Patents by Inventor Wei-Chiang Huang

Wei-Chiang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250013304
    Abstract: A touch module includes a base plate, a first magnet, a second magnet, a touch pad, a first magnetic board and a second magnetic board. The first magnet and the second magnet are installed on the base plate and separated from each other. The touch pad is located over the base plate to cover the first magnet and the second magnet. The first magnetic board and the second magnetic board are separated from each other, located under the touch pad and coupled with the touch pad. The first magnetic board is aligned with the first magnet. The second magnetic board is aligned with the second magnet. The driving circuit is electrically coupled with the first magnetic board and the second magnetic board. The first magnetic board induces a magnetic field of the first magnet. The second magnetic board induces a magnetic field of the second magnet.
    Type: Application
    Filed: September 25, 2023
    Publication date: January 9, 2025
    Inventors: Tse-Ping Kuan, Wei-Chiang Huang, Hung-Wei Kuo, Ying-Yen Huang, Sian-Yi Chiu
  • Patent number: 12153760
    Abstract: A force touch judgement method is applied to a force touch pad with two force sensors. Firstly, a force touch operation corresponding to a real force value is performed on a force touch position. Then, a first sensing signal value and a second sensing signal value corresponding to the force touch operation are respectively generated by the two force sensors. Then, the first sensing signal value and the second sensing signal value are added as a total sensing signal value. A calibration force value corresponding to the force touch position is obtained. A first calibration signal value and a second calibration signal value corresponding to the force touch position are added as a total calibration signal value. A ratio of the total sensing signal value to the total calibration signal value is equal to a ratio of the real force value to the calibration force value.
    Type: Grant
    Filed: October 18, 2023
    Date of Patent: November 26, 2024
    Assignee: Primax Electronics Ltd.
    Inventors: Chieh-Hung Hsieh, Chao-Wei Lee, Hsueh-Chao Chang, Wei-Chiang Huang
  • Publication number: 20240328885
    Abstract: A method for calibrating sensed force of a touch pad module is provided. The touch pad module includes a touch pad and force sensing elements disposed therebeneath. The method includes: obtaining a force reference table obtained before the touch pad module is assembled with an electronic device, the force reference table including a first data, which includes a first point of the touch pad and first force reference values corresponding to the first point and respectively corresponding to the force sensing elements; placing a calibration block on the first point after the touch pad module is assembled with the electronic device, so the force sensing elements respectively obtain first force test values corresponding to the first point; calculating first compensation ratios according to the first force reference values and the first force test values; and inputting the first compensation ratios into the force reference table.
    Type: Application
    Filed: May 18, 2023
    Publication date: October 3, 2024
    Inventors: Chieh-Hung Hsieh, Hsueh-Chao Chang, Sian-Yi Chiu, Chao-Wei Lee, Wei-Chiang Huang
  • Patent number: 12050741
    Abstract: A touchpad module for a computing device is provided. A fixing frame is concavely formed in a casing of the computing device. The fixing frame includes a supporting part. The touchpad module is installed within the fixing frame. The touchpad module includes a touch member and a pressure sensing element. The touch member includes a covering plate and a circuit board. An edge part of covering plate is supported on the supporting part. The pressure sensing element is installed on the touch member and electrically connected with the circuit board. While the touch member is pressed, the touch member is bent downwardly. Consequently, the touch member has a deformation amount. According to the deformation amount, a magnitude of a pressing force exerted on the touch member is sensed, and a pressure sensing signal is generated.
    Type: Grant
    Filed: March 8, 2023
    Date of Patent: July 30, 2024
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Wei-Chiang Huang, Hung-Wei Kuo, Chao-Wei Lee, Ying-Yen Huang
  • Publication number: 20240231513
    Abstract: A touchpad module for a computing device is provided. A fixing frame is concavely formed in a casing of the computing device. The fixing frame includes a supporting part. The touchpad module is installed within the fixing frame. The touchpad module includes a touch member and a pressure sensing element. The touch member includes a covering plate and a circuit board. An edge part of covering plate is supported on the supporting part. The pressure sensing element is installed on the touch member and electrically connected with the circuit board. While the touch member is pressed, the touch member is bent downwardly. Consequently, the touch member has a deformation amount. According to the deformation amount, a magnitude of a pressing force exerted on the touch member is sensed, and a pressure sensing signal is generated.
    Type: Application
    Filed: March 8, 2023
    Publication date: July 11, 2024
    Inventors: Wei-Chiang Huang, Hung-Wei Kuo, Chao-Wei Lee, Ying-Yen Huang
  • Patent number: 12013994
    Abstract: A touchpad module for a computing device is provided. The touchpad module is installed within a fixing frame of the computing device. The touchpad module includes a base plate, a touch member, a conductive supporting structure, a first adhesive layer, a second adhesive layer and a conducting element. The touch member is located over the base plate. The conductive supporting structure is arranged between the base plate and the touch member. The conducting element is connected between the base plate and the fixing frame of the computing device. An electrostatic discharge path is defined by the touch member, the conductive supporting structure, the base plate, the conducting element and the fixing frame of the computing device collaboratively. In addition, static electricity generated on the touch member is guided out of the touchpad module through the electrostatic discharge path.
