Abstract: The present disclosure, in some embodiments, relates an integrated chip. The integrated chip includes a substrate. A through-substrate-via (TSV) extends through the substrate. A dielectric liner separates the TSV from the substrate. The dielectric liner is along one or more sidewalls of the substrate. The TSV includes a horizontally extending surface and a protrusion extending outward from the horizontally extending surface. The TSV has a maximum width along the horizontally extending surface.

Abstract: A method for ingredient analysis includes the steps of: providing a database, which stores a plurality of standard ingredient data; analyzing a sample to obtain a plurality of inspection data via a high performance liquid chromatography (HPLC) method; and respectively comparing the inspection data with the corresponding standard ingredient data to analyze all ingredients contained in the sample simultaneously. The method may be applied to a device for ingredient analysis. Thus, by cooperating the database with the HPLC method, all ingredients contained in the sample can be analyzed via at least one analysis procedure so that the procedures for ingredient analysis are simpler and quicker and the accuracy of the analysis result can be enhanced.

Abstract: A method for ingredient analysis includes the steps of: providing a database, which stores a plurality of standard ingredient data; analyzing a sample to obtain a plurality of inspection data via a high performance liquid chromatography (HPLC) method; and respectively comparing the inspection data with the corresponding standard ingredient data to analyze all ingredients contained in the sample simultaneously. The method may be applied to a device for ingredient analysis. Thus, by cooperating the database with the HPLC method, all ingredients contained in the sample can be analyzed via at least one analysis procedure so that the procedures for ingredient analysis are simpler and quicker and the accuracy of the analysis result can be enhanced.