Patents by Inventor Wei-Chou Hung

Wei-Chou Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7064421
    Abstract: A wire bonding package has a housing having a plurality of pins, a circuit board installed inside the housing and having at least a trace connected to a pin of the housing, at least a die installed on the circuit board and having a plurality of bonding pads, and at least a bonding line connected between a bonding pad of the die and the trace of the circuit board so that the bonding pad of the die is electrically connected to the pin of the housing.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: June 20, 2006
    Assignee: ALI Corporation
    Inventors: Yu-Ling Chiu, Chun-Ming Chen, Wei-Chou Hung
  • Patent number: 7065026
    Abstract: A data slicer capable of removing current mismatch between internal current pumps and its operating method is proposed. The data slicer includes a comparator for comparing an analog signal with a slice reference level to convert the analog signal into a digital signal, a counter electrically connected to the comparator for calculating a digital sum value according to logic values carried by the digital signal, and a voltage-adjusting circuit electrically connected to the comparator for adjusting the slice reference level. The voltage-adjusting circuit has two current pumps for shifting the slice reference level. The current generated by the current pumps can be adjusted according to the calculated digital sum value to reduce a difference between a first and a second binary values which are used to increase and decrease the slice reference level respectively.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: June 20, 2006
    Assignee: Mediatek Incorporation
    Inventors: Wei-Chou Hung, Kou-Chih Peng, Chia-Ching Lee
  • Publication number: 20050133911
    Abstract: A wire bonding package has a housing having a plurality of pins, a circuit board installed inside the housing and having at least a trace connected to a pin of the housing, at least a die installed on the circuit board and having a plurality of bonding pads, and at least a bonding line connected between a bonding pad of the die and the trace of the circuit board so that the bonding pad of the die is electrically connected to the pin of the housing.
    Type: Application
    Filed: March 19, 2004
    Publication date: June 23, 2005
    Inventors: Yu-Ling Chiu, Chun-Ming Chen, Wei-Chou Hung
  • Publication number: 20040141450
    Abstract: A data slicer capable of removing current mismatch between internal current pumps and its operating method is proposed. The data slicer includes a comparator for comparing an analog signal with a slice reference level to convert the analog signal into a digital signal, a counter electrically connected to the comparator for calculating a digital sum value according to logic values carried by the digital signal, and a voltage-adjusting circuit electrically connected to the comparator for adjusting the slice reference level. The voltage-adjusting circuit has two current pumps for shifting the slice reference level. The current generated by the current pumps can be adjusted according to the calculated digital sum value to reduce a difference between a first and a second binary values which are used to increase and decrease the slice reference level respectively.
    Type: Application
    Filed: January 21, 2003
    Publication date: July 22, 2004
    Inventors: Wei-Chou Hung, Kou-Chih Peng, Chia-Ching Lee
  • Patent number: 6606282
    Abstract: The long seek control system and method include a reference velocity mapping unit that obtains a reference velocity when the dual actuator is moved by the residual track count; a velocity estimator for outputting an estimated velocity and obtaining a sled control effort by subtracting the estimated velocity from the reference velocity; and an electrical damper for receiving the sled control effort and simultaneously receiving the displacement of the dual actuator to output a damping control effort to the fine actuator, and reduce the vibration of the fine actuator during the long seek operation. In the reference velocity mapping unit, a reference velocity curve is used to describe the mapping relation between the residual track count and the reference velocity. The reference velocity curve includes a linear part and several quadratic parts with different quadratic functions.
    Type: Grant
    Filed: November 20, 2001
    Date of Patent: August 12, 2003
    Assignee: Acer Laboratories Inc.
    Inventors: Wei-Chou Hung, Chih Long Dai
  • Publication number: 20020196715
    Abstract: The long seek control system and method include a reference velocity mapping unit that obtains a reference velocity when the dual actuator is moved by the residual track count; a velocity estimator for outputting an estimated velocity and obtaining a sled control effort by subtracting the estimated velocity from the reference velocity; and an electrical damper for receiving the sled control effort and simultaneously receiving the displacement of the dual actuator to output a damping control effort to the fine actuator, and reduce the vibration of the fine actuator during the long seek operation. In the reference velocity mapping unit, a reference velocity curve is used to describe the mapping relation between the residual track count and the reference velocity. The reference velocity curve includes a linear part and several quadratic parts with different quadratic functions.
    Type: Application
    Filed: November 20, 2001
    Publication date: December 26, 2002
    Inventors: Wei-Chou Hung, Chih Long Dai