Patents by Inventor Wei-Chin Lau

Wei-Chin Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and an alignment plate for engaging a stiffener frame and a circuit board
    Patent number: 9349628
    Abstract: Methods and apparatus for coupling a stiffener frame to a circuit board are disclosed. In one aspect, a method for engaging a stiffener frame and a circuit board positioned in a fixture is provided. The method includes positioning an alignment plate on the stiffener frame, such that a downwardly facing shoulder of a bottom opening of the alignment plate is seated on a setback of the stiffener frame, wherein the bottom opening of the alignment plate is larger than the a top opening of the alignment plate. The circuit board is positioned on the stiffener frame. The alignment plate restrains movement of the circuit board relative to the stiffener frame with a peripheral wall of a the top opening of the alignment plate.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: May 24, 2016
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Wei-Chin Lau, Hai-Wah Lim
  • STIFFENER FRAME FIXTURE
    Publication number: 20140237815
    Abstract: Methods and apparatus for coupling a stiffener frame to a circuit board are disclosed. In one aspect, an apparatus for engaging a stiffener frame and a circuit board positioned in a fixture is provided. The stiffener frame includes an edge. The apparatus includes an alignment plate that has a shoulder to engage the edge of the stiffener frame. The alignment plate includes a first opening with a peripheral wall to restrain movement of a circuit board relative to the stiffener frame.
    Type: Application
    Filed: March 21, 2013
    Publication date: August 28, 2014
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Wei-Chin Lau, Hai-Wah Lim