Patents by Inventor Wei Chun Ang

Wei Chun Ang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system with thermal structures and method of manufacture thereof
    Patent number: 8963320
    Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a thermal attach cluster includes: forming a heat collector having a heat dissipation surface, forming a cluster bridge, having a thermal surface, connected to the heat collector, forming a cluster pad, having an attachment surface, connected to the end of the cluster bridge opposite the heat collector; connecting an integrated circuit to the thermal attach cluster; and forming an encapsulation over the thermal attach cluster with the heat dissipation surface, the thermal surface, and the attachment surface exposed from and coplanar with the encapsulation.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: February 24, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua, Wei Chun Ang
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THERMAL STRUCTURES AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20130087902
    Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a thermal attach cluster includes: forming a heat collector having a heat dissipation surface, forming a cluster bridge, having a thermal surface, connected to the heat collector, forming a cluster pad, having an attachment surface, connected to the end of the cluster bridge opposite the heat collector; connecting an integrated circuit to the thermal attach cluster; and forming an encapsulation over the thermal attach cluster with the heat dissipation surface, the thermal surface, and the attachment surface exposed from and coplanar with the encapsulation.
    Type: Application
    Filed: June 20, 2012
    Publication date: April 11, 2013
    Inventors: Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua, Wei Chun Ang