Patents by Inventor Wei-Chun Hsueh

Wei-Chun Hsueh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210135416
    Abstract: A bonding device for a wearable device includes a first bonding structure and a second bonding structure. The first bonding structure includes a first wire connecting member, a first bonding member and an elastic member, and has a plurality of first mechanical structures configured to form a first mechanical bond and a plurality of first electrical contacts configured to form a first electrical bond, and the second bonding structure includes a first signal connecting line, wherein the first wire connecting member, the first bonding member, and the elastic member form the first mechanical bond through the plurality of first mechanical structures; the first wire connecting member, the first bonding member, and the elastic member form the first electrical bond through the plurality of first electrical contacts; and the elastic member is electrically connected to the first signal connecting line to combine the first bonding structure and the second bonding structure.
    Type: Application
    Filed: March 20, 2020
    Publication date: May 6, 2021
    Inventors: Chun-Yuan Huang, Wei-Chun Hsueh
  • Publication number: 20110266321
    Abstract: A holding device for bicycles accessories contains a base including a locking structure disposed on one end thereof to hold a bicycle accessory, a clamping structure arranged on another end thereof to clamp a frame or a handle of the bicycle, and a support mounted on a bottom end thereof.
    Type: Application
    Filed: November 9, 2010
    Publication date: November 3, 2011
    Inventor: Wei-Chun Hsueh