Patents by Inventor Wei-Fang Wu

Wei-Fang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080295995
    Abstract: A heat sink includes a plurality of heat dissipation fins. Each of the heat dissipation fins includes a sheet body, at least one bent part, and at least one first combined part. The bent part is formed from a terminal end of the sheet body. The first combined part protrudes from the bent part along a direction opposite to the bent direction of the bent part. A manufacturing method of the heat sink is also disclosed.
    Type: Application
    Filed: April 29, 2008
    Publication date: December 4, 2008
    Inventors: Wei-Fang WU, Cheng-Chih Lee, Yu-Hung Huang, Chin-Ming Chen
  • Patent number: 7277285
    Abstract: The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: October 2, 2007
    Assignee: Delta Electronics, Inc.
    Inventors: Jung-Sung Shih, Wei-Fang Wu, Yu-Hung Huang, Chin-Ming Chen
  • Patent number: 7128134
    Abstract: A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.
    Type: Grant
    Filed: November 5, 2004
    Date of Patent: October 31, 2006
    Assignee: Delta Electronics, Inc.
    Inventors: Jung-Sung Shih, Wei-Fang Wu, Yu-Hung Huang, Chin-Ming Chen
  • Patent number: 7044195
    Abstract: A heat dissipation structure made of a heat-conductive material, comprising at least one penetration portion which penetrates therethrough. The at least one penetration portion further comprises a solid portion which is located at the center of the at least one penetration portion and provided with a penetration hole penetrating therethrough, and at least one bridge portion which surrounds the solid portion and is connected between the solid portion and the body of the heat dissipation structure.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: May 16, 2006
    Assignee: Delta Electronics, Inc.
    Inventors: Chin-ming Chen, Yu-hung Huang, Wei-fang Wu
  • Patent number: 7007746
    Abstract: The circulative cooling apparatus has a first chamber, a second chamber, a first pipe, and a second pipe. There are porous structures on internal walls of the first chamber and the second pipe. There is work fluid in the second chamber and the porous structures. The work fluid is evaporated by heat in the first chamber, and owing to the pressure drop the vapor of the work fluid moves to the second chamber through the first pipe. Then the vapor of the work fluid condenses into the work fluid in the second chamber. Afterward the work fluid is transported back to the first chamber through the second pipe using the porous structures thereof, thus forming a circulative cooling apparatus.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: March 7, 2006
    Assignee: Delta Electronics, Inc.
    Inventors: Wei-Fang Wu, Yu-Hung Huang, Chin-Ming Chen
  • Publication number: 20050225943
    Abstract: The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.
    Type: Application
    Filed: April 4, 2005
    Publication date: October 13, 2005
    Inventors: Jung-Sung Shih, Wei-Fang Wu, Yu-Hung Huang, Chin-Ming Chen
  • Publication number: 20050211419
    Abstract: A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.
    Type: Application
    Filed: November 5, 2004
    Publication date: September 29, 2005
    Inventors: Jung-Sung Shih, Wei-Fang Wu, Yu-Hung Huang, Chin-Ming Chen
  • Publication number: 20040250991
    Abstract: A heat dissipation structure made of a heat-conductive material, comprising at least one penetration portion which penetrates therethrough. The at least one penetration portion further comprises a solid portion which is located at the center of the at least one penetration portion and provided with a penetration hole penetrating therethrough, and at least one bridge portion which surrounds the solid portion and is connected between the solid portion and the body of the heat dissipation structure.
    Type: Application
    Filed: August 7, 2003
    Publication date: December 16, 2004
    Inventors: Chin-Ming Chen, Yu-Hung Huang, Wei-Fang Wu
  • Publication number: 20040244959
    Abstract: A cooling fin structure is constructed by a thermally conductive sheet bent to form a heat radiation part and a welding part. The welding part is formed with a vacant region, which is defined by notches, openings or a slot, and the thermally conductive sheet is welded to a substrate through the welding part.
    Type: Application
    Filed: May 5, 2004
    Publication date: December 9, 2004
    Inventors: Chao-Nan Chien, Long-Song Shish, Wei-Fang Wu, Chin-Ming Chen
  • Publication number: 20040163796
    Abstract: The circulative cooling apparatus has a first chamber, a second chamber, a first pipe, and a second pipe. There are porous structures on internal walls of the first chamber and the second pipe. There is work fluid in the second chamber and the porous structures. The work fluid is evaporated by heat in the first chamber, and owing to the pressure drop the vapor of the work fluid moves to the second chamber through the first pipe. Then the vapor of the work fluid condenses into the work fluid in the second chamber. Afterward the work fluid is transported back to the first chamber through the second pipe using the porous structures thereof, thus forming a circulative cooling apparatus.
    Type: Application
    Filed: July 18, 2003
    Publication date: August 26, 2004
    Inventors: Wei-Fang Wu, Yu-Hung Huang, Chin-Ming Chen
  • Patent number: 6729385
    Abstract: A fin structure is disclosed. The fin structure includes a first concavo-convex portion formed with a concave on a first surface of the fin in the direction of thickness and a corresponding convex on a second surface of the fin in the direction of thickness. Besides, a second concavo-convex portion formed with a first concave and second concave on the first surface of the fin in the direction of thickness and a corresponding first convex and a corresponding second convex on the second surface of the fin in the direction of thickness is included as well. Specifically, the first and second concavo-convex portions are symmetrical respect to the center of the fin. Furthermore, the second convex of the second concavo-convex portion on one fin can be exactly received by the concave of the first concavo-convex portion on another fin.
    Type: Grant
    Filed: June 13, 2003
    Date of Patent: May 4, 2004
    Assignee: Delta Electronics, Inc.
    Inventors: Wen-shi Huang, Kuo-cheng Lin, Yu-hung Huang, Wei-fang Wu