Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer and a second spacer around the gate structure; forming a recess adjacent to two sides of the second spacer; performing a cleaning process to trim the second spacer for forming a void between the first spacer and the substrate; and forming an epitaxial layer in the recess.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer and a second spacer around the gate structure; forming a recess adjacent to two sides of the second spacer; performing a cleaning process to trim the second spacer for forming a void between the first spacer and the substrate; and forming an epitaxial layer in the recess.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer and a second spacer around the gate structure; forming a recess adjacent to two sides of the second spacer; performing a cleaning process to trim the second spacer for forming a void between the first spacer and the substrate; and forming an epitaxial layer in the recess.

Abstract: A semiconductor device and a method for fabricating the semiconductor device are provided, in which the method includes the steps of forming a gate structure on a substrate, forming a spacer on a sidewall of the gate structure, forming two recesses adjacent to two sides of the spacer, performing a cleaning process to trim the spacer for forming a void between the spacer and the substrate, and forming two portions of an epitaxial layer in the two recesses. The semiconductor device preferably includes a cap layer on the two portions of the epitaxial layer as the cap layer includes a planar top surface and an inclined sidewall.

Abstract: A semiconductor device and a method for fabricating the semiconductor device are provided, in which the method includes the steps of forming a gate structure on a substrate, forming a spacer on a sidewall of the gate structure, forming two recesses adjacent to two sides of the spacer, performing a cleaning process to trim the spacer for forming a void between the spacer and the substrate, and forming two portions of an epitaxial layer in the two recesses. The semiconductor device preferably includes a cap layer on the two portions of the epitaxial layer as the cap layer includes a planar top surface and an inclined sidewall.

Abstract: A method for sorting menu options in a program menu of an electronic device creates an order parameter, a basic count parameter, and a carry count parameter to each menu option. The basic count parameters, the carry count parameters, and the order parameters are recalculated in response to a user-selected menu option, a user-added menu option, or a user-deleted menu option. The menu options are displayed according to the order parameters.

Abstract: A method for sorting menu options in a program menu of an electronic device creates an order parameter, a basic count parameter, and a carry count parameter to each menu option. The basic count parameters, the carry count parameters, and the order parameters are recalculated in response to a user-selected menu option, a user-added menu option, or a user-deleted menu option. The menu options are displayed according to the order parameters.

Abstract: The present invention relates to a lifting device for stool cover, and in particular to one comprising a bracket having a lug at one end and a supporting portion at the other end, an upper rack slidably fitted with the upper part of the supporting portion, a lower rack slidably fitted with the lower part of the supporting portion, an outer shaft inserted into the bracket, an inner shaft inserted into the outer shaft, a driving arm pivoted on the lower part of the supporting portion, a tubular member secured to the lower part of the driving arm, a controlling lever fixedly connected with the tubular member at the lower end, a stool lid having a square hole adapted to the outer shaft and a stool seat having a square hole adapted to the inner shaft.