Abstract: A door locking mechanism and semiconductor container using the same include door panel, cover, and locking module. The door panel has a first stop structure. The cover and the door panel define an accommodating space for receiving the locking module. The locking module includes rotating member, holding member, and elastic member. The elastic member is disposed on the holding member and has a second stop structure near the first stop structure. The elastic member is disposed between the holding and the rotating member. The elastic member is compressed when a force is applied to the holding member, and the second stop structure detaches from a limitation state with the first stop structure for allowing a rotating operation of the rotating member. The elastic member elastically restores when the force is removed, and the second stop structure returns to the limitation state for limiting the rotating operation.

Abstract: An optical adhesive film structure having an alignment function is provided. The optical adhesive film structure includes an optical adhesive layer and a release film. The release film is disposed on the optical adhesive layer. A first film surface of the release film facing away from the optical adhesive layer has a plurality of marks. The marks are recessed into the release film relative to the first film surface and do not run through the release film. A stitching display module and a manufacturing method of the stitching display module are also provided.

Abstract: In a method of manufacturing a semiconductor device, an underlying structure is formed over a substrate. A film is formed over the underlying structure. Surface topography of the film is measured and the surface topography is stored as topography data. A local etching is performed by using directional etching and scanning the substrate so that an entire surface of the film is subjected to the directional etching. A plasma beam intensity of the directional etching is adjusted according to the topography data.

Abstract: A packaging substrate that includes a first conductive layer to an Nth conductive layer stacked in sequence, N being a positive integer greater than 3; an insulating layer arranged between two adjacent conductive layers; a plurality of pads disposed on the first conductive layer, the plurality of pads being used to connect a plurality of conductive bumps at the bottom of a chip; and a plurality of conductive holes arranged one-to-one corresponding to the plurality of pads between the first conductive layer and an ath conductive layer, one end of the conductive hole is connected to the corresponding pad, and the other end extending to the ath conductive layer at most and being electrically connected to a corresponding core conductive hole.

Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.

Abstract: An axial-flow heat dissipation fan including a frame, a hub, and a plurality of blades is provided. The frame has an air inlet and an air outlet. The hub is rotatably arranged in the frame. The blades disposed at side of the hub respectively and rotate along with the hub. Each of the blades has a front surface facing toward the air inlet and a rear surface facing toward the air outlet. A surface roughness of the front surface is different from a surface roughness of the rear surface.

Abstract: A method for animating fibers in a computer-based animation process, the method comprises: obtaining a fiber cache comprising a plurality of fibers, each of the plurality of fibers comprising a plurality of fiber vertices; obtaining one or more guides, each of the one or more guides comprising a plurality guide vertices; and determining binding information to bind the one or more guides to the fiber cache. Determining the binding information comprises, for each fiber of the fiber cache: associating the fiber with one or more nearby guides; and, for each of the one or more associated nearby guides: associating each fiber vertex with a nearby guide vertex; and determining, for each fiber vertex, a displacement vector between the fiber vertex and the associated nearby guide vertex.

Abstract: A method for manipulating vertex positions of one or more simulated hair strands based on user input while preserving shape details of the one or more simulated hair strands. The method comprises receiving a displacement vector and a region as input and identifying first consecutive groups of vertices of a first simulated hair strand within the region. For each first consecutive group of vertices within the region, the method comprises finding the average vertex position, determining the closest vertex of the consecutive group of vertices to the average vertex position, determining a new positional constraint based on the closest vertex and the displacement vector and determining new vertex positions for the first simulated hair strand by running a constraint enforcement process constrained by the new positional constraint for each consecutive group of vertices and one or more shape-preserving constraints.

Abstract: A USB multi-adapter for connecting to a USB plug of an electronic device, and a USB receptacle of a laptop computer, a desktop computer, or an electric socket, includes a device identifying module including at least one USB plug and/or at least one USB receptacle, the device identifying module being capable of identifying kind of a connected electronic device based on a voltage signal in a differential pair and communicating therewith; and a mode determining module electrically connected to the device identifying module for determining whether the connected electronic device is in a power supply mode or a communication mode so that at least one electronic device can be charged by the USB multi-adapter or a communication between the at least one electronic device can be carried out by the USB multi-adapter.

