Abstract: A method includes forming a dielectric layer over an epitaxial source/drain region. An opening is formed in the dielectric layer. The opening exposes a portion of the epitaxial source/drain region. A barrier layer is formed on a sidewall and a bottom of the opening. An oxidation process is performing on the sidewall and the bottom of the opening. The oxidation process transforms a portion of the barrier layer into an oxidized barrier layer and transforms a portion of the dielectric layer adjacent to the oxidized barrier layer into a liner layer. The oxidized barrier layer is removed. The opening is filled with a conductive material in a bottom-up manner. The conductive material is in physical contact with the liner layer.

Abstract: A method for forming a semiconductor device is provided. The method includes forming a device layer over a device substrate and forming a front-side interconnect structure over the device layer. The method also includes forming a bevel oxide over an edge portion of the device substrate, an edge portion of the device layer, and an edge portion of the front-side interconnect structure. The method further includes forming an oxide layer over the device layer, the front-side interconnect structure, and the bevel oxide, polishing the bevel oxide and the oxide layer until a top surface of the bevel oxide is substantially level with a top surface of the oxide layer, and attaching a carrier substrate to the bevel oxide and the oxide layer.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor. The image sensor includes a deep trench isolation (DTI) structure disposed in a substrate. A pixel region of the substrate is disposed within an inner perimeter of the DTI structure. A photodetector is disposed in the pixel region of the substrate. A gate electrode structure overlies, at least partially, the pixel region of the substrate. A first gate dielectric structure partially overlies the pixel region of the substrate. A second gate dielectric structure partially overlies the pixel region of the substrate. The gate electrode structure overlies both a portion of the first gate dielectric structure and a portion of the second gate dielectric structure. The first gate dielectric structure has a first thickness. The second gate dielectric structure has a second thickness that is greater than the first thickness.

Abstract: A wideband antenna system includes a first metal radiation portion, having a coupling distance with a second metal radiation portion; a first feeding contact and a second feeding contact, electrically connected to the first metal radiation portion and the second metal radiation portion respectively, and close to the coupling distance; a first ground contact, electrically connected to the second metal radiation portion; a second ground contact, electrically connected to the first metal radiation portion; an impedance tuner, electrically connected to the first feeding contact, the second feeding contact, the first ground contact, the second ground contact, and a radio frequency signal source, to switch the first metal radiation portion and the second metal radiation portion; an aperture contact, electrically connected to the first metal radiation portion; and an aperture tuner, electrically connected to the aperture contact.

Abstract: A memory management method, a memory storage device and a memory control circuit unit are disclosed. The method includes: detecting a status of a rewritable non-volatile memory module; and determining whether to perform a data refresh operation on the rewritable non-volatile memory module according to a first condition and a second condition. The first condition is related to a first physical unit in the rewritable non-volatile memory module. The second condition is related to a plurality of second physical units in the rewritable non-volatile memory module. The data refresh operation is configured to update data in the rewritable non-volatile memory module to reduce a bit error rate of the data.

Abstract: A semiconductor device includes a semiconductor layer. A gate structure is disposed over the semiconductor layer. A spacer is disposed on a sidewall of the gate structure. A height of the spacer is greater than a height of the gate structure. A liner is disposed on the gate structure and on the spacer. The spacer and the liner have different material compositions.

Abstract: A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.

Abstract: A semiconductor device includes a first transistor and a second transistor. The first transistor includes: a first source and a first drain separated by a first distance, a first semiconductor structure disposed between the first source and first drain, a first gate electrode disposed over the first semiconductor structure, and a first dielectric structure disposed over the first gate electrode. The first dielectric structure has a lower portion and an upper portion disposed over the lower portion and wider than the lower portion. The second transistor includes: a second source and a second drain separated by a second distance greater than the first distance, a second semiconductor structure disposed between the second source and second drain, a second gate electrode disposed over the second semiconductor structure, and a second dielectric structure disposed over the second gate electrode. The second dielectric structure and the first dielectric structure have different material compositions.

Abstract: An adaptive speed control system and method for adapting control of an electric motor under a changing load condition. A load torque observer determines a load torque value when the motor is operating at a constant speed, and the load torque value is used to adapt a torque. An inertia observer determines an inertia load value when the motor is operating at a changing speed, and the inertia load value is used to adapt a controller gain. An active disturbance input decoupler provides disturbance rejection when the motor is operating at a constant speed. An adaptive control switch switches the load torque observer between driving the inertia observer and driving the active disturbance input decoupler. The system may be configured for a multi-axis system in which multiple motors are each associated with a different axis of motion, and multiple adaptive speed control systems are each associated with a different motor.

Abstract: An interconnect structure includes a lower pad including a first conductive layer having a first diameter, and a second conductive layer on the first conductive layer and having a second diameter less than the first diameter, an upper bump on the lower pad and having a third diameter less than the first diameter, and a solder joint between the upper bump and the lower pad.

Abstract: A self-centering vise structure includes a vise body, a guide screw, a positioning unit, a first movable jaw unit, and a second movable jaw unit. The vise body is provided with a guide way. The positioning unit is provided with two fixed portions each provided with an elongate slot. The positioning unit is provided with two locking screws each extending through the elongate slot of each of the two fixed portions and is screwed into the guide way of the vise body. The elongate slot of each of the two fixed portions is moved relative to each of the two locking screws, and the positioning unit is moved relative to the vise body, to micro-adjust a central location of the self-centering vise structure.