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: June 18, 2024
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Wei-Chiang Huang, Chao-Wei Lee, Hsueh-Chao Chang, Chieh-Hung Hsieh, Sian-Yi Chiu
  • Patent number: 11983377
    Abstract: A touch module includes a base plate, a magnet, a touchpad and a magnetic board. The magnetic board includes a first sensing line, a second sensing line, a third sensing line, a first communication part and a second communication part. The touchpad is located over the base plate. The magnetic board is arranged between the touchpad and the magnet. The first sensing line, the second sensing line and the third sensing line of the magnetic board are in parallel with each other and stacked on each other. The first sensing line is electrically connected with the second sensing line through the first communication part. The second sensing line is electrically connected with the third sensing line through the second communication part. The first sensing line, the second sensing line and the third sensing line sense a magnetic field of the magnet and generates a vibration.
    Type: Grant
    Filed: May 31, 2023
    Date of Patent: May 14, 2024
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Hung-Wei Kuo, Tse-Ping Kuan, Ying-Yen Huang, Wei-Chiang Huang
  • Patent number: 11966530
    Abstract: A touchpad module includes a base plate, a touch member and at least one pressure sensing module. The touch member is located over the base plate. The touch member includes a touch plate and a touch sensitive circuit board. The pressure sensing module is arranged between the base plate and the touch member. The pressure sensing module includes a pressure sensor and a miniature supporting plate. The pressure sensor is installed on the miniature supporting plate. The pressure sensor is electrically connected with the touch sensitive circuit board through the miniature supporting plate. While the touch member is pressed in response to an external pressing force, the pressing force exerted on the touch member is sensed by the at least one pressure sensing module, and the pressure sensing module generates a pressure sensing signal.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: April 23, 2024
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Wei-Chiang Huang, Chao-Wei Lee, Hsueh-Chao Chang, Sian-Yi Chiu
  • Publication number: 20240069636
    Abstract: A touch device includes a touch panel, a circuit board, a vibrating unit and a pressure detection module. The touch panel includes two press regions. When different press regions of the touch panel are pressed by the user, the vibration feedback values generated by different press regions are different.
    Type: Application
    Filed: September 14, 2022
    Publication date: February 29, 2024
    Inventors: Chieh-Hung Hsieh, Wei-Chiang Huang, Chao-Wei Lee, Hsueh-Chao Chang, Sian-Yi Chiu
  • Patent number: 11907428
    Abstract: A touch device includes a touch panel, a circuit board, a vibrating unit and a pressure detection module. The touch panel includes two press regions. When different press regions of the touch panel are pressed by the user, the vibration feedback values generated by different press regions are different.
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: February 20, 2024
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Chieh-Hung Hsieh, Wei-Chiang Huang, Chao-Wei Lee, Hsueh-Chao Chang, Sian-Yi Chiu
  • Publication number: 20240053827
    Abstract: A touch feedback correction method and a touch module using the touch feedback correction method are provided. In the touch feedback correction method, the coordinate values and the initial vibration values of plural press region on a touch panel of the touch module are detected. Consequently, a driving voltage calibration table is established. Then, a vibrating unit of the touch module is driven according to plural compensated voltage values of the driving voltage calibration table. Consequently, the plural press regions generate plural corrected vibration values, respectively.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 15, 2024
    Inventors: Chieh-Hung Hsieh, Wei-Chiang Huang, Chao-Wei Lee, Chun-Pi Wang, Hsueh-Chao Chang, Sian-Yi Chiu
  • Publication number: 20240053857
    Abstract: A touch module includes a base plate, a magnet, a touchpad and a magnetic board. The magnetic board includes a first sensing line, a second sensing line, a third sensing line, a first communication part and a second communication part. The touchpad is located over the base plate. The magnetic board is arranged between the touchpad and the magnet. The first sensing line, the second sensing line and the third sensing line of the magnetic board are in parallel with each other and stacked on each other. The first sensing line is electrically connected with the second sensing line through the first communication part. The second sensing line is electrically connected with the third sensing line through the second communication part. The first sensing line, the second sensing line and the third sensing line sense a magnetic field of the magnet and generates a vibration.
    Type: Application
    Filed: May 31, 2023
    Publication date: February 15, 2024
    Inventors: Hung-Wei Kuo, Tse-Ping Kuan, Ying-Yen Huang, Wei-Chiang Huang
  • Patent number: 11899857
    Abstract: A touchpad module includes a base plate, a touch member, a supporting structure and a pressure sensing unit. The touch member is movable toward the base plate. The supporting structure is arranged between the base plate and the touch member. The pressure sensing unit is installed on the touch member. The pressure sensing unit is arranged between the touch member and the base plate. While the touch member is pressed in response to an external pressing force, the touch member is moved downwardly toward the base plate to compress the supporting structure. Consequently, the supporting structure is subjected to deformation, and the touch member has a displacement amount. According to the displacement amount, a magnitude of the pressing force is sensed by the pressure sensing unit, and a pressure sensing signal is outputted from the pressure sensing unit.
