Patents by Inventor Wei-Chi Liu
Wei-Chi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240072633Abstract: The present invention provides a resonant switched capacitor voltage converter (RSCC), which is coupled to and operates synchronously with another RSCC. The RSCC includes: plural switches, a resonant inductor, a resonant capacitor, and a control circuit. The control circuit controls the switches, so that the resonant capacitor and the resonant inductor are connected in series to each other, to perform resonant operation in a switching period, thus converting an input voltage to an output voltage. The control circuit generates a zero current signal and a first synchronization signal when a resonant inductor current flowing through the resonant inductor is zero. The control circuit turns off at least one corresponding switch according to the zero current signal. The control circuit turns on at least one corresponding switch according to the zero-current signal and a second synchronization signal, so that the RSCC operates in synchronization with at least another RSCC.Type: ApplicationFiled: August 14, 2023Publication date: February 29, 2024Inventors: Kuo-Chi Liu, Ta-Yung Yang, Wei-Hsu Chang, Chao-Chi Chen
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Patent number: 11916077Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.Type: GrantFiled: May 24, 2021Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Ru-Gun Liu, Wei-Cheng Lin, Lei-Chun Chou, Wei-An Lai
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Publication number: 20240055825Abstract: A control system for a laser source includes a light extraction unit connected to a signal transmission port of a pump combiner of the laser source, and a microprocessor. The signal transmission port detects a leakage light signal from an optical resonator via the pump combiner to obtain a light parameter. The microprocessor unit is configured to determine an output power of the output laser signal based on the light parameter, and when it is determined that the output power differs from a preset power value, transmit an adjustment signal for adjusting an input power supplied to a plurality of pump sources.Type: ApplicationFiled: August 10, 2022Publication date: February 15, 2024Inventors: Hou-Jen Chen, Wei-Chi Liu, Feng-Ming Kuo, Min-Ju Lee, Po-Hsiu Yen, Sung-Yuen Wang
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Patent number: 11714341Abstract: A projection device includes at least one heat source and a heat dissipation module. The heat dissipation module is connected to the heat source and is configured to dissipate heat energy generated by the heat source. The heat dissipation module includes a tank, at least one radiator, at least one cold plate, a cooling fluid, and a connection pipe. The connection pipe connects the tank, the radiator, and the cold plate, so that the cooling fluid flows in the heat dissipation module. The tank includes a pressure sensing device configured to measure a liquid level of the cooling fluid in the tank. Also, a tank is provided. The projection device provided in the disclosure can learn the liquid level of the tank in real-time, and the design cost is low.Type: GrantFiled: March 9, 2021Date of Patent: August 1, 2023Assignee: Coretronic CorporationInventors: Wei-Chi Liu, Kai-Lun Hou
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Publication number: 20230101677Abstract: Provided is a projection device including an illumination system, an optical engine module, a projection lens, at least one first case, at least one second case, and at least one optical element. The at least one first case includes a first flow channel to transmit a first fluid therein. The at least one second case is connected to the at least one first case to form an accommodating space. The at least one optical element is disposed in the accommodating space. Heat generated by the at least one optical element is transferred, by the first fluid, to an outside of the at least one first case.Type: ApplicationFiled: September 14, 2022Publication date: March 30, 2023Applicant: Coretronic CorporationInventors: Wei-Chi Liu, Meng-Syuan Dai
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Publication number: 20230057909Abstract: A projection device includes a heat source and a heat dissipation module, including a heat dissipation base, a heat dissipation fin set, at least one heat conductor, a first fan and a second fan. The heat dissipation fin set has first and second regions adjacent to each other. The first region is located between the heat dissipation base and the second region. The first region has two opposite first ventilation surfaces. The second region has two opposite second ventilation surfaces. There is an angle between a normal direction of the first ventilation surface and a normal direction of the second ventilation surface. The heat conductor is connected between the heat dissipation base and the heat dissipation fin set. The first fan generates a first airflow flowing through the first ventilation surfaces. The second fan generates a second airflow flowing through the second ventilation surfaces.Type: ApplicationFiled: August 18, 2022Publication date: February 23, 2023Inventors: JIA-HONG DAI, WEI-CHI LIU
