Patents by Inventor Wei-Cheng Huang
Wei-Cheng Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250109120Abstract: The invention relates to indoline derivatives and uses thereof for treating and/or preventing an inflammatory condition or fibrosis diseases, and tumor or cell proliferative diseases.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Inventors: Chia-Ron YANG, Wei-Jan HUANG, Kai-Cheng HSU
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Publication number: 20250103914Abstract: In some aspects, the techniques described herein relate to a method including: determining a first cross-entropy loss, wherein the first cross-entropy loss is determined based on a set of predictions, and wherein the set of predictions are based on a classifier head of a machine learning model generating the set of predictions based on a set of feature vectors; updating the classifier head and a prompt of the machine learning model with the first cross-entropy loss; generating outlier samples based on the set of feature vectors; providing, as input to the classifier head, the set of feature vectors and the outlier samples, wherein a second cross-entropy loss and an outlier regularization loss are computed by the classifier head based on the set of feature vectors and the outlier samples; and updating the classifier head with the second cross-entropy loss and the outlier regularization loss.Type: ApplicationFiled: September 27, 2023Publication date: March 27, 2025Inventors: Wei-Cheng HUANG, Richard CHEN, Hsiang HSU
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Patent number: 12261116Abstract: In some embodiments, an integrated circuit device includes a substrate having a frontside and a backside; one or more active semiconductor devices formed on the frontside of the substrate; conductive paths formed on the frontside of the substrate; and conductive paths formed on the backside of the substrate. At least some of the conductive paths formed on the backside of the substrate, and as least some of the conductive paths formed on the front side of the substrate, are signal paths among the active semiconductor devices. In in some embodiments, other conductive paths formed on the backside of the substrate are power grid lines for powering at least some of the active semiconductor devices.Type: GrantFiled: March 10, 2022Date of Patent: March 25, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ching-Yu Huang, Wei-Cheng Lin, Shih-Wei Peng, Jiann-Tyng Tzeng, Yi-Kan Cheng
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Publication number: 20250092225Abstract: A thermoplastic polyurethane precursor that can be used to prepare a polyurethane having a low initial yellowness index, high yellowing resistance, high thermal oxidative aging resistance, high hydrolysis resistance, and low fisheye.Type: ApplicationFiled: July 14, 2023Publication date: March 20, 2025Inventors: Ching-Hao CHENG, Huang-Min WU, Wei-Chun CHANG, Yi-Shuo HUANG, Chi-Feng WU, De-Shun LUO, Si-Yuan CHEN, Yen-Hei CHIANG, Wei-Cheng SUNG
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Patent number: 12255392Abstract: A wideband antenna system includes a first metal radiation portion, having a coupling distance with a second metal radiation portion; a first feeding contact and a second feeding contact, electrically connected to the first metal radiation portion and the second metal radiation portion respectively, and close to the coupling distance; a first ground contact, electrically connected to the second metal radiation portion; a second ground contact, electrically connected to the first metal radiation portion; an impedance tuner, electrically connected to the first feeding contact, the second feeding contact, the first ground contact, the second ground contact, and a radio frequency signal source, to switch the first metal radiation portion and the second metal radiation portion; an aperture contact, electrically connected to the first metal radiation portion; and an aperture tuner, electrically connected to the aperture contact.Type: GrantFiled: March 9, 2023Date of Patent: March 18, 2025Assignee: ASUSTEK COMPUTER INC.Inventors: Chun-Chieh Su, Wei-Cheng Lo, Chien-Ming Hsu, Che-Yen Lin, Chuan-Chien Huang
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Publication number: 20250087533Abstract: A method of forming a semiconductor device includes: forming a via in a first dielectric layer disposed over a substrate; forming a second dielectric layer over the first dielectric layer; forming an opening in the second dielectric layer, where the opening exposes an upper surface of the via; selectively forming a capping layer over the upper surface of the via, where the capping layer has a curved upper surface that extends above a first upper surface of the first dielectric layer distal from the substrate; after forming the capping layer, forming a barrier layer in the opening over the capping layer and along sidewalls of the second dielectric layer exposed by the opening; and filling the opening by forming an electrically conductive material over the barrier layer.Type: ApplicationFiled: March 28, 2024Publication date: March 13, 2025Inventors: Ming-Hsing Tsai, Ya-Lien Lee, Chih-Han Tseng, Kuei-Wen Huang, Kuan-Hung Ho, Ming-Uei Hung, Chih-Cheng Kuo, Yi-An Lai, Wei-Ting Chen
