Abstract: A system and a method for workplace safety management are provided. The method includes: dividing a work field corresponding to the workplace into work zones; assigning an environmental indicator to each of the work zones according to environmental data of the workplace; generating AR warning image signals according to the work zones and the environmental indicator; transmitting the AR warning image signals respectively to wearable electronic devices located in the workplace; and each of the wearable electronic devices displaying an AR warning image according to the received AR warning image signal.

Abstract: A sensing apparatus is applicable to a surgical instrument having a clamping portion, a linkage rod member and an operating portion. The damping portion is used to damp a target. The sensing apparatus includes a touch sensor set, a force sensor, a displacement sensor and a processing device. The touch sensor set can sense a touch signal between the target and the clamping portion. The force sensor can sense a clamping force applied on the target. The displacement sensor can measure a displacement of the linkage rod member. The processing device includes a database, a processing unit and a comparison unit. The database stores reference curves of different reference objects. The processing unit can build an actual measurement curve of the target. The comparison unit can compare the actual measurement curve with each of the reference curves to obtain one of the reference curves corresponding to the actual measurement curve.

Abstract: A surgery navigation system according to the present invention includes: a positioning module including: a transceiver unit, configured to transmit a frequency modulated signal; multiple positioning marks, which are separately disposed on each vertebra of a spine and configured to transmit the positioning mark frequency signal to the transceiver unit after receiving the frequency modulated signal; and a surgical instrument, which transmits the instrument frequency signal to the transceiver unit after receiving the frequency modulated signal; and a processing unit, which obtains a distance between the positioning marks and the transceiver unit through calculation according to a difference between the positioning mark frequency signal and the frequency modulated signal, and obtains space coordinates of the spine through calculation according to the distance; and obtains a distance between the surgical instrument and the transceiver unit through calculation according to a difference between the instrument freque

Abstract: An acetabular cup structure of the present invention includes a ball-and-socket prosthesis and a liner, where a ball wall of the ball-and-socket prosthesis has a groove formed by connecting at least two continuous straight lines, and the groove connects an outer surface of the ball wall to an inner surface of the ball wall, so that an expandable sheet is formed between the groove formed by connecting the at least two continuous straight lines and having an angle there-between and two ends of the groove that are not connected, and the liner, for connecting a femoral stem, is tightly attached to the inner surface of the ball wall, and when the liner is tightly attached to the inner surface of the ball wall, the liner presses the sheet and extends to the groove, so that the liner is attached to the ball-and-socket prosthesis more tightly.

Abstract: A sensing apparatus is applicable to a surgical instrument having a clamping portion, a linkage rod member and an operating portion. The damping portion is used to damp a target. The sensing apparatus includes a touch sensor set, a force sensor, a displacement sensor and a processing device. The touch sensor set can sense a touch signal between the target and the clamping portion. The force sensor can sense a clamping force applied on the target. The displacement sensor can measure a displacement of the linkage rod member. The processing device includes a database, a processing unit and a comparison unit. The database stores reference curves of different reference objects. The processing unit can build an actual measurement curve of the target. The comparison unit can compare the actual measurement curve with each of the reference curves to obtain one of the reference curves corresponding to the actual measurement curve.

Abstract: An intervertebral implant is a porous structure formed of a plurality of metal balls, and the intervertebral implant includes a bone support area and a bone growth area. The bone support area and the bone growth area each have a plurality of connecting holes, and a porosity of the bone support area is smaller than that of the bone growth area.

Abstract: An intervertebral implant, particularly an intervertebral implant comprising local degradable hydroxyl apatite/metal block and based on a support mounting model of porous hydroxyl apatite with metal powders held for sintering and molding, guides osseous tissues to grow in porous metal and is steadily merged in upper and lower bones when the implanted hydroxyl apatite is gradually degraded in a certain period.

Abstract: A supporting instrument with a modular intramedullary nail includes a plurality of intramedullary nails and a coupling module. Each intramedullary nail is in a form of a long rod and has a coupling portion arranged between two ends of the intramedullary nail and an abutting surface along a longitudinal face of the intramedullary nail. The coupling module is mounted to the coupling portions of the plurality of intramedullary nails for the abutting surfaces of the plurality of intramedullary nails to abut against each other and for assembling the plurality of intramedullary nails.

Abstract: A supporting instrument with a modular intramedullary nail includes a plurality of intramedullary nails and a coupling module. Each intramedullary nail is in a form of a long rod and has a coupling portion arranged between two ends of the intramedullary nail and an abutting surface along a longitudinal face of the intramedullary nail. The coupling module is mounted to the coupling portions of the plurality of intramedullary nails for the abutting surfaces of the plurality of intramedullary nails to abut against each other and for assembling the plurality of intramedullary nails.

