Patents by Inventor Wei-Chia Hsu

Wei-Chia Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical element driving mechanism having movable portion for holding lens
    Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Semiconductor package with redistribution structure and manufacturing method thereof
    Patent number: 11955439
    Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin
  • OVERLOAD PROTECTION DEVICE FOR LED LUMINARY
    Publication number: 20110175540
    Abstract: An overload protection device for LED luminary includes a light bulb connected in front of a circuit that has a single or a group of LED luminaries thereon. The light bulb forms an energy consumption device. The energy consumption device can change the consumption value automatically to protect the LED luminary.
    Type: Application
    Filed: January 19, 2010
    Publication date: July 21, 2011
    Inventors: Han-Peng Hsu, Pei-Yeh Hsieh, Wei-Chia Hsu, Wei-Shin Hsu
  • Cable tie
    Publication number: 20080083094
    Abstract: A cable tie includes: a belt body with a gear portion and a through portion. The through portion with a cross-hole forms on one end of the belt body and there is a first against-block and a second against-block forms inside the cross-hole and protrudes in different direction. Those against-blocks can against with the gear on the belt body.
    Type: Application
    Filed: October 6, 2006
    Publication date: April 10, 2008
    Inventors: Han-Peng Hsu, Pei-Yeh Hsieh, Wei-Chia Hsu, Wei-Shin Hsu