Abstract: A method of forming a semiconductor structure is provided, and includes trimming a first substrate to form a recess on a sidewall of the first substrate. A conductive structure is formed in the first substrate. The method includes bonding the first substrate to a carrier. The method includes thinning down the first substrate. The method also includes forming a dielectric material in the recess and over a top surface of the thinned first substrate. The method further includes performing a planarization process to remove the dielectric material and expose the conductive structure over the top surface. In addition, the method includes removing the carrier from the first substrate.

Abstract: An integrated circuit device includes a gate stack disposed over a substrate. A first L-shaped spacer is disposed along a first sidewall of the gate stack and a second L-shaped spacer is disposed along a second sidewall of the gate stack. The first L-shaped spacer and the second L-shaped spacer include silicon and carbon. A first source/drain epitaxy region and a second source/drain epitaxy region are disposed over the substrate. The gate stack is disposed between the first source/drain epitaxy region and the second source/drain epitaxy region. An interlevel dielectric (ILD) layer disposed over the substrate. The ILD layer is disposed between the first source/drain epitaxy region and a portion of the first L-shaped spacer disposed along the first sidewall of the gate stack and between the second source/drain epitaxy region and a portion of the second L-shaped spacer disposed along the second sidewall of the gate stack.

Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.

Abstract: A method for fabricating a semiconductor device includes the steps of: providing a substrate, wherein the substrate comprises a MRAM region and a logic region; forming a magnetic tunneling junction (MTJ) on the MRAM region; forming a top electrode on the MTJ; and then performing a flowable chemical vapor deposition (FCVD) process to form a first inter-metal dielectric (IMD) layer around the top electrode and the MTJ.

Abstract: A power supply system includes an output terminal, a power supply control chip, a power supply switch and a detection device. The power supply control chip is configured to adjust the amount of an input power providing to an electronic device by the power supply device. The power supply switch is configured to control the connection between the power supply device and the power supply control chip. The detection device is configured to detect whether the power supply control chip operates normally. When the power supply control chip operates abnormally, the detection device controls the connection between the power supply device and the power supply control chip through the power supply switch for restarting the power supply control chip. The power supply control chip, the power supply switch and the detection device are disposed in an enclosed space.

Abstract: A connector is provided for tensioning a guy line and connecting the guy line to a ground anchor or a tower. The connector may include a first body and a second body connected together by two or more threaded rods. The first body is connected to the ground anchor or the tower. The second body has a tapered cavity extending therethrough. The guy line extends through the tapered cavity, and wedges with a first and second inner arcuate surface that are vertically offset from one another are pushed into the tapered cavity. The first arcuate inner surface and the second arcuate inner surface may grip the guy line after the wedges have been pushed into the tapered cavity, while the vertical offsetting of the second arcuate inner surface reduces that stress on the guy line at an end of wedges. The first and second bodies may be drawn toward each other to tension the guy line.

Abstract: A method for manufacturing micro LED panel and micro LED panel thereof is disclosed. The method includes defining a plurality of pixel regions on an optical element carrier; providing a first solder portion, or a first solder portion, a second solder portion and a third solder portion in each pixel region; selecting a plurality of process substrates and defining a process area on each process substrate; setting a first process mode, a second process mode and a third process mode, and determining the number of process substrates in the first process mode, the second process mode and the third process mode according to the number of units; then the process area of the process substrate will form a plurality of first micro light emitting chips corresponding to the position of the first soldering portion.

Abstract: A method for manufacturing micro LED panel and micro LED panel thereof is disclosed. The method includes defining a plurality of pixel regions on an optical element carrier; providing a first solder portion, or a first solder portion, a second solder portion and a third solder portion in each pixel region; selecting a plurality of process substrates and defining a process area on each process substrate; setting a first process mode, a second process mode and a third process mode, and determining the number of process substrates in the first process mode, the second process mode and the third process mode according to the number of units; then the process area of the process substrate will form a plurality of first micro light emitting chips corresponding to the position of the first soldering portion.

Abstract: Disclosed are an LED light source, an LED light source manufacturing method, and their direct display device. The LED light source includes a base, at least an LED chip, an anti-vulcanization structure, a light excitation structure, an encapsulation structure and a protection structure. The LED light source can overcome catalyst poison or vulcanization of the light-emitting material effectively to improve product yield and reliability of the LED light source. In the meantime, the LED light source has the feature of a better light emission performance.

