Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

Abstract: A package comprises a substrate including a first surface, and an upper conductive layer arranged on the first surface, a first light-emitting unit arranged on the upper conductive layer, and comprises a first semiconductor layer, a first substrate, a first light-emitting surface and a first side wall, a second light-emitting unit, which is arranged on the upper conductive layer, and comprises a second light-emitting surface and a second side wall, a light-transmitting layer arranged on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit, a light-absorbing layer, which is arranged between the substrate and the light-transmitting layer in a continuous configuration of separating the first light-emitting unit and the second light-emitting unit from each other, and a reflective wall arranged on the first side wall, wherein a height of the reflective wall is lower than that of the light-absorbing layer.

Abstract: A slide rail assembly includes a first rail, a second rail, and an auxiliary member. The first rail includes a passage, and the passage includes a passage opening. The second rail is inserts in the passage from the passage opening through being guided by the auxiliary member.

Abstract: A semiconductor device includes a first semiconductor die and a second semiconductor die connected to the first semiconductor die. Each of the first semiconductor die and the second semiconductor die includes a substrate, a conductive bump formed on the substrate and a conductive contact formed on the conductive bump. The conductive contact has an outer lateral sidewall, there is an inner acute angle included between the outer lateral sidewall and the substrate is smaller than 85°, and the conductive contact of the first semiconductor die is connected opposite to the conductive contact of the second semiconductor die.

Abstract: A slide rail assembly includes a first rail, a second rail, a slide-facilitating device, and a working member. The second rail is movably mounted in a channel of, and is displaceable with respect to, the first rail. The slide-facilitating device is movably mounted between the rails and includes an engaging feature. The working member is provided on the first rail and includes a main body portion, an elastic portion for supporting the main body portion, and a predetermined portion connected to the main body portion. The first rail includes a supporting portion for supporting the elastic portion of the working member. The engaging feature is engaged with the predetermined portion of the working member when the slide-facilitating device is at a predetermined position.

Abstract: A device a includes a substrate, two source/drain (S/D) features over the substrate, and semiconductor layers suspended over the substrate and connecting the two S/D features. The device further includes a dielectric layer disposed between two adjacent layers of the semiconductor layers and an air gap between the dielectric layer and one of the S/D features, where a ratio between a length of the air gap to a thickness of the first dielectric layer is in a range of 0.1 to 1.0.

Abstract: A slide rail assembly includes a first rail, a second rail, a slide-facilitating device, and a retaining member. The second rail is movably mounted in a channel of, and is longitudinally displaceable with respect to, the first rail. The slide-facilitating device is movably mounted between the rails and includes an engaging feature. The retaining member is provided on the first rail and includes an elastic portion with a predetermined feature. The first rail includes a limiting feature for preventing deformation of the elastic portion. When the second rail is moved out of the channel after displacement in an opening direction with respect to the first rail, the slide-facilitating device is at a predetermined position, with the engaging feature engaged with the predetermined feature.

Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: A portable electronic device is provided. The portable electronic device includes a main body and an accessory. The main body includes a display region, a non-display region, and a plurality of magnetic sensors. The magnetic sensors are disposed on the non-display region along a path. The accessory is movably disposed on the non-display region and includes a magnetic element. When the accessory moves on the non-display region, the accessory drives the magnetic element moving along the path.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A diagnostic device includes a microscope configured to obtain image data on a plurality of cells and a computing device. The computing device is configured to receive the image data, identify at least a portion of each of the plurality of cells based on the received image data, determine at least one of a value of a morphological parameter for each identified at least a portion of the plurality of cells or a relative organization among the identified at least a portion of the plurality of cells, and calculate statistics for the plurality of cells based on the at least one of the determined values of the morphological parameter or the determined relative organization, the statistics including information suitable for distinguishing metastatic cells from non-metastatic cells. The diagnostic device further includes an output device configured to output the statistics for diagnosis.

Abstract: A diagnostic device includes a microscope configured to obtain image data on a plurality of cells and a computing device. The computing device is configured to receive the image data, identify at least a portion of each of the plurality of cells based on the received image data, determine at least one of a value of a morphological parameter for each identified at least a portion of the plurality of cells or a relative organization among the identified at least a portion of the plurality of cells, and calculate statistics for the plurality of cells based on the at least one of the determined values of the morphological parameter or the determined relative organization, the statistics including information suitable for distinguishing metastatic cells from non-metastatic cells. The diagnostic device further includes an output device configured to output the statistics for diagnosis.

Abstract: Polymer coated carbon nanotube (NT) particles having NT particles with a solid polymer layer around the surface of each NT particle are presented. The NT particles can be isolated NTs or can include bundles of NTs. A method for preparation of the polymer coated carbon NT particles involves an aqueous dispersion that has a water insoluble first monomer contained in an emulsion-like nano-environment about the NT particles that undergoes an interfacial polymerization with a water soluble second monomer added to the dispersion.

Abstract: A method for permanently sealing an ultra-high vacuum within a glass enclosure. This is accomplished by first forming a hole, either in one of the flat plates that form the enclosure or in one of the standoffs that separate the plates, and then sealing a metal tube to the glass. In one embodiment, the metal tube is positioned so as to be partly inside the hole while in another a flange at the end of the tube is positioned to cover the hole. In both cases, a glass frit paste is then applied all around the glass metal interface. This is followed by heating so that the frit softens and becomes a glass-to-metal seal. Once the structure has cooled down the attached metal tube is used as a pumping port to evacuate it and, while still under vacuum, the metal tube is pinched off to form a permanent seal.