Abstract: A self-centering vise structure includes a vise body, a guide screw, a positioning unit, a first movable jaw unit, and a second movable jaw unit. The vise body is provided with a guide way. The positioning unit is provided with two fixed portions each provided with an elongate slot. The positioning unit is provided with two locking screws each extending through the elongate slot of each of the two fixed portions and is screwed into the guide way of the vise body. The elongate slot of each of the two fixed portions is moved relative to each of the two locking screws, and the positioning unit is moved relative to the vise body, to micro-adjust a central location of the self-centering vise structure.

Abstract: A card vending machine includes a machine base, a motor, a gear unit, a transmission roller and a pair of output rollers. The machine base includes a card storage trough and a middle partition. The output rollers include upper and lower rollers. The motor drives the gear unit to turn the transmission roller and the output rollers, so that the cards in a card storage recess are outputted one by one.

Abstract: A base structure is used for bearing a display. The base structure includes a support and a seat. The support is connected to a display at one end and detachably disposed on the seat at the other end. The support has a buckling member, and the seat has at least one slot. The buckling member is fitted on the end of the support disposed on the seat, and is rotatable between a release position and a clamping position relative to the support. The buckling member has at least one baffle. When the buckling member is at the release position, the support is detached from the seat by passing the baffle through the slot. When the buckling member is at the clamping position, the baffle and the slot form an angle, and the baffle and the seat have a retaining relationship so as to lock the support on the seat.

Abstract: A base structure is used for bearing a display. The base structure includes a support and a seat. The support is connected to a display at one end and detachably disposed on the seat at the other end. The support has a buckling member, and the seat has at least one slot. The buckling member is fitted on the end of the support disposed on the seat, and is rotatable between a release position and a clamping position relative to the support. The buckling member has at least one baffle. When the buckling member is at the release position, the support is detached from the seat by passing the baffle through the slot. When the buckling member is at the clamping position, the baffle and the slot form an angle, and the baffle and the seat have a retaining relationship so as to lock the support on the seat.

Abstract: A connector is mounted on a circuit board via its feet of the housing (and/or a frame's feet) mounted at a tilting angle to the circuit board, or via a wedge base of its connector body such that the signal pins and the opening of the housing extend along a direction at the tilting angle relative to the circuit board. An external connector may be plugged into the tilting-type connector at a tilting angle. The feet and signal pins of the connector may be mounted to the circuit board by use of surface mount device (SMD) technology or direct insertion. A plane may be further deployed on the top of the connector for being used by an SMD equipment.

Abstract: An apparatus for solving an edge exclusion problem when polishing a semiconductor wafer includes a rotatable polishing platen with a polishing pad attached to its upper surface. A polishing slurry is deposited on the upper surface of the polishing pad during polishing. Mounted above the polishing pad is a rotatable polishing head for holding a substrate. A non-rotary actuator assembly is coaxially oriented about the outer edge of the polishing head. A ditched ring is removably attached to the bottom surface of the actuator assembly. A multiplicity of conduit grooves are formed in the bottom section of the ditched ring that allows the polishing slurry to travel unimpeded beneath the rotating wafer. A reduced wall thickness at the bottom of the ditched ring is configured to displace wrinkles from the outer edge of the wafer to the outer periphery of the ditched ring. This solves the edge exclusion problem while permitting polishing slurry to pass under the wafer.

Abstract: An apparatus for polishing a semiconductor wafer comprising a rotatable polishing platen having an upper surface, a polishing pad fixedly attached to the upper surface, a polishing slurry containing a mechanical abrasive deposited on the upper surface of the polishing pad. Mounted above the polishing pad is a rotatable polishing head assembly having a shallow recessed face adapted to centrally hold the upper back surface of the substrate, the recessed face is oriented substantially parallel to the upper surface of the polishing platen. The rotatable polishing head assembly has its rotatable axis offset relative to the rotatable axis of the polishing platen. A non-rotary cylindrical actuator assembly is coaxially oriented about the outer edge of the rotatable polishing head assembly with a ditched ring removably attached to the bottom surface of the cylindrical actuator assembly. The ditched ring also has a bottom section of a reduced wall thickness of approximately 5 mm.

Abstract: An apparatus for polishing a semiconductor wafer comprising a rotatable polishing platen having an upper surface, a polishing pad fixedly attached to the upper surface, a polishing slurry containing a mechanical abrasive deposited on the upper surface of the polishing pad. Mounted above the polishing pad is a rotatable polishing head assembly having a shallow recessed face adapted to centrally hold the upper back surface of the substrate, the recessed face is oriented substantially parallel to the upper surface of the polishing platen. The rotatable polishing head assembly has its rotatable axis offset relative to the rotatable axis of the polishing platen. A non-rotary cylindrical actuator assembly is coaxially oriented about the outer edge of the rotatable polishing head assembly with a ditched ring removably attached to the bottom surface of the cylindrical actuator assembly. The ditched ring also has a bottom section of a reduced wall thickness of approximately 5 mm.

Abstract: The present invention relates to a dressing apparatus for conditioning and regenerating a chemical mechanical polishing (CMP) pad. More specifically, the invention relates to a diamond disc dresser that employs an air spraying assembly and radially arranged dressing tools to clean, flatten, and roughen the polishing pad. Each of the dressing tools points at a same radial angle but are not necessarily equidistantly separated. Furthermore, a debris collector is used to collect the micro-particles and other types of contamination after they are swept off the working surface of the polishing pad.