Abstract: A semiconductor device includes a substrate. The semiconductor device includes a fin that is formed over the substrate and extends along a first direction. The semiconductor device includes a gate structure that straddles the fin and extends along a second direction perpendicular to the first direction. The semiconductor device includes a first source/drain structure coupled to a first end of the fin along the first direction. The gate structure includes a first portion protruding toward the first source/drain structure along the first direction. A tip edge of the first protruded portion is vertically above a bottom surface of the gate structure.

Abstract: A thin film transistor, a manufacturing method for the thin film transistor, and a display device are provided. The thin film transistor includes a substrate, and further includes an oxide semiconductor layer, a gate electrode, a gate insulation layer, a source electrode, and a drain electrode that are disposed on the substrate. The oxide semiconductor layer includes a channel portion, a first contact portion, and a second contact portion, where the source electrode is in contact with the first contact portion, and the drain electrode is in contact with the second contact portion. The channel portion at least partially protrudes in a direction away from the substrate, and the gate insulation layer and the gate electrode are successively stacked on the channel portion.

Abstract: An electronic system with an electronically controlled electronic locking mechanism is provided. The system includes a first electronic device having a first part, a first fastening element, a second part, and an electronic locking element. The first fastening element is pivotally connected to the first part and rotates relatively to the first part. The second part includes a fastening portion. The electronic locking element is disposed at the first part, electronically connected to the first electronic device, and connected to the first fastening element. When the fastening portion of the second part contacts and fastens to the first fastening element of the first part, the first electronic device supplies power to the electronic locking element, and thus the electronic locking element fixes the first fastening element to lock the first part and the second part together.

Abstract: An electronic device including at least one electronic component and a method of manufacturing the same are provided. The electronic device may include a substrate, a semiconductor layer disposed on the substrate, an insulating layer disposed on the semiconductor layer, and a first metal layer disposed on the insulating layer. The insulating layer may have a pattern corresponding to a pattern of the semiconductor layer or the first metal layer. The flexible layer has a Young's modulus less than 40 GPa and is disposed on the substrate to encapsulate the semiconductor layer. At least one first opening penetrates the flexible layer. At least one second metal layer is disposed on the flexible layer and in the first opening and electrically connected to the semiconductor layer.

Abstract: An electronic component and a method for fabricating the electronic component are provided. The electronic component includes a carrier, a first metal layer, a dielectric layer, a semiconductor layer, a flexible layer, at least one first opening, and at least one second metal layer. The first metal layer is disposed on the carrier. The dielectric layer is disposed on the first metal layer, and has a pattern consistent with a pattern of the dielectric layer. The semiconductor layer is disposed on the dielectric layer. The flexible layer is disposed on the carrier and encapsulates the first metal layer, the dielectric layer and the semiconductor layer. The flexible layer has a Young's modulus less than 40 GPa. The first opening penetrates the flexible layer. The second metal layer is disposed on the flexible layer and in the first opening and is electrically connected with the semiconductor layer.

Abstract: An electronic device including at least one electronic component and a method of manufacturing the same are provided. The electronic device may include a substrate, a semiconductor layer disposed on the substrate, an insulating layer disposed on the semiconductor layer, and a first metal layer disposed on the insulating layer. The insulating layer may have a pattern corresponding to a pattern of the semiconductor layer or the first metal layer. The flexible layer has a Young's modulus less than 40 GPa and is disposed on the substrate to encapsulate the semiconductor layer. At least one first opening penetrates the flexible layer. At least one second metal layer is disposed on the flexible layer and in the first opening and electrically connected to the semiconductor layer.

Abstract: An electronic component and a method for fabricating the electronic component are provided. The electronic component includes a carrier, a first metal layer, a dielectric layer, a semiconductor layer, a flexible layer, at least one first opening, and at least one second metal layer. The first metal layer is disposed on the carrier. The dielectric layer is disposed on the first metal layer, and has a pattern consistent with a pattern of the dielectric layer. The semiconductor layer is disposed on the dielectric layer. The flexible layer is disposed on the carrier and encapsulates the first metal layer, the dielectric layer and the semiconductor layer. The flexible layer has a Young's modulus less than 40 GPa. The first opening penetrates the flexible layer. The second metal layer is disposed on the flexible layer and in the first opening and is electrically connected with the semiconductor layer.

Abstract: An electronic system with an electronically electronic locking element is provided. The system includes a first electronic device having a first part, a first fastening element, a second part, and an electronic locking element. The first fastening element is pivotally connected to the first part and rotates relatively to the first part. The second part includes a fastening portion. The electronic locking element is disposed at the first part, electronically connected to the first electronic device, and connected to the first fastening element. When the fastening portion of the second part contacts and fastens to the first fastening element of the first part, the first electronic device supplies power to the electronic locking element, and thus the electronic locking element fixes the first fastening element to lock the first part and the second part together.

Abstract: A pico projector device used with a mobile phone is disclosed. The pico projector device used with a mobile phone includes: a housing; a connector, partially exposed from the housing, for connecting with the mobile phone; and a pico projector module, provided in the housing, for projecting an image under control of the mobile phone based on an image signal from the mobile phone through the first connector.