Abstract: A semiconductor device includes a gate structure over a substrate, a source region in the substrate, where the source region is adjacent to the gate structure. Additionally, the semiconductor device includes a drain region in the substrate, where the drain region is adjacent to the gate structure. Moreover, the semiconductor device includes a first dislocation in the substrate between the source region and the drain region. Furthermore, the semiconductor device includes a second dislocation in the substrate between the source region and the drain region, where the second dislocation is substantially parallel to the first dislocation.

Abstract: A metal implant produced from a method for treating a surface of a metal implant includes a metal layer, an oxide layer formed on a surface of the metal layer, and a macromolecular anti-adhesion layer formed on an outer surface of the oxide layer. The macromolecular anti-adhesion layer is formed of polyethylene glycol.

Abstract: An intervertebral implant, particularly an intervertebral implant comprising local degradable hydroxyl apatite/metal block and based on a support mounting model of porous hydroxyl apatite with metal powders held for sintering and molding, guides osseous tissues to grow in porous metal and is steadily merged in upper and lower bones when the implanted hydroxyl apatite is gradually degraded in a certain period.

Abstract: A method for treating a surface of a metal implant includes a polishing step, a grafting step and a surface modifying step. The polishing step includes polishing a surface of a metal implant to remove an uneven, natural oxide layer on the surface of the metal implant and to generate an even oxide layer on the surface of the metal implant. The grafting step includes grafting an anti-adhesion macromolecule on an outer face of the even oxide layer. A covalent bond between the anti-adhesion macromolecule and oxygen atoms on the outer face of the even oxide layer is formed. Thus, a macromolecular anti-adhesion layer on the outer face of the even oxide layer can be created. The surface modifying step includes changing a property of the surface of the metal implant with the macromolecular anti-adhesion layer by high temperature and high pressure, providing the metal implant with high hydrophilicity.

Abstract: A method for manufacturing a biomedical signal conductive membrane includes providing a natural polymer material, adding an acid solution for making the natural polymer material dissolved in the acid solution to form a viscous liquid mixture, performing a dry step for drying the viscous liquid mixture to form an initial stage of membrane, wherein the structure of natural polymer material within the initial stage of membrane is a straight chain, providing a cross-linking agent to perform a cross-linking step for transforming the initial stage of membrane into a gel membrane, wherein the structure of natural polymer material within the gel membrane is a cross-linked network, and performing a rinse step for removing the cross-linking agent and keeping a plurality of water molecules remaining within the cross-linked network of natural polymer material.

Abstract: An intervertebral implant is a porous structure formed of a plurality of metal balls, and the intervertebral implant includes a bone support area and a bone growth area. The bone support area and the bone growth area each have a plurality of connecting holes, and a porosity of the bone support area is smaller than that of the bone growth area.

Abstract: A semiconductor device includes a gate structure over a substrate, a source region in the substrate, where the source region is adjacent to the gate structure. Additionally, the semiconductor device includes a drain region in the substrate, where the drain region is adjacent to the gate structure. Moreover, the semiconductor device includes a first dislocation in the substrate between the source region and the drain region. Furthermore, the semiconductor device includes a second dislocation in the substrate between the source region and the drain region, where the second dislocation is substantially parallel to the first dislocation.

Abstract: A method of forming a semiconductor device includes performing a first pre-amorphous implantation process on a substrate, where the substrate has a gate stack. The method further includes forming a first stress film over the substrate. The method also includes performing a first annealing process on the substrate and the first stress film. The method further includes performing a second pre-amorphous implantation process on the annealed substrate, forming a second stress film over the substrate, and performing a second annealing process on the substrate and the second stress film.

Abstract: A positioning device, an image projecting system and a method for overlapping images are provided. The positioning device is applied to a Computed Tomography process and a Magnetic Resonance Imaging process. The positioning device includes a patch and a positioning mark. The positioning mark is adapted to be mounted on the patch, and includes a Computed Tomography mark and a Magnetic Resonance Imaging mark.

Abstract: A method of fabricating and a semiconductor device with multiple dislocation structures is disclosed. The exemplary semiconductor device includes gate structure overlying a top surface of a semiconductor substrate and a first gate spacer disposed on a sidewall of the gate structure and overlying the top surface of the substrate. The semiconductor device further includes a crystallized semiconductor material overlying the top surface of the semiconductor substrate and adjacent to a sidewall of the first gate spacer. The semiconductor device further includes a second gate spacer disposed on the sidewall of the first gate spacer and overlying the crystallized semiconductor material. The semiconductor device further includes a first stressor region disposed in the semiconductor substrate and a second stressor region disposed in the semiconductor substrate and in the crystallized semiconductor material.

Abstract: A supporting instrument with a modular intramedullary nail includes a plurality of intramedullary nails and a coupling module. Each intramedullary nail is in a form of a long rod and has a coupling portion arranged between two ends of the intramedullary nail and an abutting surface along a longitudinal face of the intramedullary nail. The coupling module is mounted to the coupling portions of the plurality of intramedullary nails for the abutting surfaces of the plurality of intramedullary nails to abut against each other and for assembling the plurality of intramedullary nails.