Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: The present disclosure, in some embodiments, relates an integrated chip. The integrated chip includes a substrate. A through-substrate-via (TSV) extends through the substrate. A dielectric liner separates the TSV from the substrate. The dielectric liner is along one or more sidewalls of the substrate. The TSV includes a horizontally extending surface and a protrusion extending outward from the horizontally extending surface. The TSV has a maximum width along the horizontally extending surface.

Abstract: A method for intelligent antenna configuration selection of a communication apparatus including an antenna module including a plurality of antennas and a plurality of radio modules sharing the antenna module includes individually determining a preferred antenna configuration of the antenna module by each radio module; determining an optimum antenna configuration according to the preferred antenna configurations; and controlling a configuration of the antennas based on the optimum antenna configuration. The optimum antenna configuration is determined for a radio module having a highest priority among the radio modules to have an optimum radio communication performance.