Abstract: A liquid storage tank includes a housing, a piston located in the housing, a cover, an elastic element, and an outlet pipe. The cover is attached to the housing and has a support post extending toward the piston. The piston, the housing, and the cover define a tank chamber. The tank chamber is filled with cooling liquid. The elastic element is connected with the tank hosing and the piston. The elastic element is free from contact with the cooling liquid. The outlet pipe communicates with the tank chamber. An extension direction of an opening of the outlet pipe is not parallel to a direction of movement of the elastic element. When the cooling liquid is decreased, the piston compressed the tank chamber such that the elastic element is released. The tank chamber is continuously compressed by pairing the elastic element and the piston.

Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: A device structure according to the present disclosure may include a first die having a first substrate and a first interconnect structure, a second die having a second substrate and a second interconnect structure, and a third die having a third interconnect structure and a third substrate. The first interconnect structure is bonded to the second substrate via a first plurality of bonding layers. The second interconnect structure is bonded to the third interconnect structure via a second plurality of bonding layers. The third substrate includes a plurality of photodiodes and a first transistor. The second die includes a second transistor having a source connected to a drain of the first transistor, a third transistor having a gate connected to drain of the first transistor and the source of the second transistor, and a fourth transistor having a drain connected to the source of the third transistor.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.

Abstract: An interconnect structure includes a lower pad including a first conductive layer having a first diameter, and a second conductive layer on the first conductive layer and having a second diameter less than the first diameter, an upper bump on the lower pad and having a third diameter less than the first diameter, and a solder joint between the upper bump and the lower pad.

Abstract: A self-centering vise structure includes a vise body, a guide screw, a positioning unit, a first movable jaw unit, and a second movable jaw unit. The vise body is provided with a guide way. The positioning unit is provided with two fixed portions each provided with an elongate slot. The positioning unit is provided with two locking screws each extending through the elongate slot of each of the two fixed portions and is screwed into the guide way of the vise body. The elongate slot of each of the two fixed portions is moved relative to each of the two locking screws, and the positioning unit is moved relative to the vise body, to micro-adjust a central location of the self-centering vise structure.

Abstract: A self-centering vise structure includes a vise body, a guide screw, a positioning unit, a first movable jaw unit, and a second movable jaw unit. The vise body is provided with a guide way. The positioning unit is provided with two fixed portions each provided with an elongate slot. The positioning unit is provided with two locking screws each extending through the elongate slot of each of the two fixed portions and is screwed into the guide way of the vise body. The elongate slot of each of the two fixed portions is moved relative to each of the two locking screws, and the positioning unit is moved relative to the vise body, to micro-adjust a central location of the self-centering vise structure.

Abstract: A card vending machine includes a machine base, a motor, a gear unit, a transmission roller and a pair of output rollers. The machine base includes a card storage trough and a middle partition. The output rollers include upper and lower rollers. The motor drives the gear unit to turn the transmission roller and the output rollers, so that the cards in a card storage recess are outputted one by one.

Abstract: A base structure is used for bearing a display. The base structure includes a support and a seat. The support is connected to a display at one end and detachably disposed on the seat at the other end. The support has a buckling member, and the seat has at least one slot. The buckling member is fitted on the end of the support disposed on the seat, and is rotatable between a release position and a clamping position relative to the support. The buckling member has at least one baffle. When the buckling member is at the release position, the support is detached from the seat by passing the baffle through the slot. When the buckling member is at the clamping position, the baffle and the slot form an angle, and the baffle and the seat have a retaining relationship so as to lock the support on the seat.

Abstract: A base structure is used for bearing a display. The base structure includes a support and a seat. The support is connected to a display at one end and detachably disposed on the seat at the other end. The support has a buckling member, and the seat has at least one slot. The buckling member is fitted on the end of the support disposed on the seat, and is rotatable between a release position and a clamping position relative to the support. The buckling member has at least one baffle. When the buckling member is at the release position, the support is detached from the seat by passing the baffle through the slot. When the buckling member is at the clamping position, the baffle and the slot form an angle, and the baffle and the seat have a retaining relationship so as to lock the support on the seat.

Abstract: A connector is mounted on a circuit board via its feet of the housing (and/or a frame's feet) mounted at a tilting angle to the circuit board, or via a wedge base of its connector body such that the signal pins and the opening of the housing extend along a direction at the tilting angle relative to the circuit board. An external connector may be plugged into the tilting-type connector at a tilting angle. The feet and signal pins of the connector may be mounted to the circuit board by use of surface mount device (SMD) technology or direct insertion. A plane may be further deployed on the top of the connector for being used by an SMD equipment.

Abstract: An apparatus for solving an edge exclusion problem when polishing a semiconductor wafer includes a rotatable polishing platen with a polishing pad attached to its upper surface. A polishing slurry is deposited on the upper surface of the polishing pad during polishing. Mounted above the polishing pad is a rotatable polishing head for holding a substrate. A non-rotary actuator assembly is coaxially oriented about the outer edge of the polishing head. A ditched ring is removably attached to the bottom surface of the actuator assembly. A multiplicity of conduit grooves are formed in the bottom section of the ditched ring that allows the polishing slurry to travel unimpeded beneath the rotating wafer. A reduced wall thickness at the bottom of the ditched ring is configured to displace wrinkles from the outer edge of the wafer to the outer periphery of the ditched ring. This solves the edge exclusion problem while permitting polishing slurry to pass under the wafer.

Abstract: An apparatus for polishing a semiconductor wafer comprising a rotatable polishing platen having an upper surface, a polishing pad fixedly attached to the upper surface, a polishing slurry containing a mechanical abrasive deposited on the upper surface of the polishing pad. Mounted above the polishing pad is a rotatable polishing head assembly having a shallow recessed face adapted to centrally hold the upper back surface of the substrate, the recessed face is oriented substantially parallel to the upper surface of the polishing platen. The rotatable polishing head assembly has its rotatable axis offset relative to the rotatable axis of the polishing platen. A non-rotary cylindrical actuator assembly is coaxially oriented about the outer edge of the rotatable polishing head assembly with a ditched ring removably attached to the bottom surface of the cylindrical actuator assembly. The ditched ring also has a bottom section of a reduced wall thickness of approximately 5 mm.

Abstract: An apparatus for polishing a semiconductor wafer comprising a rotatable polishing platen having an upper surface, a polishing pad fixedly attached to the upper surface, a polishing slurry containing a mechanical abrasive deposited on the upper surface of the polishing pad. Mounted above the polishing pad is a rotatable polishing head assembly having a shallow recessed face adapted to centrally hold the upper back surface of the substrate, the recessed face is oriented substantially parallel to the upper surface of the polishing platen. The rotatable polishing head assembly has its rotatable axis offset relative to the rotatable axis of the polishing platen. A non-rotary cylindrical actuator assembly is coaxially oriented about the outer edge of the rotatable polishing head assembly with a ditched ring removably attached to the bottom surface of the cylindrical actuator assembly. The ditched ring also has a bottom section of a reduced wall thickness of approximately 5 mm.

Abstract: The present invention relates to a dressing apparatus for conditioning and regenerating a chemical mechanical polishing (CMP) pad. More specifically, the invention relates to a diamond disc dresser that employs an air spraying assembly and radially arranged dressing tools to clean, flatten, and roughen the polishing pad. Each of the dressing tools points at a same radial angle but are not necessarily equidistantly separated. Furthermore, a debris collector is used to collect the micro-particles and other types of contamination after they are swept off the working surface of the polishing pad.