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Publication number: 20230033834Abstract: A heat dissipating module includes a casing including a bottom plate and a water inlet; a cover plate disposed on one side of the casing opposite to the bottom plate; a pressurizing device moving back and forth in the casing and having a maximum stroke; a water pump disposed between the bottom plate and the pressurizing device, where liquid fills a space between the water pump and the pressurizing device to define a water tank; and a stop valve disposed in the water tank and located between the pressurizing device and the water pump. According to a direction from the bottom plate to the cover plate, the height of the water inlet is lower than the stop valve. The heat dissipating module has a small volume and is configured to flip at multiple angles. A projection device including the heat dissipating module and having structural reliability is also provided.Type: ApplicationFiled: August 2, 2022Publication date: February 2, 2023Applicant: Coretronic CorporationInventors: Shi-Wen Lin, Wei-Chi Liu, Tsung-Ching Lin
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Patent number: 11506961Abstract: A heat dissipation module includes a base, a cover and a plurality of heat dissipation fins. The cover is disposed on the base and forms an accommodation space with the base. The plurality of heat dissipation fins is disposed in the accommodation space. The cover includes a top, at least one side wall, a first opening and a second opening. The first opening and the second opening are disposed on the top or the at least one side wall. The at least one side wall surrounds the top and is connected to the base. The distances between the plurality of heat dissipation fins and one of the at least one side wall in a first direction are different. A projection apparatus is also provided, which includes a light source module, a light valve, the aforementioned heat dissipation module and a projection lens.Type: GrantFiled: October 14, 2020Date of Patent: November 22, 2022Assignee: Coretronic CorporationInventors: Shi-Wen Lin, Wei-Chi Liu, Tsung-Ching Lin
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Patent number: 11500274Abstract: A projector includes a housing, a fan, a first heat dissipation fin group, a second heat dissipation fin group, and at least one heat generation assembly. The housing includes a first air entry, a second air entry, and a first air exit. The fan, the first and second heat dissipation fin groups, and the heat generation assembly are disposed in the housing. The fan is located between the first and second heat dissipation fin groups. The fan includes a first air inlet, a second air inlet, and an air outlet disposed corresponding to the first air exit. The first heat dissipation fin group is located between the first air entry and the first air inlet. The second heat dissipation fin group is located between the second air entry and the second air inlet. The heat generation assembly is connected to the first and second heat dissipation fin groups.Type: GrantFiled: September 23, 2021Date of Patent: November 15, 2022Assignee: Coretronic CorporationInventors: Tsung-Ching Lin, Wei-Chi Liu, Jhih-Hao Chen
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Publication number: 20220100066Abstract: A projector includes a housing, a fan, a first heat dissipation fin group, a second heat dissipation fin group, and at least one heat generation assembly. The housing includes a first air entry, a second air entry, and a first air exit. The fan, the first and second heat dissipation fin groups, and the heat generation assembly are disposed in the housing. The fan is located between the first and second heat dissipation fin groups. The fan includes a first air inlet, a second air inlet, and an air outlet disposed corresponding to the first air exit. The first heat dissipation fin group is located between the first air entry and the first air inlet. The second heat dissipation fin group is located between the second air entry and the second air inlet. The heat generation assembly is connected to the first and second heat dissipation fin groups.Type: ApplicationFiled: September 23, 2021Publication date: March 31, 2022Applicant: Coretronic CorporationInventors: Tsung-Ching Lin, Wei-Chi Liu, Jhih-Hao Chen