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Publication number: 20250070092Abstract: Various embodiments of the present disclosure are directed towards a shared frontside pad/bridge layout for a three-dimensional (3D) integrated circuit (IC), as well as the 3D IC and a method for forming the 3D IC. A second IC die underlies the first IC die, and a third IC die underlies the second IC die. A first-die backside pad, a second-die backside pad, and a third die backside pad are in a row extending in a dimension and overlie the first, second, and third IC dies. Further, the first-die, second-die, and third-die backside pads are electrically coupled respectively to individual semiconductor devices of the first, second, and third IC dies. The second and third IC dies include individual pad/bridge structures at top metal (TM) layers of corresponding interconnect structures. The pad/bridge structures share the shared frontside pad/bridge layout and provide lateral routing in the dimension for the aforementioned electrical coupling.Type: ApplicationFiled: November 12, 2024Publication date: February 27, 2025Inventors: Harry-Hak-Lay Chuang, Wei-Cheng Wu, Wen-Tuo Huang, Chia-Sheng Lin, Wei Chuang Wu, Shih Kuang Yang, Chung-Jen Huang, Shun-Kuan Lin, Chien Lin Liu, Ping-Tzu Chen, Yung Chun Tu
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Patent number: 12237382Abstract: A semiconductor device includes: a substrate; a channel layer disposed on the substrate, wherein the channel layer is made of GaN; a barrier layer disposed on the channel layer, wherein the barrier layer is made of AlzGa1-zN; and an inserting structure inserted between the channel layer and the barrier layer. The inserting structure includes: a first inserting layer disposed on the channel layer, wherein the first inserting layer is made of AlxGa1-xN; and a second inserting layer disposed on the first inserting layer, wherein the second inserting layer is made of AlyGa1-yN, and y is greater than x. The semiconductor device further includes: a gate electrode disposed on the barrier layer; a source electrode and a drain electrode disposed on the barrier layer and respectively at opposite sides of the gate electrode; and a spike region formed below at least one of the source electrode and the drain electrode.Type: GrantFiled: May 30, 2022Date of Patent: February 25, 2025Assignee: WIN SEMICONDUCTORS CORP.Inventors: Chieh-Chih Huang, Yan-Cheng Lin, Cheng-Kuo Lin, Wei-Chou Wang, Che-Kai Lin, Jiun-De Wu
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Publication number: 20250054662Abstract: The present invention relates to a thermistor paste and a manufacturing method thereof. The thermistor paste includes specific contents of thermistor powder, a glass powder, and an organic carrier, in which the organic carrier includes an organic solvent, a binder, and an additive. A thermistor semi-finished product slurry of the present invention has been sintered. The thermistor paste of the present invention excludes a precious metal, such as ruthenium, gold, or platinum, etc., so the production cost can be reduced.Type: ApplicationFiled: November 27, 2023Publication date: February 13, 2025Inventors: Shen-Li HSIAO, Kuang-Cheng LIN, Wei-Chen HUANG, Ren-Hong WANG
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Publication number: 20250028151Abstract: An optical element driving mechanism is provided, including a fixed part, a movable part, a metallic member and a driving assembly. The fixed part includes a base. The movable part is movably connected to the fixed part, and carries an optical element, the optical element has an optical axis. The metallic member is disposed on the base, and includes an inner electrical connection part and an outer electrical connection part, the inner electrical connection part and the outer electrical connection part are connected to each other. The driving assembly includes at least one driving magnetic element and drives the movable part to move relative to the fixed part.Type: ApplicationFiled: October 9, 2024Publication date: January 23, 2025Inventors: Chien-Lun HUANG, Shao-Chung CHANG, Wei-Cheng WANG, Che-Hsiang CHIU, Fu-Yuan WU, Shou-Jen LIU
