Patents by Inventor Wei-Chung Lai

Wei-Chung Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170299
    Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Inventors: KUN-JU LI, ANG CHAN, HSIN-JUNG LIU, WEI-XIN GAO, JHIH-YUAN CHEN, CHUN-HAN CHEN, ZONG-SIAN WU, CHAU-CHUNG HOU, I-MING LAI, FU-SHOU TSAI
  • Patent number: 11923205
    Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: March 5, 2024
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: Kun-Ju Li, Ang Chan, Hsin-Jung Liu, Wei-Xin Gao, Jhih-Yuan Chen, Chun-Han Chen, Zong-Sian Wu, Chau-Chung Hou, I-Ming Lai, Fu-Shou Tsai
  • Publication number: 20220192999
    Abstract: Disclosed herein is a novel use of a gold nanocluster for treating hypercholesterolemia or hypercholesterolemia-associated diseases, for example, atherosclerosis. According to embodiments of the present disclosure, the gold nanocluster has a particle size ranging from about 1 to 10 nm, and consists of, a gold nanocluster formed by a plurality of gold nanoparticles, and a plurality of DHLAs coated on the gold nanocluster.
    Type: Application
    Filed: May 7, 2019
    Publication date: June 23, 2022
    Applicants: GoldRed NanoBiotech CO., LTD.
    Inventors: Hung-I YEH, Yi-Nan LEE, Hong-Shong CHANG, Kuan-Jung LI, Wei-Chung LAI, Hsueh-Hsiao WANG
  • Publication number: 20220062169
    Abstract: Disclosed herein are an ocular lens and a pharmaceutical composition. The ocular lens of the present disclosure is characterized in having a dihydrolipoic acid (DHLA) coated gold nanoclusters absorbed thereon. The pharmaceutical composition of the present disclosure comprises a DHLA coated gold nanocluster, and a pharmaceutically acceptable excipient. According to some embodiments of the present disclosure, the DHLA coated gold nanoclusters are capable of reducing intracellular ROS levels, promoting tissue repair, and inhibiting pathological angiogenesis. Accordingly, also disclosed herein are methods of treating ocular conditions by uses of the present contact lens or pharmaceutical composition.
    Type: Application
    Filed: January 17, 2020
    Publication date: March 3, 2022
    Applicant: GoldRed Nanobiotech CO., LTD.
    Inventors: Hong-Shong CHANG, Yun-Yu CHEN, Wei-Chung LAI, Juin-Hong CHERNG, Kuan-Jung LI
  • Publication number: 20200086264
    Abstract: A method for enhancing anti-oxidation activity of a solution containing gold nanoclusters binding with ligands and its making process are disclosed, The method for enhancing anti-oxidation activity of a solution containing gold nanoclusters binding with ligands comprises: Treat a solution containing gold nanoclusters binding with ligands by UV light, and a wavelength range of the UV light is 300˜400 nm.
    Type: Application
    Filed: November 20, 2019
    Publication date: March 19, 2020
    Inventors: Hong Shong Chang, Cheng-An Lin, Zih-Yun Huang, Yun-Yu Chen, Kuan-Jung Li, Juin-Hong Cherng, Wei-Chung Lai