Abstract: A routing structure between dies is provided, including a trace layer, disposed on a substrate, wherein a plurality of routing paths is embedded in the trace layer. In addition, a first die and a second die are disposed on the trace layer and connected by the routing paths. A spacing gap between the first die and the second die is along a first direction and interfacing edges of the first die and the second die are extending along a second direction perpendicular to the first direction. Each of the routing paths includes a first straight portion in parallel to connect to the interfacing edges. The first straight portion has a slant angle with respect to the first direction other than 0° and 90°.

Abstract: A communication interface structure for connection between dies is provided, including a memory die, processing dies and interconnection routings. The memory die includes a first interface edge, wherein the first interface edge is split into a plurality of interface groups. Each of the processing dies includes a second interface edge. Interconnection routings respectively connect the second interface edges of the processing dies to the interface groups of the memory die.

Abstract: A routing structure between dies is provided, including a trace layer, disposed on a substrate, wherein a plurality of routing paths is embedded in the trace layer. In addition, a first die and a second die are disposed on the trace layer and connected by the routing paths. A spacing gap between the first die and the second die is along a first direction and interfacing edges of the first die and the second die are extending along a second direction perpendicular to the first direction. Each of the routing paths includes a first straight portion in parallel to connect to the interfacing edges. The first straight portion has a slant angle with respect to the first direction other than 0° and 90°.

Abstract: A communication interface structure for connection between dies is provided, including a memory die, processing dies and interconnection routings. The memory die includes a first interface edge, wherein the first interface edge is split into a plurality of interface groups. Each of the processing dies includes a second interface edge. Interconnection routings respectively connect the second interface edges of the processing dies to the interface groups of the memory die.

Abstract: Techniques for allocating power budget to a central processing unit (CPU) of a computing device are described. According to an example of the present subject matter, a CPU is operated at default power level corresponding to a thermal design power (TDP) of the computing device. Thereafter, an unused power of the computing device is determined at run-time. The unused power is a difference between an allocated power budget of the component and current power consumption of the component, wherein the allocated power budget is an amount of power allocated to the component based on the TDP of the computing device. Based on the unused power the CPU is operated at a high-performance power level. The high-performance power level is a power level above the default power and up to a maximum power level of the CPU.

Abstract: A crystal oscillation circuit, a gain stage of the crystal oscillation circuit and a method for designing the same are provided. The gain stage includes multiple amplifiers and multiple current-limiting resistors. Input terminals of the amplifiers are coupled together to a first bonding pad, wherein transconductances of the amplifiers are different from each other. The first bonding pad is used for electrically coupling to a first terminal of an oscillation crystal module. First terminals of the current-limiting resistors are respectively coupled to output terminals of the amplifiers in a one-on-one manner, and second terminals of the current-limiting resistors are coupled together to a second bonding pad, wherein the second bonding pad is used for electrically coupling to a second terminal of the oscillation crystal module.

Abstract: A crystal oscillation circuit, a gain stage of the crystal oscillation circuit and a method for designing the same are provided. The gain stage includes multiple amplifiers and multiple current-limiting resistors. Input terminals of the amplifiers are coupled together to a first bonding pad, wherein transconductances of the amplifiers are different from each other. The first bonding pad is used for electrically coupling to a first terminal of an oscillation crystal module. First terminals of the current-limiting resistors are respectively coupled to output terminals of the amplifiers in a one-on-one manner, and second terminals of the current-limiting resistors are coupled together to a second bonding pad, wherein the second bonding pad is used for electrically coupling to a second terminal of the oscillation crystal module.

Abstract: An electronic card including a substrate and a display panel is provided. The substrate has a first surface, a second surface opposite to the first surface, a first side, a second side opposite to the first side, a third side and a fourth side opposite to the third side, wherein the first surface and the second surface are surrounded by the first side, the second side, the third side and the fourth side. The display panel is disposed on the first surface and is roughly near the first side, the third side and the fourth side. Therefore, a disposition area of the display panel is wider.

Abstract: An electronic card including a substrate and a display panel is provided. The substrate has a first surface, a second surface opposite to the first surface, a first side, a second side opposite to the first side, a third side and a fourth side opposite to the third side, wherein the first surface and the second surface are surrounded by the first side, the second side, the third side and the fourth side. The display panel is disposed on the first surface and is roughly near the first side, the third side and the fourth side. Therefore, a disposition area of the display panel is wider.

Abstract: A handheld radio signal tracker is provided. The handheld tracker includes a plurality of directional antennas to receive radio signal, whereby a microprocessor will identify the direction and distance of the target which sends the signal. In particular, two directional antennas receive a signal from the same target, the indicating light will show the right direction when the target is positioned in the overlapping area between two directional antennas' detection area.