Abstract: Various solutions for low-power wake-up signal (LP-WUS) monitoring with respect to user equipment and network node in mobile communications are described. An apparatus may receive a configuration from a network node. The apparatus may comprise a main radio (MR) and a lower-power wake-up radio (LP-WUR). The apparatus may determine whether to activate or deactivate a low-power wake-up signal (LP-WUS) monitoring by the LP-WUR according to at least one pre-configured condition in the configuration. The apparatus may receive an LP-WUS from the network node via the LP-WUR in an event that the LP-WUS monitoring is activated.

Abstract: Various solutions for low-power wake-up signal (LP-WUS) design with respect to user equipment and network node in mobile communications are described. An apparatus may receive a LP-WUS configuration from a network node. The apparatus may receive a LP-WUS based on the LP-WUS configuration from the network node. The apparatus may determine whether to wake up according to the LP-WUS. The LP-WUS with N subcarriers (SCs) is generated through a transformation of M-bit on-off keying (OOK) in a time domain. The transformation is a discrete Fourier transform (DFT) or least square operation. K samples are generated from the M bits with a signal modification or a signal truncation. The LP-WUS is generated through an inverse fast Fourier transform (IFFT) operation. The K is a size of the IFFT operation of cyclic-prefix orthogonal frequency-division multiple access (CP-OFDMA). The N is less than or equal to the K.

Abstract: A package structure and method of forming the same are provided. The package structure includes a polymer layer, a redistribution layer, a die, and an adhesion promoter layer. The redistribution layer is disposed over the polymer layer. The die is sandwiched between the polymer layer and the redistribution layer. The adhesion promoter layer, an oxide layer, a through via, and an encapsulant are sandwiched between the polymer layer and the redistribution layer. The encapsulant is laterally encapsulates the die. The through via extends through the encapsulant. The adhesion promoter layer and the oxide layer are laterally sandwiched between the through via and the encapsulant. A bottom portion of the encapsulant is longitudinally sandwiched between the adhesion promoter layer and the polymer layer.

Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.

Abstract: A semiconductor device and method of manufacturing that includes a first etch stop layer and a second etch stop layer to prevent delamination and damage to underlying components. A first passivation layer and a second passivation layer are disposed on a substrate, with a metal pad exposed through the passivation layers and contacting a top metal component of the substrate. The first etch stop layer is then formed on the second passivation layer and the metal pad. A third passivation layer is then formed on the substrate with an opening to the metal pad, which is covered by the first etch stop layer. The second etch stop layer is then formed on the third passivation layer and in the opening on the second etch stop layer. A bottom metal film/conductive component is then formed on the second etch stop layer, photoresist is applied, and wet etching is performed. The metal pad is protected from damage caused by delamination of the second etch stop layer by the first etch stop layer.

Abstract: A wearable electronic device and an emergency method thereof are provided. The wearable electronic device includes a host and a strap. The host senses physiological information of a user by using a sensor. When the physiological information is determined as being abnormal, the host sends an enabling signal to the strap by a transmitting coil to enable the strap. After the strap is enabled, a warning light module displays a warning message based on the enabling signal.

Abstract: A wearable electronic device and an emergency method thereof are provided. The wearable electronic device includes a host and a strap. The host senses physiological information of a user by using a sensor. When the physiological information is determined as being abnormal, the host sends an enabling signal to the strap by a transmitting coil to enable the strap. After the strap is enabled, a warning light module displays a warning message based on the enabling signal.