Abstract: A light-emitting element array substrate includes a temporary base, an adhesive layer, light-emitting elements and at least one support member. The temporary storage base has a first surface and a second surface opposite to each other. The adhesive layer is disposed on the first surface of the temporary storage base. The light-emitting elements are disposed on the adhesive layer. The adhesive layer is located between the light-emitting elements and the temporary storage substrate. The at least one support member is disposed on at least one of the first surface and the second surface of the temporary storage base. In addition, a method for manufacturing a light-emitting element array substrate is also provided.

Abstract: A light emitting element array substrate includes a temporary storage base, light emitting elements, and adhesive structures. The light emitting elements are disposed on the temporary storage base. The adhesive structures are respectively located on the light emitting elements. Each of the adhesive structures includes a first adhesive member and a second adhesive member stacked on the first adhesive member. In addition, a manufacturing method of the light emitting element array substrate is also provided.

Abstract: A display apparatus includes a driving backplane and a light emitting component. The driving backplane has a first pad and a second pad. The light emitting component is disposed on the driving backplane. The light emitting component includes a first semiconductor layer, a second semiconductor layer, an active layer, a first electrode, a second electrode, a first solder and a second solder. The first solder and the second solder of the light-emitting component are respectively disposed on the first pad and the second pad of the driving backplane and electrically connected to the first pad and the second pad respectively. A volume of the first solder is larger than a volume of the second solder, and an area of the first pad is smaller than an area of the second pad.

Abstract: A light emitting element substrate includes a substrate and a light emitting element disposed on the substrate and including first and second semiconductor layers, an active layer, first and second electrodes, and first and second solders. The second semiconductor layer is disposed opposite to the first semiconductor layer. The active layer is disposed between the first and second semiconductor layers. The first and second electrodes are electrically connected to the first and second semiconductor layers respectively. The first and second solders are respectively disposed on and electrically connected to the first and second electrodes respectively. The first electrode includes a first under barrier pattern. The first solder covers the first under barrier pattern. A projection area of the first solder on the substrate is greater than a projection area of the first under barrier pattern on the substrate. A display apparatus is provided.

Abstract: A device of mass transferring chips includes a first substrate, which includes a chip-connecting area configured to connect a chip. The device further includes a second substrate, which includes a support layer and a first adhesive layer. The chip is between the first substrate and the second substrate. The first adhesive layer includes a first surface, a second surface, and a patterned recess. The first surface has a chip-receiving area configured to attach the chip from the first substrate. The second surface is opposite to the first surface and is in contact with a first side of the support layer. The patterned recess is disposed on the first surface and spaced apart from the chip-receiving area.

Abstract: A device of mass transferring chips includes a first substrate, which includes a first surface with a chip-connecting area configured to attach a chip, a second surface opposite to the first surface, and a patterned recess. The patterned recess is disposed on the first surface or the second surface. A projection of at least a portion of the patterned recess on the first surface is spaced apart from the chip-connecting area. The device further includes a second substrate with a third surface. The third surface has a chip-receiving area configured to attach the chip from the first substrate.

Abstract: A hinge synchronization module includes a base unit, and two hinge units. The two hinge units are connected to the base unit, and each of the hinge units has a gear member, a rotating platform, and a connecting member. The gear members of the hinge units mesh with each other. The rotating platform of each hinge unit has a platform body pivotable relative to the base unit. The connecting member of each hinge unit has a gear part mashing with the gear member of the hinge unit, and a slide hole. A slidable rod of the rotating platform of each hinge unit is disposed in and slidable along the slide hole of the connecting member of the hinge unit.

Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.

Abstract: An electronic device and a method for detecting abnormal device operation are provided. The method includes: obtaining multiple action events of a movable input device, and each action event including a relative coordinate and a time stamp of the movable input device; generating multiple absolute coordinates based on the relative coordinate of each action event; estimating multiple speed vectors based on the absolute coordinates and the time stamp of each action event; estimating multiple acceleration vectors based on the speed vectors and the time stamp of each action event; and estimating a probability of abnormal operation based on the speed vectors and the acceleration vectors.

Abstract: A light-emitting element panel, including a temporary storage substrate, an auxiliary pattern layer, multiple adhesive patterns, and multiple light-emitting elements, is provided. The auxiliary pattern layer is disposed on the temporary storage substrate and has multiple openings. The adhesive patterns are respectively disposed in the openings of the auxiliary pattern layer. The light-emitting elements are respectively disposed on the adhesive patterns. A reaction rate of the auxiliary pattern layer to a laser is lower than a reaction rate of the adhesive pattern to the laser. Moreover, another light-emitting element panel is also provided.