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Patent number: 11255534Abstract: A thermal module and a projector using the same are provided. The thermal module comprises a heat sink and a base. The heat sink comprises a bottom, a plurality of fins, a cover, and a plurality of side walls. The fins are disposed on the bottom, and each of the fins comprises a reference plane and a plurality of protrusions, wherein adjacent two of the protrusions are convex toward opposite directions with respect to the reference plane, and rows of through holes are formed by adjacent two protrusions along a flowing direction. The cover is disposed on the fins. The side walls are disposed between the bottom and the cover and surrounding the fins, wherein a liquid is capable of flowing through the heat sink by entering the inlet and exiting by the outlet of the side walls or the cover. The bottom of the heat sink is disposed on the base.Type: GrantFiled: October 3, 2018Date of Patent: February 22, 2022Assignee: Coretronic CorporationInventors: Shi-Wen Lin, Tsung-Ching Lin, Wei-Chi Liu
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Patent number: 11194238Abstract: A heat dissipation module includes a housing, at least one inlet, at least one outlet and at least one heat dissipation set. The housing includes a partition dividing the housing, such that a first accommodation space and a second accommodation space are formed inside the housing. At least one opening is disposed in the partition, penetrates through the partition and communicates the first accommodation space with the second accommodation space. The inlet is connected to the housing and communicates with the first accommodation space. The outlet is connected to the housing and communicates with the second accommodation space. The heat dissipation set is located in the second accommodation space. A projection apparatus is also provided. The heat dissipation module and the projection apparatus may effectively exhaust the heat accumulated on the at least one heat dissipation set, which facilitates reducing a temperature of a heat source with high heat-density.Type: GrantFiled: March 27, 2020Date of Patent: December 7, 2021Assignee: Coretronic CorporationInventors: Wei-Chi Liu, Tsung-Ching Lin, Shi-Wen Lin
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Publication number: 20210286242Abstract: A projection device includes at least one heat source and a heat dissipation module. The heat dissipation module is connected to the heat source and is configured to dissipate heat energy generated by the heat source. The heat dissipation module includes a tank, at least one radiator, at least one cold plate, a cooling fluid, and a connection pipe. The connection pipe connects the tank, the radiator, and the cold plate, so that the cooling fluid flows in the heat dissipation module. The tank includes a pressure sensing device configured to measure a liquid level of the cooling fluid in the tank. Also, a tank is provided. The projection device provided in the disclosure can learn the liquid level of the tank in real-time, and the design cost is low.Type: ApplicationFiled: March 9, 2021Publication date: September 16, 2021Applicant: Coretronic CorporationInventors: Wei-Chi Liu, Kai-Lun Hou
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Patent number: 11009783Abstract: A liquid cooled heat dissipation module includes a housing and at least one flow channel. The housing includes a chamber, and the at least one flow channel is located in the chamber. The housing includes an upper plate, a lower plate, and a plurality of annular wall portions. Two ends of each of the annular wall portions are respectively connected to the upper plate and the lower plate. The annular wall portions respectively form a plurality of through-holes between the upper plate and the lower plate, and the through-holes penetrate through the upper plate and the lower plate. The at least one flow channel is located between two adjacent annular wall portions. In addition, a projection device is also provided.Type: GrantFiled: July 18, 2019Date of Patent: May 18, 2021Assignee: Coretronic CorporationInventors: Tsung-Ching Lin, Wei-Chi Liu
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Publication number: 20210116794Abstract: A heat dissipation module includes a base, a cover and a plurality of heat dissipation fins. The cover is disposed on the base and forms an accommodation space with the base. The plurality of heat dissipation fins is disposed in the accommodation space. The cover includes a top, at least one side wall, a first opening and a second opening. The first opening and the second opening are disposed on the top or the at least one side wall. The at least one side wall surrounds the top and is connected to the base. The distances between the plurality of heat dissipation fins and one of the at least one side wall in a first direction are different. A projection apparatus is also provided, which includes a light source module, a light valve, the aforementioned heat dissipation module and a projection lens.Type: ApplicationFiled: October 14, 2020Publication date: April 22, 2021Inventors: SHI-WEN LIN, WEI-CHI LIU, TSUNG-CHING LIN
