includes an arched base member, an upper clamping member, which has one end pivoted to one end of the base member and a longitudinal rail at one side, and a lower clamping member, which has a first end pivoted to the base member adjacent to the pivot joint between the base member and the upper clamping member, a second end slidably coupled to the longitudinal rail of the upper clamping member, a longitudinal sliding slot, and an arched clamping strip that has one end fixedly connected to one end of the longitudinal sliding slot and the other end inserted through and movable along the longitudinal sliding slot.