Patents by Inventor Wei-Chun Hu

Wei-Chun Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966628
    Abstract: A memory device, includes a memory array for storing a plurality of vector data each of which has an MSB vector and a LSB vector. The memory array includes a plurality of memory units each of which has a first bit and a second bit. The first bit is used to store the MSB vector of each vector data, the second bit is used to store the LSB vector of each vector data. A bit line corresponding to each vector data executes one time of bit-line-setup, and reads the MSB vector and the LSB vector of each vector data according to the bit line. The threshold voltage distribution of each memory unit is divided into N states, where N is a positive integer and N is less than 2 to the power of 2, and the effective bit number stored by each memory unit is less than 2.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: April 23, 2024
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Wei-Chen Wang, Han-Wen Hu, Yung-Chun Li, Huai-Mu Wang, Chien-Chung Ho, Yuan-Hao Chang, Tei-Wei Kuo
  • Patent number: 11948863
    Abstract: A package structure and method of forming the same are provided. The package structure includes a polymer layer, a redistribution layer, a die, and an adhesion promoter layer. The redistribution layer is disposed over the polymer layer. The die is sandwiched between the polymer layer and the redistribution layer. The adhesion promoter layer, an oxide layer, a through via, and an encapsulant are sandwiched between the polymer layer and the redistribution layer. The encapsulant is laterally encapsulates the die. The through via extends through the encapsulant. The adhesion promoter layer and the oxide layer are laterally sandwiched between the through via and the encapsulant. A bottom portion of the encapsulant is longitudinally sandwiched between the adhesion promoter layer and the polymer layer.
    Type: Grant
    Filed: February 8, 2023
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Chun Cho, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Wei-Chih Chen
  • Publication number: 20070226225
    Abstract: A mobile collaboration and communication system includes a wireless resource controller for receiving and/or transmitting wireless frequency data; a management module for receiving and/or transmitting data and controlling the operation of the mobile collaboration and communication system; a policy database, connected to the management module, for storing a plurality of levels of authorization for network access; a user account database, connected to the management module, for storing a plurality of authorized user accounts, wherein each user account has a corresponding level of authorization for network access; an access control module, connected to the management module, for controlling access level according the levels of authorization for network access stored in the policy database; and a collaboration and communication module, connected to the management module, for creating and managing a collaboration and communication group for communication, and relaying and controlling the data traffic to and from t
    Type: Application
    Filed: March 22, 2006
    Publication date: September 27, 2007
    Inventors: Timothy Yiu, Wei-Chun Hu