Patents by Inventor Wei Chung
Wei Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12646846Abstract: A heterogeneous material integration antenna includes grounded conductive layer, dielectric layer, dielectric pieces, and antenna conductive structure. Dielectric layer is spaced apart from grounded conductive layer by first distance, and dielectric layer has first dielectric constant. Dielectric pieces each are formed in dielectric layer. Dielectric pieces are adjacent to one another and arranged in dielectric array. Outline of outermost edge of dielectric array forms dielectric region having area. The adjacent ones of dielectric pieces are spaced apart from each other by second distance. Dielectric pieces each have second dielectric constant. Magnitude of second dielectric constant is higher than magnitude of first dielectric constant. Antenna conductive structure is disposed between grounded conductive layer and dielectric array. Antenna conductive structure is electrically connected to signal source.Type: GrantFiled: June 4, 2024Date of Patent: June 2, 2026Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chun-An Lu, Wei-Yu Li, Wei Chung, Jiun-Jang Yu
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Patent number: 12489204Abstract: The disclosure provides an integrated multi-feed antenna, including a first conductor layer, a second conductor layer, and multiple feeding conductor lines. The second conductor layer has a first center position. The second conductor layer has a closed slit structure. The closed slit structure surrounds the first center position to encircle forming a center region. The second conductor layer is spaced apart from the first conductor layer at a first interval. Each of the feeding conductor lines has one end electrically connected or electrically coupled to the second conductor layer, and each has another end electrically connected to a signal source. Each of the feeding conductor lines excites the second conductor layer to generate at least one resonant mode. The resonant modes cover at least one identical wireless communication band.Type: GrantFiled: December 26, 2023Date of Patent: December 2, 2025Assignee: Industrial Technology Research InstituteInventors: Wei-Yu Li, Wei Chung, Kin-Lu Wong
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Publication number: 20250210857Abstract: The disclosure provides an integrated multi-feed antenna, including a first conductor layer, a second conductor layer, and multiple feeding conductor lines. The second conductor layer has a first center position. The second conductor layer has a closed slit structure. The closed slit structure surrounds the first center position to encircle forming a center region. The second conductor layer is spaced apart from the first conductor layer at a first interval. Each of the feeding conductor lines has one end electrically connected or electrically coupled to the second conductor layer, and each has another end electrically connected to a signal source. Each of the feeding conductor lines excites the second conductor layer to generate at least one resonant mode. The resonant modes cover at least one identical wireless communication band.Type: ApplicationFiled: December 26, 2023Publication date: June 26, 2025Applicant: Industrial Technology Research InstituteInventors: Wei-Yu Li, Wei Chung, Kin-Lu Wong
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Publication number: 20250210869Abstract: A heterogeneous material integration antenna includes grounded conductive layer, dielectric layer, dielectric pieces, and antenna conductive structure. Dielectric layer is spaced apart from grounded conductive layer by first distance, and dielectric layer has first dielectric constant. Dielectric pieces each are formed in dielectric layer. Dielectric pieces are adjacent to one another and arranged in dielectric array. Outline of outermost edge of dielectric array forms dielectric region having area. The adjacent ones of dielectric pieces are spaced apart from each other by second distance. Dielectric pieces each have second dielectric constant. Magnitude of second dielectric constant is higher than magnitude of first dielectric constant. Antenna conductive structure is disposed between grounded conductive layer and dielectric array. Antenna conductive structure is electrically connected to signal source.Type: ApplicationFiled: June 4, 2024Publication date: June 26, 2025Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chun-An LU, Wei-Yu LI, Wei CHUNG, Jiun-Jang YU
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Patent number: 12283737Abstract: An electromagnetic wave guidance and beam reshaping structure is favorable to incorporate a radiation source antenna into an energy focusing system. The electromagnetic wave guidance and beam reshaping structure includes a substrate, a plurality of metal patterns and a plurality of hollow structures. The substrate includes a central portion and a peripheral portion that surrounds the central portion. The plurality of metal patterns are disposed on the central portion. The plurality of hollow structures are disposed in the peripheral portion. The metal patterns are axisymmetrically arranged with respect to a central axis of the substrate, and the hollow structures are axisymmetrically arranged with respect to the central axis of the substrate.Type: GrantFiled: December 27, 2022Date of Patent: April 22, 2025Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Joseph Poujiong Wang, Wei-Yu Li, Wei Chung, Chun-An Lu, Jiun-Jang Yu
