Abstract: A semiconductor die includes a semiconductor substrate, an interconnect structure, and a conductive bump. The interconnect structure is disposed on and electrically connected to the semiconductor substrate. The interconnect structure includes stacked interconnect layers. Each of the stacked interconnect layers includes a dielectric layer and an interconnect wiring embedded in the dielectric layer. The interconnect wiring of a first interconnect layer among the stacked interconnect layers further includes a first via and second vias. The first via electrically connected to the interconnect wiring. The second vias connected to the interconnect wiring, and the first via and the second vias are located on a same level height. The conductive bump is disposed on the interconnect structure. The conductive bump includes a base portion and a protruding portion connected to the base portion, and the base portion is between the protruding portion and the first via.

Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.

Abstract: An electrical connector is adapted to be alternatively connected to an audio plug or another device plug. The electrical connector includes a hollow insulating main body having an insertion opening that has an audio insertion portion corresponding in shape to the audio plug and a main insertion portion corresponding in shape to the another device plug, a main terminal module including main terminals partially exposed in a receiving space of the insulating main body for electrical connection with the another device plug, and an audio terminal module including audio terminals partially exposed in the receiving space for electrical connection with the audio plug.

Abstract: An electrical connector is adapted to be alternatively connected to an audio plug or another device plug. The electrical connector includes a hollow insulating main body having an insertion opening that has an audio insertion portion corresponding in shape to the audio plug and a main insertion portion corresponding in shape to the another device plug, a main terminal module including main terminals partially exposed in a receiving space of the insulating main body for electrical connection with the another device plug, and an audio terminal module including audio terminals partially exposed in the receiving space for electrical connection with the audio plug.