Patents by Inventor Wei-Cheng SHIH

Wei-Cheng SHIH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240363421
    Abstract: The present disclosure describes a semiconductor device with a rare earth metal oxide layer and a method for forming the same. The method includes forming fin structures on a substrate and forming superlattice structures on the fin structures, where each of the superlattice structures includes a first-type nanostructured layer and a second-type nanostructured layer. The method further includes forming an isolation layer between the superlattice structures, implanting a rare earth metal into a top portion of the isolation layer to form a rare earth metal oxide layer, and forming a polysilicon structure over the superlattice structures. The method further includes etching portions of the superlattice structures adjacent to the polysilicon structure to form a source/drain (S/D) opening and forming an S/D region in the S/D opening.
    Type: Application
    Filed: July 8, 2024
    Publication date: October 31, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Han-Yu LIN, Szu-Hua Chen, Kuan-Kan Hu, Kenichi Sano, Po-Cheng Wang, Wei-Yen Woon, Pinyen Lin, Che Chi Shih
  • Publication number: 20240332068
    Abstract: A representative method includes forming a photo-sensitive material over a substrate, and forming a cap layer over the photo-sensitive material, and patterning the cap layer. Using the patterned cap layer, a first portion of the photo-sensitive material is selectively exposed to a pre-selected light wavelength to change at least one material property of the first portion of the photo-sensitive material, while preventing a second portion of the photo-sensitive material from being exposed to the pre-selected light wavelength. One, but not both of the following steps is then conducted: removing the first portion of the photo-sensitive material and forming in its place a conductive element at least partially surrounded by the second portion of the photo-sensitive material, or removing the second portion of the photo-sensitive material and forming from the first portion of the photo-sensitive material a conductive element electrically connecting two or more portions of a circuit.
    Type: Application
    Filed: June 10, 2024
    Publication date: October 3, 2024
    Inventors: Wei-Jen Lo, Po-Cheng Shih, Syun-Ming Jang, Tze-Liang Lee
  • Patent number: 12095472
    Abstract: The present invention provides a transceiver circuit including a transmitter circuit, a frequency synthesizer and control circuit. The transmitter circuit is configured to generate a transmission signal, wherein the transmission signal is transmitted through an antenna. The frequency synthesizer is configured to generate a clock signal for the transmitter circuit to generate the transmission signal. The control circuit is configured to generate a first control signal to control the frequency synthesizer to determine a loop bandwidth of the frequency synthesizer; wherein when the transceiver circuit operates in a standby mode, the control circuit generates the first control signal to make the frequency synthesizer have a first loop bandwidth; and after a period of time after the transceiver circuit is switched from the standby mode to a transmission mode, the control circuit generates the first control signal to make the frequency synthesizer have a second loop bandwidth.
    Type: Grant
    Filed: January 4, 2023
    Date of Patent: September 17, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Wei-Cheng Lin, Ching-Her Huang, Yi-Chang Shih, Yu-Jung Li
  • Patent number: 12087579
    Abstract: A method for forming a semiconductor device includes receiving a substrate having a first opening and a second opening formed thereon, wherein the first opening has a first width, and the second opening has a second width less than the first width; forming a protecting layer to cover the first opening and expose the second opening; performing a wet etching to widen the second opening with an etchant, wherein the second opening has a third width after the performing of the wet etching, and the third width of the second opening is substantially equal to the first width of the first opening; and performing a photolithography to transfer the first opening and the second opening to a target layer.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: September 10, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chung-Yang Huang, Hao-Ming Chang, Ming Che Li, Yu-Hsin Hsu, Po-Cheng Lai, Kuan-Shien Lee, Wei-Hsin Lin, Yi-Hsuan Lin, Wang Cheng Shih, Cheng-Ming Lin
  • Patent number: 12062576
    Abstract: The present disclosure describes a semiconductor device with a rare earth metal oxide layer and a method for forming the same. The method includes forming fin structures on a substrate and forming superlattice structures on the fin structures, where each of the superlattice structures includes a first-type nanostructured layer and a second-type nanostructured layer. The method further includes forming an isolation layer between the superlattice structures, implanting a rare earth metal into a top portion of the isolation layer to form a rare earth metal oxide layer, and forming a polysilicon structure over the superlattice structures. The method further includes etching portions of the superlattice structures adjacent to the polysilicon structure to form a source/drain (S/D) opening and forming an S/D region in the S/D opening.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: August 13, 2024
    Inventors: Han-Yu Lin, Szu-Hua Chen, Kuan-Kan Hu, Kenichi Sano, Po-Cheng Wang, Wei-Yen Woon, Pinyen Lin, Che Chi Shih
  • Publication number: 20140194158
    Abstract: A method for intelligent antenna configuration selection of a communication apparatus including an antenna module including a plurality of antennas and a plurality of radio modules sharing the antenna module includes individually determining a preferred antenna configuration of the antenna module by each radio module; determining an optimum antenna configuration according to the preferred antenna configurations; and controlling a configuration of the antennas based on the optimum antenna configuration. The optimum antenna configuration is determined for a radio module having a highest priority among the radio modules to have an optimum radio communication performance.
    Type: Application
    Filed: January 6, 2014
    Publication date: July 10, 2014
    Applicant: HTC Corporation
    Inventors: Win-Chyi GONG, Haw-Wei SHU, Hsing-Yu LUNG, Yuan-Hao LAN, Kuo-Hsing HUNG, Chien-Jen HUANG, Wei-Cheng SHIH