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Patent number: 12166278Abstract: A transparent antenna includes a substrate, an antenna grid layer, and a ground grid layer. The substrate has an electrically conductive hole extending from two opposite surfaced of the substrate. The antenna grid layer is formed on a surface of the substrate. The antenna grid layer includes a feeding portion and a transmission portion. The ground grid layer is formed on another surface of the substrate. The ground grid layer is coupled to the feeding portion of the antenna grid layer via the electrically conductive hole. An offset distance between a projection of a gridline of the antenna grid layer on the first surface and a projection of a gridline of the ground grid layer on the first surface is smaller than or equal to half of a difference between a line width of the antenna grid layer and a line width of the ground grid layer.Type: GrantFiled: August 23, 2021Date of Patent: December 10, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Shih-Ming Lin, Wei Chung, Chen-Chun Yu, Hsin-Chu Chen, Wei-Yu Li
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Publication number: 20240213646Abstract: An electromagnetic wave guidance and beam reshaping structure is favorable to incorporate a radiation source antenna into an energy focusing system. The electromagnetic wave guidance and beam reshaping structure includes a substrate, a plurality of metal patterns and a plurality of hollow structures. The substrate includes a central portion and a peripheral portion that surrounds the central portion. The plurality of metal patterns are disposed on the central portion. The plurality of hollow structures are disposed in the peripheral portion. The metal patterns are axisymmetrically arranged with respect to a central axis of the substrate, and the hollow structures are axisymmetrically arranged with respect to the central axis of the substrate.Type: ApplicationFiled: December 27, 2022Publication date: June 27, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Joseph Poujiong WANG, Wei-Yu LI, Wei CHUNG, Chun-An LU, Jiun-Jang YU
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Patent number: 11862868Abstract: The disclosure provides a multi-feed antenna including a first conductor layer, a second conductor layer, four supporting conductor structures and four feeding conductor lines. The second conductor layer has a first center position and is spaced apart from the first conductor layer at a first interval. The four electrically connected sections respectively extend from different side edges of the second conductor layer toward the first center position, so that the second conductor layer forms four mutually connected radiating conductor plates. The four feeding conductor lines are all located between the first conductor layer and the second conductor layer. The four feeding conductor lines and the four supporting conductor structures form an interleaved annular arrangement. The four feeding conductor lines excite the second conductor layer to generate at least four resonant modes. The at least four resonant modes cover at least one identical first communication band.Type: GrantFiled: December 20, 2021Date of Patent: January 2, 2024Assignee: Industrial Technology Research InstituteInventors: Kin-Lu Wong, Wei-Yu Li, Wei Chung
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Publication number: 20230198148Abstract: The disclosure provides a multi-feed antenna including a first conductor layer, a second conductor layer, four supporting conductor structures and four feeding conductor lines. The second conductor layer has a first center position and is spaced apart from the first conductor layer at a first interval. The four supporting conductor structures respectively electrically connect the first conductor layer and the second conductor layer and form four electrically connected sections at the second conductor layer. The four electrically connected sections respectively extend from different side edges of the second conductor layer toward the first center position, so that the second conductor layer forms four mutually connected radiating conductor plates. The four feeding conductor lines are all located between the first conductor layer and the second conductor layer. The four feeding conductor lines and the four supporting conductor structures form an interleaved annular arrangement.Type: ApplicationFiled: December 20, 2021Publication date: June 22, 2023Applicant: Industrial Technology Research InstituteInventors: Kin-Lu Wong, Wei-Yu Li, Wei Chung
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Publication number: 20230187829Abstract: The disclosure provides an integrated wideband antenna, comprising a first conductor layer, a first conductor patch, a second conductor patch, a feeding conductor structure and a signal source. The first conductor patch has a first coupling edge and a first connecting edge. The first connecting edge electrically connects with the first conductor layer through a first shorting structure. The second conductor patch has a second coupling edge and a second connecting edge. The second connecting edge electrically connects with the first conductor layer through a second shorting structure. The second coupling edge is spaced apart from the first coupling edge at a third interval forming a resonant open slot. The feeding conductor structure is located within the resonant open slot and has a first conductor line, a second conductor line and a third conductor line. The first conductor line is spaced apart from the first coupling edge with a first coupling interval.Type: ApplicationFiled: December 15, 2021Publication date: June 15, 2023Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kin-Lu WONG, Wei-Yu LI, Wei CHUNG
