Patents by Inventor WEI-FENG HSIAO

WEI-FENG HSIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DCPD-derived polyether and method of producing the same
    Patent number: 10711103
    Abstract: A low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether and a method of producing the same are introduced. Incorporation of a phosphorus group and a DCPD derivative into a low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether enable the DCPD-derived polyether to not only serve as an epoxy resin curing agent but also cure itself such that the cured product not only features satisfactory thermal properties and low-k characteristics but is also non-flammable.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: July 14, 2020
    Assignee: NATIONAL CHUNG SAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Wen-Chiung Su, Ching-Hsuan Lin, Wei-Feng Hsiao, Han-Ya Lin
  • DCPD-DERIVED POLYETHER AND METHOD OF PRODUCING THE SAME
    Publication number: 20190048137
    Abstract: A low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether and a method of producing the same are introduced. Incorporation of a phosphorus group and a DCPD derivative into a low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether enable the DCPD-derived polyether to not only serve as an epoxy resin curing agent but also cure itself such that the cured product not only features satisfactory thermal properties and low-k characteristics but is also non-flammable.
    Type: Application
    Filed: November 30, 2017
    Publication date: February 14, 2019
    Inventors: WEN-CHIUNG SU, CHING-HSUAN LIN, WEI-FENG HSIAO, HAN-YA LIN