Abstract: A field emission device has pixels with cathode and anode provided on the same plane, so that electrons directly penetrate an independently provided fluorescent powder layer to produce light, giving the display the advantages of easy focusing, no dark spots, high brightness, and enhanced light emitting performance. Since the light produced by the fluorescent powder layer is not blocked by the anode, the problem of charge accumulation on the fluorescent powder layer is avoided, and it is not necessary to use expensive light-transmittable conducting glass as the anode. With the cathode and the anode located at the same plane, it is not necessary to use a high precision spacer to maintain a fixed distance between the cathode and the anode, enabling the device to be manufactured at reduced cost and high good yield.

Abstract: A liquid-based gravity-driven etching-stop technique for controlling structure dimension is provided, where opposite etching trenches in cooperation with an etching-stop solution are used for controlling the dimension of a microstructure on the wafer level. In an embodiment, opposite trenches surrounding the microstructure are respectively etched on sides of the wafer, and the trench depth on the side of the wafer, on which the microstructure is, is equal to the design dimension of the microstructure. Contrarily, it is unnecessary to define the trench depth on the back-side of the chip. In the final step of the fabrication process, when the device is etched, such that the trenches on the sides communicate with each other to separate the microstructure from the whole wafer automatically and thereby shift from the etchant into the etching-stop solution to stop etching.

Abstract: A liquid-based gravity-driven etching-stop technique for controlling structure dimension is provided, where opposite etching trenches in cooperation with an etching-stop solution are used for controlling the dimension of a microstructure on the wafer level. In an embodiment, opposite trenches surrounding the microstructure are respectively etched on sides of the wafer, and the trench depth on the side of the wafer, on which the microstructure is, is equal to the design dimension of the microstructure. Contrarily, it is unnecessary to define the trench depth on the back-side of the chip. In the final step of the fabrication process, when the device is etched, such that the trenches on the sides communicate with each other to separate the microstructure from the whole wafer automatically and thereby shift from the etchant into the etching-stop solution to stop etching.

Abstract: A scrap device for a food processor is connected to the cap of the processor and the cap includes a feeding tube which is located above the grinding plate of the processing unit. The grinding plate includes blades for grinding fruit or food and is driven by a motor. A filter extends from a periphery of the grinding plate and the scrap plate keeps a proper a gap between an inside of the filter and the scrap device. The scrap plate is stationary and the filter is rotated together with the grinding plate so that the scrap plate remove the debris attached on the filter which operating the food processor.

Abstract: The present invention discloses a method for assembling carbon nanotubes and microprobe, which employs the Electrophoresis or Dielectrophoresis principles to drive the carbon nanotubes self-assembling the microprobe under an electric field. The method comprises the steps of: forming at least one microprobe, the microprobe being covered by a conductive layer; exposing the microprobe to a solution having carbon nanotubes spreading therein, the solution being furnished with an electrode; applying a predetermined voltage between the conductive layer and the electrode, making at least one carbon nanotube to move and attach onto the top of the microprobe.

Abstract: An apparatus is provided for feeding fabric workpieces one at a time from the top of a stack of like workpieces having a first rough side and a second smooth side, the workpieces being stacked with alternating sides up. A computer controlled picker is used to separate the top workpiece from the remaining workpieces in the stack, and for depositing the workpiece on a downstream conveyor. An ultrasonic face detector is mounted above the first conveyor for determining whether the side of the workpiece facing the face detector--the top surface--is relatively rough or relatively smooth. A pivoting feeder/inverter is provided at the end of the first conveyor. If the workpiece has the desired side up for subsequent sewing operations, the inverter/conveyor is placed in a first position so that the workpiece is directed into a sandwich belt type conveyor which will not change the orientation of the workpiece.

Abstract: An automatic garment inspection and measurement system can create a two-dimensional or three-dimensional electronic representation of an object. This electronic representation can then be combined with other electronic representations to create a database of measurements from which standard patterns can be generated for use in manufacturing garments. The electronic representation can also be used to compare the manufactured object it represents to an ideal representation in order to determine if the object's measurements are within a predetermined tolerance of the ideal representation. A machine vision system is used to capture an image of the object and convert that image into a digital representation which can then be added to a database to be used to compile an ideal pattern or can be compared to an already existing ideal image to determine if the object is the correct size.