    Type: Grant
    Filed: March 8, 2023
    Date of Patent: February 13, 2024
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Wei-Chiang Huang, Hung-Wei Kuo, Chao-Wei Lee, Chen-Yu Wu
  • Patent number: 11726584
    Abstract: A touchpad module includes a base plate, a touch member, plural supporting elements, plural pressure sensing units and a feedback generation element. The base plate includes a plate body and plural elastic arms. The plural elastic arms are formed on the plate body. The plural supporting elements are arranged between the base plate and the touch member, and aligned with the corresponding elastic arms. While the touch member is moved toward the base plate, the plural supporting elements are move downwardly with the touch member to press the corresponding elastic arms. Consequently, the plural elastic arms are subjected to deformation. If the deformation amount of at least one of the plural elastic arms reaches a threshold value, the corresponding pressure sensing unit issues a pressure sensing signal. The feedback generation element generates a haptics feedback effect in response to the pressure sensing signal.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: August 15, 2023
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Wei-Chiang Huang, Chao-Wei Lee, Hsueh-Chao Chang, Chieh-Hung Hsieh, Sian-Yi Chiu
  • Patent number: 11703629
    Abstract: A light guide structure for a backlight module is provided. A light source of the backlight module emits a light beam. The light beam is guided by the light guide structure. The light guide structure includes a plate body and a light-shielding layer. The plate body includes a light-transmissible plate, a light-guiding plate and a reflecting plate. The light-guiding plate has a lateral surface. The light-transmissible plate has a light-transmissible plate lateral surface. The reflecting plate has a reflecting plate lateral surface. The lateral surface of the light-guiding plate, the light-transmissible plate lateral surface and the reflecting plate lateral surface are collaboratively formed as a plate body lateral surface. The plate body lateral surface is covered by the light-shielding layer. The light beam from the light source is blocked by the light-shielding layer.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: July 18, 2023
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Wei-Ping Chan, Wei-Chiang Huang, Hung-Wei Kuo
  • Patent number: 11640215
    Abstract: A touchpad module includes a touch member, a base plate, a supporting element and a switch. The touch member includes a first touch region and a second touch region. The base plate is located under the touch member. The supporting element is arranged between the touch member and the base plate. The supporting element is aligned with the second touch region. The switch is arranged between the touch member and the base plate. The switch is aligned with the second touch region. When a pressing force is applied to the second touch region of the touch member, the pressing force is transmitted to the base plate through the supporting element. Consequently, the base plate is subjected to deformation. The switch is triggered in response to the deformation of the base plate.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: May 2, 2023
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Wei-Chiang Huang, Chao-Wei Lee, Hsueh-Chao Chang, Sian-Yi Chiu
  • Patent number: 11619997
    Abstract: A touch module includes a base plate, a magnet, a touchpad and a magnetic board. The magnetic board includes a first wiring layer, a second wiring layer and a third wiring layer. The magnet is installed on the base plate. The touchpad is located over the base plate. The magnet is covered by the touchpad. The magnetic board is arranged between the touchpad and the magnet. The first wiring layer, the second wiring layer and the third wiring layer are in parallel with each other and stacked on each other. The second wiring layer is arranged between the first wiring layer and the third wiring layer. The first wiring layer is connected with the second sensing line through the third wiring layer. The first sensing line, the second sensing line and the third sensing line sense a magnetic field of the magnet and generates a vibrating effect.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: April 4, 2023
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Hung-Wei Kuo, Tse-Ping Kuan, Ying-Yen Huang, Wei-Chiang Huang
  • Publication number: 20230047597
    Abstract: A touch panel and a manufacturing method of the touch panel are provided. The touch panel includes a touch circuit board, a cover plate and a glue layer. The glue layer is arranged between the touch circuit board and the cover plate to bond the touch circuit board and the cover plate. The glue layer contains an epoxy resin main agent and an epoxy resin hardener.
    Type: Application
    Filed: October 22, 2021
    Publication date: February 16, 2023
    Inventors: Wei-Ping Chan, Wei-Chiang Huang
  • Patent number: 11567599
    Abstract: A touch panel and a manufacturing method of the touch panel are provided. The touch panel includes a touch circuit board, a cover plate and a glue layer. The glue layer is arranged between the touch circuit board and the cover plate to bond the touch circuit board and the cover plate. The glue layer contains an epoxy resin main agent and an epoxy resin hardener.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: January 31, 2023
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Wei-Ping Chan, Wei-Chiang Huang
  • Patent number: 11556155
    Abstract: A touchpad module includes a bracket, a touch member and a supporting plate. The supporting plate is arranged between the bracket and the touch member. When an end of the touch member is pressed down, the end of the touch member is swung relative to the bracket through the supporting plate. The supporting plate includes a plate body, at least one supporting part and a swingable part. The plate body, the at least one supporting part and the swingable part are integrally formed as a one-piece structure. The present invention further provides a computing device with the touchpad module.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: January 17, 2023
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Hsin-Chih Liu, Wei-Chiang Huang