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Patent number: 12205634Abstract: The present disclosure provides an electronic circuit, a memory device, and a method for operating an electronic circuit. An electronic circuit comprises a driver circuit configured to provide a drive voltage to a word line of the electronic circuit, a suppression circuit electrically connected to the driver circuit and the word line, and a control circuit electrically connected to the suppression circuit. The suppression circuit is configured to generate a voltage drop in the drive voltage. The control circuit controls the suppression circuit.Type: GrantFiled: February 15, 2022Date of Patent: January 21, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wei-Cheng Wu, Pei-Yuan Li, Kao-Cheng Lin, Chien Hui Huang, Yung-Ning Tu
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Publication number: 20250024671Abstract: A memory device is provided which includes a first memory cell including a first transistor and a second transistor coupled to the first transistor in parallel. Gates of the first transistor and the second transistor are coupled to each other, and the gates of the first transistor and the second transistor pass different layers and overlap with each other. Types of the first transistor and the second transistor are the same.Type: ApplicationFiled: July 11, 2023Publication date: January 16, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chien Hui Huang, Kao-Cheng LIN, Wei Min CHAN, Shang Lin WU, Chia-Chi HUNG, Wei-Cheng WU, Chia-Che CHUNG, Pei-Yuan LI, Chien-Chen LIN, Yung-Ning TU, Yen Lin CHUNG
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Patent number: 12189662Abstract: A method may include: receiving an original dataset and a sensitive attribute; initializing a distilled dataset from the original dataset; initializing a classification model; sampling original dataset data and an original dataset label from the original dataset, and distilled dataset data and a distilled dataset label from the distilled dataset; providing the sampled original dataset data from the original dataset to the classification model, resulting in an original dataset prediction probability; providing the sampled distilled dataset data from the distilled dataset to the classification model, resulting in a distilled dataset prediction probability; calculating a distilled dataset cross-entropy loss for the distilled dataset prediction probability and the distilled dataset label; calculating distilled dataset gradients for the distilled dataset cross-entropy loss; calculating a distance between the gradients as a matching loss; and updating the distilled dataset with the matching loss.Type: GrantFiled: November 21, 2023Date of Patent: January 7, 2025Assignee: JPMORGAN CHASE BANK, N.A.Inventors: Zhonghao Shi, Hsiang Hsu, Richard Chen, Wei-Cheng Huang
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Patent number: 11714348Abstract: An apparatus for removing a pellicle frame from a photomask includes a heater configured to soften an adhesive between the pellicle frame and the photomask; a shower head including a plate, a central region of the plate is configured to overlap with a pattern area of the photomask, and a periphery region of the plate is configured to provide a flow from the periphery region of the plate toward the pellicle frame and the adhesive; and a gripper configured to secure the pellicle frame against the flow and remove the adhesive and the pellicle frame from the photomask. A method of removing a pellicle frame, includes providing a plate overlapped with a pattern area of the photomask; providing a flow from the plate toward the pellicle frame and an adhesive; securing the pellicle frame; soften the adhesive; and leveraging the pellicle frame to remove the adhesive and the pellicle frame.Type: GrantFiled: July 6, 2022Date of Patent: August 1, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wei Cheng Huang, Kun-Lung Hsieh
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Publication number: 20220334465Abstract: An apparatus for removing a pellicle frame from a photomask includes a heater configured to soften an adhesive between the pellicle frame and the photomask; a shower head including a plate, a central region of the plate is configured to overlap with a pattern area of the photomask, and a periphery region of the plate is configured to provide a flow from the periphery region of the plate toward the pellicle frame and the adhesive; and a gripper configured to secure the pellicle frame against the flow and remove the adhesive and the pellicle frame from the photomask. A method of removing a pellicle frame, includes providing a plate overlapped with a pattern area of the photomask; providing a flow from the plate toward the pellicle frame and an adhesive; securing the pellicle frame; soften the adhesive; and leveraging the pellicle frame to remove the adhesive and the pellicle frame.Type: ApplicationFiled: July 6, 2022Publication date: October 20, 2022Inventors: WEI CHENG HUANG, KUN-LUNG HSIEH