Abstract: A hinge synchronization module includes a base unit, and two hinge units. The two hinge units are connected to the base unit, and each of the hinge units has a gear member, a rotating platform, and a connecting member. The gear members of the hinge units mesh with each other. The rotating platform of each hinge unit has a platform body pivotable relative to the base unit. The connecting member of each hinge unit has a gear part mashing with the gear member of the hinge unit, and a slide hole. A slidable rod of the rotating platform of each hinge unit is disposed in and slidable along the slide hole of the connecting member of the hinge unit.

Abstract: A hinge includes: a base seat; two slide seats that are mounted on the base seat, that are movable between an inner position and an outer position, and that each have a slide rail portion; two rotary members that each have a slide portion being in sliding contact with the slide rail portion of a respective slide seat, and that are respectively rotatable relative to the slide seats; and two coupling mechanisms that are connected between the rotary members and the slide seats, such that rotations of the rotary members drive the slide seats to move between the inner position and the outer position. A distance between the slide seats decreases when the slide seats move from the outer position to the inner position.

Abstract: An electronic device and a method for detecting abnormal device operation are provided. The method includes: obtaining multiple action events of a movable input device, and each action event including a relative coordinate and a time stamp of the movable input device; generating multiple absolute coordinates based on the relative coordinate of each action event; estimating multiple speed vectors based on the absolute coordinates and the time stamp of each action event; estimating multiple acceleration vectors based on the speed vectors and the time stamp of each action event; and estimating a probability of abnormal operation based on the speed vectors and the acceleration vectors.

Abstract: An electronic device and a method for detecting abnormal device operation are provided. The method includes: obtaining multiple action events of a movable input device, and each action event including a relative coordinate and a time stamp of the movable input device; generating multiple absolute coordinates based on the relative coordinate of each action event; estimating multiple speed vectors based on the absolute coordinates and the time stamp of each action event; estimating multiple acceleration vectors based on the speed vectors and the time stamp of each action event; and estimating a probability of abnormal operation based on the speed vectors and the acceleration vectors.

Abstract: A device of mass transferring chips includes a first substrate, which includes a first surface with a chip-connecting area configured to attach a chip, a second surface opposite to the first surface, and a patterned recess. The patterned recess is disposed on the first surface or the second surface. A projection of at least a portion of the patterned recess on the first surface is spaced apart from the chip-connecting area. The device further includes a second substrate with a third surface. The third surface has a chip-receiving area configured to attach the chip from the first substrate.

Abstract: A multifunctional holder is provided for supporting a first object and a second object. The multifunctional holder includes a backboard assembly, an adapter, at least one movable arm and a positioning member. The backboard assembly is disposed on a back side of the first object. The adapter is connected to the backboard assembly. The at least one movable arm is connected to the adapter, wherein a first degree of rotational freedom is provided between the backboard assembly and the adapter, and a second degree of rotational freedom is provided between the adapter and the at least one movable arm. The positioning member is disposed on the backboard assembly or the adapter for fixing the second object.

Abstract: An electronic device and a method for detecting abnormal device operation are provided. The method includes: obtaining multiple action events of a movable input device, and each action event including a relative coordinate and a time stamp of the movable input device; generating multiple absolute coordinates based on the relative coordinate of each action event; estimating multiple speed vectors based on the absolute coordinates and the time stamp of each action event; estimating multiple acceleration vectors based on the speed vectors and the time stamp of each action event; and estimating a probability of abnormal operation based on the speed vectors and the acceleration vectors.

Abstract: Methods of semiconductor arrangement formation are provided. A method of forming the semiconductor arrangement includes forming a first nucleus on a substrate in a trench or between dielectric pillars on the substrate. Forming the first nucleus includes applying a first source material beam at a first angle relative to a top surface of the substrate and concurrently applying a second source material beam at a second angle relative to the top surface of the substrate. A first semiconductor column is formed from the first nucleus by rotating the substrate while applying the first source material beam and the second source material beam. Forming the first semiconductor column in the trench or between the dielectric pillars using the first source material beam and the second source material beam restricts the formation of the first semiconductor column to a single direction.

Abstract: An iontophoresis device may include a flexible support layer, an electrode layer, having at least two electrically isolated electrodes, fixed to the support layer. A return electrode is separated from the electrode layer and the flexible support layer. A control module is detachably connected to the electrode layer and to the return electrode. The control module is configured to provide a variable current source or a variable voltage source only to a selected proper subset of the at least two electrically isolated electrodes while not providing the variable current source to other electrodes of the at least two electrically isolated electrodes.

Abstract: A multifunctional holder is provided for supporting a first object and a second object. The multifunctional holder includes a backboard assembly, an adapter, at least one movable arm and a positioning member. The backboard assembly is disposed on a back side of the first object. The adapter is connected to the backboard assembly. The at least one movable arm is connected to the adapter, wherein a first degree of rotational freedom is provided between the backboard assembly and the adapter, and a second degree of rotational freedom is provided between the adapter and the at least one movable arm. The positioning member is disposed on the backboard assembly or the adapter for fixing the second object.