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Patent number: 10976116Abstract: A liquid cooled heat dissipation device including a housing, at least two cooling fin modules, an input pipe, and an output pipe is provided. The housing has an accommodation space. The at least two cooling fin modules are disposed in the accommodation space. The input pipe is disposed on the top plate, the front plate, the rear plate, or one of the side plates of the housing and communicates with the accommodation space. The output pipe is disposed on the top plate, the front plate, the rear plate, or the other one of the side plates of the housing and communicates with the accommodation space. The at least two cooling fin modules have different arrangement densities and different fin thicknesses.Type: GrantFiled: March 27, 2019Date of Patent: April 13, 2021Assignee: Coretronic CorporationInventors: Wei-Chi Liu, Tsung-Ching Lin, Shi-Wen Lin, Chi-Chuan Wang, Yong-Dong Zhang
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Patent number: 10969667Abstract: A wavelength conversion module and a projection device are provided. The projection device includes an illumination system providing an illumination light, a light valve forming the illumination light into an image light, and a projection lens forming the image light into a projection light. The illumination system includes an excitation light source providing an excitation light, and a wavelength conversion module receiving the excitation light. The wavelength conversion module includes a case and a wavelength conversion layer. The case has a liquid inlet, a liquid outlet, and a cavity connecting the liquid inlet and the liquid outlet for circulation of a cooling liquid. The wavelength conversion layer is located on the case, wherein the relative positions of the wavelength conversion layer and the excitation light remain unchanged. The projection device and the wavelength conversion module have good reliability.Type: GrantFiled: May 18, 2020Date of Patent: April 6, 2021Assignee: Coretronic CorporationInventor: Wei-Chi Liu
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Publication number: 20200371412Abstract: A wavelength conversion module and a projection device are provided. The projection device includes an illumination system providing an illumination light, a light valve forming the illumination light into an image light, and a projection lens forming the image light into a projection light. The illumination system includes an excitation light source providing an excitation light, and a wavelength conversion module receiving the excitation light. The wavelength conversion module includes a case and a wavelength conversion layer. The case has a liquid inlet, a liquid outlet, and a cavity connecting the liquid inlet and the liquid outlet for circulation of a cooling liquid. The wavelength conversion layer is located on the case, wherein the relative positions of the wavelength conversion layer and the excitation light remain unchanged. The projection device and the wavelength conversion module have good reliability.Type: ApplicationFiled: May 18, 2020Publication date: November 26, 2020Applicant: Coretronic CorporationInventor: Wei-Chi Liu
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Patent number: 10827647Abstract: The invention provides a liquid-cooling device, including a shell, wherein the shell includes a top plate, a bottom plate, a front plate, a rear plate and two opposite side plates, and form an accommodating space. At least one water inlet pipe is disposed on the top plate of the shell and communicates with the accommodating space. At least one water outlet pipe is disposed on the front plate of the shell and communicates with the accommodating space. A plurality of heat-dissipating fins is disposed in the accommodating space. A partition plate is disposed in the accommodating space. The partition plate forms at least two flow passages in the accommodating space.Type: GrantFiled: March 22, 2019Date of Patent: November 3, 2020Assignee: Coretronic CorporationInventors: Shi-Wen Lin, Tsung-Ching Lin, Wei-Chi Liu
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Publication number: 20200310234Abstract: A heat dissipation module includes a housing, at least one inlet, at least one outlet and at least one heat dissipation set. The housing includes a partition dividing the housing, such that a first accommodation space and a second accommodation space are formed inside the housing. At least one opening is disposed in the partition, penetrates through the partition and communicates the first accommodation space with the second accommodation space. The inlet is connected to the housing and communicates with the first accommodation space. The outlet is connected to the housing and communicates with the second accommodation space. The heat dissipation set is located in the second accommodation space. A projection apparatus is also provided. The heat dissipation module and the projection apparatus may effectively exhaust the heat accumulated on the at least one heat dissipation set, which facilitates reducing a temperature of a heat source with high heat-density.Type: ApplicationFiled: March 27, 2020Publication date: October 1, 2020Applicant: Coretronic CorporationInventors: Wei-Chi Liu, Tsung-Ching Lin, Shi-Wen Lin