Abstract: Disclosed is a light emitting diode structure including a substrate, an LED chip and an adhesive material. The LED chip is installed on the substrate, and the adhesive material covers the LED chip to fix the LED chip. A light of the LED chip is emitted to the outside through the adhesive material to form a rectangular light pattern, so that when the light source is lit, a specific rectangular illumination light pattern is formed.

Abstract: Disclosed are an LED light source, an LED light source manufacturing method, and their direct display device. The LED light source includes a base, at least an LED chip, an anti-vulcanization structure, a light excitation structure, an encapsulation structure and a protection structure. The LED light source can overcome catalyst poison or vulcanization of the light-emitting material effectively to improve product yield and reliability of the LED light source. In the meantime, the LED light source has the feature of a better light emission performance.

Abstract: A connector is provided for tensioning a guy line and connecting the guy line to a ground anchor or a tower. The connector may include a first body and a second body connected together by two or more threaded rods. The first body is connected to the ground anchor or the tower. The second body has a tapered cavity extending therethrough. The guy line extends through the tapered cavity, and wedges with a first and second inner arcuate surface that are vertically offset from one another are pushed into the tapered cavity. The first arcuate inner surface and the second arcuate inner surface may grip the guy line after the wedges have been pushed into the tapered cavity, while the vertical offsetting of the second arcuate inner surface reduces that stress on the guy line at an end of wedges. The first and second bodies may be drawn toward each other to tension the guy line.

Abstract: Disclosed are an LED light source, an LED light source manufacturing method, and their direct display device. The LED light source includes a base, at least an LED chip, an anti-vulcanization structure, a light excitation structure, an encapsulation structure and a protection structure. The LED light source can overcome catalyst poison or vulcanization of the light-emitting material effectively to improve product yield and reliability of the LED light source. In the meantime, the LED light source has the feature of a better light emission performance.

Abstract: Disclosed are an LED light source, an LED light source manufacturing method, and their direct display device. The LED light source includes a base, at least an LED chip, an anti-vulcanization structure, a light excitation structure, an encapsulation structure and a protection structure. The LED light source can overcome catalyst poison or vulcanization of the light-emitting material effectively to improve product yield and reliability of the LED light source. In the meantime, the LED light source has the feature of a better light emission performance.

Abstract: Disclosed is a primary optics light source with a rectangular light pattern including a substrate, an LED chip and an encapsulated package. The LED chip is installed on the substrate, and the encapsulated package covers the LED chip to fix the LED chip. A light of the LED chip is emitted to the outside through the encapsulated package to form a rectangular light pattern, so that when the light source is lit, a specific rectangular illumination light pattern is formed.

Abstract: The present disclosure provides a fitting for a power transmission system. The fitting may include a first end configured to couple to an end of an insulator, a second end configured to couple to a power line, a collar located between the first end and the second end, and a neck located between the collar and the first end. An outer diameter of the collar may be greater than an outer diameter of the neck. A power transmission system with a fitting and corona ring assembly is also provided.

Abstract: An LED lighting device is disclosed. The LED lighting device uses a violet LED chip as a light source for exciting quantum dots. The quantum dots excited by the light of the violet LED chip are mixed with each other to form white light. So, the LED lighting device not just has the effects of providing a high luminous efficiency and preventing the blue light from damaging human eyes only, but also provides a better color rendering ability.

Abstract: The present disclosure provides a ground roller assembly for grounding electrical current induced in a conductor during installation of high power transmission lines. The ground roller assembly may include a mounting bracket having a plurality of pivot points spaced away from a mounting aperture, and an integrally formed tongue projecting outwardly away from an upper edge of the mounting bracket. A support arm may be coupled to one of the plurality of pivot points positioned proximate to a side edge of the mounting bracket.

Abstract: The present disclosure provides a fitting for a power transmission system. The fitting may include a first end configured to couple to an end of an insulator, a second end configured to couple to a power line, a collar located between the first end and the second end, and a neck located between the collar and the first end. An outer diameter of the collar may be greater than an outer diameter of the neck. A power transmission system with a fitting and corona ring assembly is also provided.

Abstract: The present disclosure provides a stringing block. The stringing block may include a sheave with a circumferential groove with a pair of opposed walls. The opposed walls may extend away from the base of the groove to a flair point at a first angle. The opposed walls may extend away from the flair point to a rim at a second angle that is less than the first angle.