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Patent number: 11664595Abstract: The disclosure provides an integrated wideband antenna, comprising a first conductor layer, a first conductor patch, a second conductor patch, a feeding conductor structure and a signal source. The first conductor patch has a first coupling edge and a first connecting edge. The first connecting edge electrically connects with the first conductor layer through a first shorting structure. The second conductor patch has a second coupling edge and a second connecting edge. The second connecting edge electrically connects with the first conductor layer through a second shorting structure. The second coupling edge is spaced apart from the first coupling edge at a third interval forming a resonant open slot. The feeding conductor structure is located within the resonant open slot and has a first conductor line, a second conductor line and a third conductor line. The first conductor line is spaced apart from the first coupling edge with a first coupling interval.Type: GrantFiled: December 15, 2021Date of Patent: May 30, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kin-Lu Wong, Wei-Yu Li, Wei Chung
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Patent number: 11569585Abstract: A highly integrated pattern-variable multi-antenna array, including a ground conductor structure, a first antenna array, a second antenna array, and an array conjoined grounding structure, is provided. A first inverted L-shaped resonant structure has a first feeding point, and the others respectively have a first switch and are electrically connected or coupled to the ground conductor structure. A second inverted L-shaped resonant structure has a second feeding point, and the others respectively have a second switch and are electrically connected or coupled to the ground conductor structure. The first and second antenna arrays respectively generate first and second resonance modes. The second and first resonance modes cover at least one same first communication frequency band.Type: GrantFiled: December 30, 2020Date of Patent: January 31, 2023Assignee: Industrial Technology Research InstituteInventors: Wei-Yu Li, Wei Chung, Kin-Lu Wong
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Publication number: 20220359980Abstract: A transparent antenna includes a substrate, an antenna grid layer, and a ground grid layer. The substrate has an electrically conductive hole extending from two opposite surfaced of the substrate. The antenna grid layer is formed on a surface of the substrate. The antenna grid layer includes a feeding portion and a transmission portion. The ground grid layer is formed on another surface of the substrate. The ground grid layer is coupled to the feeding portion of the antenna grid layer via the electrically conductive hole. An offset distance between a projection of a gridline of the antenna grid layer on the first surface and a projection of a gridline of the ground grid layer on the first surface is smaller than or equal to half of a difference between a line width of the antenna grid layer and a line width of the ground grid layer.Type: ApplicationFiled: August 23, 2021Publication date: November 10, 2022Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Shih-Ming LIN, Wei CHUNG, Chen-Chun YU, Hsin-Chu CHEN, Wei-Yu LI
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Publication number: 20220209420Abstract: A highly integrated pattern-variable multi-antenna array, including a ground conductor structure, a first antenna array, a second antenna array, and an array conjoined grounding structure, is provided. A first inverted L-shaped resonant structure has a first feeding point, and the others respectively have a first switch and are electrically connected or coupled to the ground conductor structure. A second inverted L-shaped resonant structure has a second feeding point, and the others respectively have a second switch and are electrically connected or coupled to the ground conductor structure. The first and second antenna arrays respectively generate first and second resonance modes. The second and first resonance modes cover at least one same first communication frequency band.Type: ApplicationFiled: December 30, 2020Publication date: June 30, 2022Applicant: Industrial Technology Research InstituteInventors: Wei-Yu Li, Wei Chung, Kin-Lu Wong
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Patent number: 11276942Abstract: A highly-integrated multi-antenna array comprising a first conductor layer, a second conductor layer, a plurality of conjoined conducting structures, a plurality of slot antennas, and a conjoined slot structure is provided. The first conductor layer and the second conductor layer are spaced apart by a first interval, and are electrically connected by the conjoined conducting structures. Each slot antenna has a radiating slot structure and a signal coupling line, which partially overlap or cross each other. All radiating slot structures are formed at the second conductor layer. Each signal coupling line is spaced apart from the second conductor layer by a coupling interval and has a signal feeding point. Each slot antenna is excited to generate at least one resonant mode covering at least one identical first communication band. The conjoined slot structure is formed at the second conductor layer and connects with all radiating slot structures.Type: GrantFiled: December 27, 2019Date of Patent: March 15, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kin-Lu Wong, Wei-Yu Li, Wei Chung
