Patents by Inventor Wei-Feng Lin

Wei-Feng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12251081
    Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: March 18, 2025
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Wei-Ping Chen, Wei-Feng Lin, Jau-Jan Deng
  • Publication number: 20240387588
    Abstract: An image sensor package with a multi-step cavity formed in or on a substrate, which includes an image sensor bonded onto bottom of the multi-step cavity, and a cover glass placed and sealed on a lower portion of the multi-step cavity. Lower portion of the multi-step cavity includes at least a first and a second raised-step structures protruding from the bottom of the multi-step cavity, and the cover glass is placed and sealed over the first raised-step structure.
    Type: Application
    Filed: May 19, 2023
    Publication date: November 21, 2024
    Inventors: Wei-Feng Lin, Chi-Chih Huang, En-Chi Li
  • Publication number: 20240355846
    Abstract: A curved-surface image-sensor assembly has a porous carrier having a concave surface with a thinned image sensor bonded by an adhesive to its concave surface of the porous carrier; the porous carrier is mounted into a water-resistant package. The sensor assembly is made by fabricating a thinned, flexible, image-sensor integrated circuit (IC) and applying adhesive to a non-illuminated side of the IC; positioning the IC over a concave surface of a porous carrier; applying vacuum through the porous carrier to suck the IC onto the concave surface of the porous carrier; and curing the adhesive to bond the IC to the concave surface of the porous carrier.
    Type: Application
    Filed: June 24, 2024
    Publication date: October 24, 2024
    Inventors: Chun-Sheng FAN, Wei-Feng LIN
  • Patent number: 12064090
    Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: August 20, 2024
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Wei-Ping Chen, Jau-Jan Deng, Wei-Feng Lin, Chun-Sheng Fan
  • Patent number: 12062673
    Abstract: A curved-surface image-sensor assembly has a porous carrier having a concave surface with a thinned image sensor bonded by an adhesive to its concave surface of the porous carrier; the porous carrier is mounted into a water-resistant package. The sensor assembly is made by fabricating a thinned, flexible, image-sensor integrated circuit (IC) and applying adhesive to a non-illuminated side of the IC; positioning the IC over a concave surface of a porous carrier; applying vacuum through the porous carrier to suck the IC onto the concave surface of the porous carrier; and curing the adhesive to bond the IC to the concave surface of the porous carrier.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: August 13, 2024
    Assignee: OmniVision Technologies, Inc.
    Inventors: Chun-Sheng Fan, Wei-Feng Lin
  • Patent number: 11973098
    Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: April 30, 2024
    Assignee: OmniVision Technologies, Inc.
    Inventors: Wei-Feng Lin, En-Chi Li, Chi-Chih Huang
  • Patent number: 11943525
    Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: March 26, 2024
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Wei-Ping Chen, Jau-Jan Deng, Wei-Feng Lin
  • Publication number: 20230262310
    Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 17, 2023
    Inventors: Teng-Sheng CHEN, Wei-Ping CHEN, Jau-Jan DENG, Wei-Feng LIN
  • Publication number: 20230136491
    Abstract: A curved-surface image-sensor assembly has a porous carrier having a concave surface with a thinned image sensor bonded by an adhesive to its concave surface of the porous carrier; the porous carrier is mounted into a water-resistant package. The sensor assembly is made by fabricating a thinned, flexible, image-sensor integrated circuit (IC) and applying adhesive to a non-illuminated side of the IC; positioning the IC over a concave surface of a porous carrier; applying vacuum through the porous carrier to suck the IC onto the concave surface of the porous carrier; and curing the adhesive to bond the IC to the concave surface of the porous carrier.
    Type: Application
    Filed: November 2, 2021
    Publication date: May 4, 2023
    Inventors: Chun-Sheng FAN, Wei-Feng LIN
  • Publication number: 20230122722
    Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
    Type: Application
    Filed: October 18, 2021
    Publication date: April 20, 2023
    Inventors: Teng-Sheng CHEN, Wei-Ping CHEN, Jau-Jan DENG, Wei-Feng LIN, Chun-Sheng FAN
  • Publication number: 20230118866
    Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
    Type: Application
    Filed: May 18, 2022
    Publication date: April 20, 2023
    Inventors: Teng-Sheng CHEN, Wei-Ping CHEN, Wei-Feng LIN, Jau-Jan DENG
  • Patent number: 11626434
    Abstract: A method of image sensor package fabrication includes forming a recess in a transparent substrate, depositing conductive traces in the recess, inserting an image sensor in the recess so that the image sensor is positioned in the recess to receive light through the transparent substrate, and inserting a circuit board in the recess so that the image sensor is positioned between the transparent substrate and the circuit board.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: April 11, 2023
    Assignee: OMNIVISION TECHNOLOGIES, INC.
    Inventors: Wei-Feng Lin, Ying-Chih Kuo, Ying Chung
  • Publication number: 20230076598
    Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.