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Patent number: 11392025Abstract: An apparatus for removing a pellicle frame from a photomask includes a heater, a shower head, and a gripper. The heater is configured to soften a portion of an adhesive between the pellicle frame and the photomask. The shower head facing to the heater and configured to provide a flow from a patterned area of the photomask toward the pellicle frame and the adhesive. The gripper is configured to secure the pellicle frame against the flow and to remove the adhesive and the pellicle frame from the photomask. A method of removing a pellicle frame from a photomask includes providing a flow from a pattern area of the photomask toward the pellicle frame and an adhesive; securing the pellicle frame in a force-transmitting manner against the flow; soften at least a portion of the adhesive; and leveraging the pellicle frame to remove the adhesive and the pellicle frame.Type: GrantFiled: December 15, 2020Date of Patent: July 19, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wei Cheng Huang, Kun-Lung Hsieh
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Publication number: 20210103212Abstract: An apparatus for removing a pellicle frame from a photomask includes a heater, a shower head, and a gripper. The heater is configured to soften a portion of an adhesive between the pellicle frame and the photomask. The shower head facing to the heater and configured to provide a flow from a patterned area of the photomask toward the pellicle frame and the adhesive. The gripper is configured to secure the pellicle frame against the flow and to remove the adhesive and the pellicle frame from the photomask. A method of removing a pellicle frame from a photomask includes providing a flow from a pattern area of the photomask toward the pellicle frame and an adhesive; securing the pellicle frame in a force-transmitting manner against the flow; soften at least a portion of the adhesive; and leveraging the pellicle frame to remove the adhesive and the pellicle frame.Type: ApplicationFiled: December 15, 2020Publication date: April 8, 2021Inventors: WEI CHENG HUANG, KUN-LUNG HSIEH
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Patent number: 10877369Abstract: An apparatus for removing a pellicle frame from a photomask includes a shower head and a gripper. The shower head is configured to provide an air curtain between the pellicle frame and a patterned area of the photomask. The gripper is configured to secure the pellicle frame from a direction against the flow blown from the air curtain. The flow is substantially directed toward a periphery of the photomask. A method of removing a pellicle frame from a photomask includes providing an air curtain between the pellicle frame and a patterned area of the photomask, and generating a temperature difference between the photomask and the pellicle frame. The flow of the air curtain is substantially directed toward a periphery of the photomask. The temperature of the photomask is higher than the temperature of the pellicle frame.Type: GrantFiled: August 28, 2018Date of Patent: December 29, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wei Cheng Huang, Kun-Lung Hsieh
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Patent number: 10796872Abstract: A vehicle circuit breaker includes a housing configured with a electrode assembly including a first electrode and second electrode; the first electrode is configured with a first conducting element and first insertion portion, and the second electrode is configured with an electrode connection portion and second insertion portion; a bimetal conducting sheet and blocking element are configured inside the housing, where the bimetal conducting sheet has a plurality of conducting concave portions for the installment of a second conducting element and the connection with the electrode connection portion, thereby carrying out a blocking action when current is abnormal and therefore making it easier for assembly.Type: GrantFiled: September 1, 2019Date of Patent: October 6, 2020Assignee: KUOYUH W.L. ENTERPRISE CO., LTD.Inventor: Wei-Cheng Huang
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Publication number: 20200073231Abstract: An apparatus for removing a pellicle frame from a photomask includes a shower head and a gripper. The shower head is configured to provide an air curtain between the pellicle frame and a patterned area of the photomask. The gripper is configured to secure the pellicle frame from a direction against the flow blown from the air curtain. The flow is substantially directed toward a periphery of the photomask. A method of removing a pellicle frame from a photomask includes providing an air curtain between the pellicle frame and a patterned area of the photomask, and generating a temperature difference between the photomask and the pellicle frame. The flow of the air curtain is substantially directed toward a periphery of the photomask. The temperature of the photomask is higher than the temperature of the pellicle frame.Type: ApplicationFiled: August 28, 2018Publication date: March 5, 2020Inventors: Wei Cheng HUANG, Kun-Lung HSIEH