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Publication number: 20210203080Abstract: A highly-integrated multi-antenna array comprising a first conductor layer, a second conductor layer, a plurality of conjoined conducting structures, a plurality of slot antennas, and a conjoined slot structure is provided. The first conductor layer and the second conductor layer are spaced apart by a first interval, and are electrically connected by the conjoined conducting structures. Each slot antenna has a radiating slot structure and a signal coupling line, which partially overlap or cross each other. All radiating slot structures are formed at the second conductor layer. Each signal coupling line is spaced apart from the second conductor layer by a coupling interval and has a signal feeding point. Each slot antenna is excited to generate at least one resonant mode covering at least one identical first communication band. The conjoined slot structure is formed at the second conductor layer and connects with all radiating slot structures.Type: ApplicationFiled: December 27, 2019Publication date: July 1, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kin-Lu WONG, Wei-Yu LI, Wei CHUNG
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Publication number: 20200212572Abstract: Provided is a hybrid multi-band antenna array, including: a multilayer substrate board including a ground conductor structure having a first edge; a first antenna array including a plurality of folded loop antennas, all of which being integrated with the multilayer substrate board and arranged along the first edge sequentially, wherein the first antenna array is excited to generate a first resonant mode covering at least one first communication band; and a second antenna array including a plurality of parallel-connected slot antennas, all of which being integrated with the multilayer substrate board and arranged along the first edge sequentially, wherein the second antenna array is excited to generate a second resonant mode covering at least one second communication band, and a frequency of the second resonant mode is lower than a frequency of the first resonant mode.Type: ApplicationFiled: December 28, 2018Publication date: July 2, 2020Inventors: Wei-Yu Li, Wei Chung, Kin-Lu Wong
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Patent number: 10680332Abstract: Provided is a hybrid multi-band antenna array, including: a multilayer substrate board including a ground conductor structure having a first edge; a first antenna array including a plurality of folded loop antennas, all of which being integrated with the multilayer substrate board and arranged along the first edge sequentially, wherein the first antenna array is excited to generate a first resonant mode covering at least one first communication band; and a second antenna array including a plurality of parallel-connected slot antennas, all of which being integrated with the multilayer substrate board and arranged along the first edge sequentially, wherein the second antenna array is excited to generate a second resonant mode covering at least one second communication band, and a frequency of the second resonant mode is lower than a frequency of the first resonant mode.Type: GrantFiled: December 28, 2018Date of Patent: June 9, 2020Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wei-Yu Li, Wei Chung, Kin-Lu Wong
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Patent number: 10020569Abstract: A laminated antenna structure includes a substrate, a first conductive circuit layer, an insulating colloidal layer, a second conductive circuit layer and a conductive structure. The first conductive circuit layer is disposed on or above the substrate, the second conductive circuit layer is disposed above the first conductive circuit layer, and the insulating colloidal layer is disposed between the first and the second conductive circuit layers. The first conductive circuit layer, the insulating colloidal layer and the second conductive circuit layer form a laminated capacitive structure. The conductive structure is electrically connected to a signal source on the substrate, and the signal source is electrically connected to at least one of the first conductive circuit layer and the second conductive circuit layer. The insulating colloidal layer contains catalyzers.Type: GrantFiled: December 30, 2015Date of Patent: July 10, 2018Assignee: Industrial Technology Research InstituteInventors: Meng-Chi Huang, Tune-Hune Kao, Wei-Yu Li, Wei Chung, Wen-Hua Zhang
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Publication number: 20170162936Abstract: A laminated antenna structure includes a substrate, a first conductive circuit layer, an insulating colloidal layer, a second conductive circuit layer and a conductive structure. The first conductive circuit layer is disposed on or above the substrate, the second conductive circuit layer is disposed above the first conductive circuit layer, and the insulating colloidal layer is disposed between the first and the second conductive circuit layers. The first conductive circuit layer, the insulating colloidal layer and the second conductive circuit layer form a laminated capacitive structure. The conductive structure is electrically connected to a signal source on the substrate, and the signal source is electrically connected to at least one of the first conductive circuit layer and the second conductive circuit layer. The insulating colloidal layer contains catalyzers.Type: ApplicationFiled: December 30, 2015Publication date: June 8, 2017Inventors: Meng-Chi Huang, Tune-Hune Kao, Wei-Yu Li, Wei Chung, Wen-Hua Zhang