    Type: Application
    Filed: October 26, 2022
    Publication date: March 9, 2023
    Applicant: OmniVision Technologies, Inc.
    Inventors: Wei-Feng Lin, En-Chi Li, Chi-Chih Huang
  • Patent number: 11583171
    Abstract: A surface-mount device platform includes a surface-mounting region, a connection region, and a bendable region therebetween, each including a respective part of a base substrate. The base substrate includes electrically-conductive layers interspersed with electrically-insulating build-up layers. Each of the surface-mounting region, the connection region, and the bendable region spans between a bottom substrate-surface and a top substrate-surface of the base substrate. The surface-mounting region further includes an electrically-insulating first top rigid-layer, and device bond-pads exposed on a top surface of the first top rigid-layer facing away from the top substrate-surface in the surface-mounting region.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: February 21, 2023
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Chien-Chan Yeh, Cheng-Fang Chiu, Wei-Feng Lin
  • Patent number: 11562928
    Abstract: A chip comprises a semiconductor substrate having a first side and a second side opposite to the first side, a plurality of conductive metal patterns formed on the first side of the semiconductor substrate, a plurality of solder balls formed on the first side of the semiconductor substrate, and at least one code pattern formed using laser marking on the first side of the semiconductor substrate in a space free from the plurality of conductive metal patterns and the plurality of solder balls, wherein the at least one code pattern is visible from a backside of the chip, the at least one code pattern represents a binary number having four bits; and the binary number represents a decimal number to represent a tracing number of the chip.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: January 24, 2023
    Assignee: OmniVision Technologies, Inc.
    Inventors: Wei-Feng Lin, Chi-Chih Huang
  • Patent number: 11520197
    Abstract: An active-pixel device assembly with stray-light reduction includes an active-pixel device including a semiconductor substrate and an array of active pixels, a light-transmissive substrate disposed on a light-receiving side of the active-pixel device, and a rough opaque coating disposed on a first surface of the light-transmissive substrate and forming an aperture aligned with the array of active pixels, wherein the rough opaque coating is rough so as to suppress reflection of light incident thereon from at least one side. A method for manufacturing a stray-light-reducing coating for an active-pixel device assembly includes depositing an opaque coating on a light-transmissive substrate such that the opaque coating forms a light-transmissive aperture, and roughening the opaque coating to form a rough opaque coating, said roughening including treating the opaque coating with an alkaline solution.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: December 6, 2022
    Assignee: OmniVision Technologies, Inc.
    Inventors: Chun-Sheng Fan, Wei-Feng Lin
  • Patent number: 11515347
    Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: November 29, 2022
    Assignee: OmniVision Technologies, Inc.
    Inventors: Wei-Feng Lin, En-Chi Li, Chi-Chih Huang
  • Patent number: 11404844
    Abstract: A semiconductor structure is provided. The semiconductor structure includes: a substrate having a cavity recessed from a top surface of the substrate toward a bottom surface of the substrate opposite to the top surface, wherein the cavity has a sidewall and a bottom surface, and the bottom surface of the cavity is substantially parallel to the top surface of the substrate; a light source structure in the cavity, and the light source structure emitting a light from a sidewall of the light source structure; and a diffractive optical element (DOE) over the top surface of the substrate; wherein the sidewall of the cavity is a sloped surface, so that when the light is incident on the sidewall, the sloped surface reflects the incident light to generate a reflected light toward the DOE. Associated semiconductor structure and manufacturing method are also disclosed.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: August 2, 2022
    Assignee: OMNIVISION TECHNOLOGIES, INC.
    Inventors: Chun-Sheng Fan, Wei-Feng Lin
  • Patent number: 11320663
    Abstract: A diffractive optical element (DOE) comprises a first part comprising a first transparent non-conductive base and a first transparent conductive layer disposed on the first transparent non-conductive base and a second part comprising a second transparent non-conductive base and a second transparent conductive layer disposed on the second transparent non-conductive base. The first transparent conductive layer and the second transparent conductive layer have periodical patterns of thickness for diffracting light. Spacers separate the first part and the second part. The first part and the second part are positioned such that the first transparent conductive layer is facing the second transparent conductive layer. A first end of the first transparent conductive layer is electrically connected to a first terminal of a capacitance monitor, and a second end of the second transparent conductive layer is electrically connected to a second terminal of the capacitance monitor.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: May 3, 2022
    Assignee: Omni Vision Technologies, Inc.
    Inventors: Chun-Sheng Fan, Wei-Feng Lin
  • Publication number: 20220077210
    Abstract: A method of image sensor package fabrication includes forming a recess in a transparent substrate, depositing conductive traces in the recess, inserting an image sensor in the recess so that the image sensor is positioned in the recess to receive light through the transparent substrate, and inserting a circuit board in the recess so that the image sensor is positioned between the transparent substrate and the circuit board.
    Type: Application
    Filed: November 18, 2021
    Publication date: March 10, 2022
    Inventors: Wei-Feng Lin, Ying-Chih Kuo, Ying Chung