Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.

Abstract: An overhead hoist transfer apparatus includes a rail assembly including a straight rail having an empty section, and a curved rail having a curved empty section; an engine including a first LSD having first and second wheels at two sides respectively; and a second LSD having third and fourth wheels at two sides respectively; a moving carriage driven by the engine and suspended from the rail assembly; first and second guide wheels disposed on the first LSD; third and fourth guide wheels disposed on the second LSD; and two guide boards disposed above a joining point of the straight rail and the curved rail. An elevation of the guide boards is equal to that of the guide wheels. The guide board includes a straight edge and a curved edge.

Abstract: A semiconductor device includes a first semiconductor die and a second semiconductor die connected to the first semiconductor die. Each of the first semiconductor die and the second semiconductor die includes a substrate, a conductive bump formed on the substrate and a conductive contact formed on the conductive bump. The conductive contact has an outer lateral sidewall, there is an inner acute angle included between the outer lateral sidewall and the substrate is smaller than 85°, and the conductive contact of the first semiconductor die is connected opposite to the conductive contact of the second semiconductor die.

Abstract: A powered industrial truck includes a lateral movement assembly including four sliding members and four pivotal members both on a wheeled carriage, four links having a first end pivotably secured to the sliding member and a second end pivotably secured to either end of the pivotal member, a motor shaft having two ends pivotably secured to the pivotal members respectively, a first electric motor on one frame member, and four mounts attached to the sliding members respectively; two lift assemblies including a second electric motor, a shaft having two ends rotatably secured to the sliding members respectively, two gear trains at the ends of the shaft respectively, a first gear connected to the second electric motor, a second gear on the shaft, and a first roller chain on the first and second gears; two electric attachments on the platform and being laterally moveable, each attachment. The mount has rollers.

Abstract: An impeller is provided, including a metal housing, a shaft, and a plastic member. The metal housing has a shaft mounting hole. The inner surface of the shaft mounting hole includes three or more contact points, and the contact points are closer to the shaft than other portions of the inner surface of the shaft mounting hole. The shaft passes through the shaft mounting hole and is affixed by the contact points. The metal housing divides the shaft into an upper section, a middle section, and a lower section. The plastic member passes through the shaft mounting hole and is in contact with the middle section.

Abstract: A liquid-cooled cooling structure includes a cooling main body having a condensation chamber and an evaporation chamber arranged vertically therein; a separation member arranged between and separating the condensation chamber and the evaporation chamber, and having a first through hole and a second through hole communicating with the condensation chamber and the evaporation chamber, a dimension of the first through hole being greater than that of the second through hole; a longitudinal partition board received in the condensation chamber and arranged between the first through hole and the second through hole and separating the condensation chamber into a first channel and a second channel; cooling fins extended from an outer perimeter of the cooling main body.

Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: The disclosure provides a light-emitting element inspection device optically connected to at least one light-emitting element of a test object and including a dark box, a slide rail, an image-capturing device, a light-entrance plate, and a processor. The slide rail and the image-capturing device are disposed in the dark box. The image-capturing device slides on the slide rail. The light-entrance plate is disposed on one side of the dark box and has at least one hole optically connected to the light-emitting element. The image-capturing device is aligned with the light-entrance plate to capture an image of the light-entrance plate. The processor is coupled to the image-capturing device and is adapted to obtain a set of RGB values of the image, convert the RGB values into a set of HSV values, and determine whether the light-emitting element of the test object conforms to a standard based on the HSV values.

Abstract: Disclosed herein are carbon doped tin disulphide (C—SnS2) and other SnS2 composites as visible light photocatalyst for CO2 reduction to solar fuels. The in situ carbon doped SnS2 photocatalyst provide higher efficiency than the undoped pure SnS2. Also disclosed herein are methods for preparing the catalysts.

Abstract: Compositions that can be used in producing electrodes (e.g., battery electrodes) and related methods are disclosed. As one example, a composition, includes carbonaceous particles; a dispersant; a polymer comprising a maleic anhydride moiety; and a solvent. The carbonaceous particles can include carbon black, graphite, acetylene black, graphenes, graphenes-related materials, carbon nanotubes, carbon nanostructures, activated carbons, carbon aerogels, templated carbons, and/or carbon fibers.

Abstract: Disclosed herein are carbon doped tin disulphide (C—SnS2) and other SnS2 composites as visible light photocatalyst for CO2 reduction to solar fuels. The in situ carbon doped SnS2 photocatalyst provide higher efficiency than the undoped pure SnS2. Also disclosed herein are methods for preparing the catalysts.

Abstract: A thermo tea maker includes a tea cup and a tea infuser. The exterior of the tea cup has a first isolation gap in a vacuum state to block the heat conduction from an inner part to an outer part of the cup part. The exterior of the tea infuser has a second isolation gap in a vacuum state to block the heat conduction from an inner segment to an outer segment of the tea infuser. The tea cup and the tea infuser are able to keep the tea warm. When the tea infuser is turned, the tea infuser will not scald the user's hand.

Abstract: A catalytic composition from earth-abundant transition metal salts and biomass is disclosed. A calcined catalytic composition formed from soybean powder and ammonium molybdate is specifically exemplified herein. Methods for making the catalytic composition are disclosed as are electrodes for hydrogen evolution reactions comprising the catalytic composition.

Abstract: A rotary tea maker includes a tea cup and a tea infuser. After the tea is brewed in a tea brewing room of the tea infuser, through rotation of the tea infuser, the tea is discharged from the tea brewing room to be stored in a tea room of the tea cup for use. The tea in the tea brewing room flows to a passage from a water outlet of the tea infuser and then enters the tea room from a through hole of the tea cup. During the process, the air in the tea room is expelled to the passage from the through hole when the tea is poured and then flows to the tea brewing room through an air hole of an air pipe of the tea infuser, so that the tea in the tea brewing room can be discharged to the tea room smoothly.

Abstract: A catalytic composition from earth-abundant transition metal salts and biomass is disclosed. A calcined catalytic composition formed from soybean powder and ammonium molybdate is specifically exemplified herein. Methods for making the catalytic composition are disclosed as are electrodes for hydrogen evolution reactions comprising the catalytic composition.

Abstract: A container for storing food is provided with a receptacle including a bellows, a top opening, and external threads around the opening; and a lid including a skirt including internal threads secured to the external threads, a top bossed hole communicating with the bellows, and a top frame having an n-shaped section, the frame including an inner slot; an inlet valve in the bossed hole; a trigger assembly including a spring loaded piston in the frame, and a trigger formed with the piston; a sealing ring secured to an end of the piston distal the trigger; a cylinder for receipt of the sealing ring and a portion of the piston, an inlet port fitted on the bossed hole, and an outlet valve at an end distal the sealing ring; and a cover including a peripheral opening for receipt of the trigger.

Abstract: An image processing method for processing an input image is provided. The image processing method includes: performing a plurality of first imaging processing operations on the input image to generate a first image; and performing a plurality of second imaging processing operations on the first image. Each of the first imaging processing operations is along a first direction, and the plurality of first imaging processing operations include a first scaling operation for increasing resolution. Each of the second imaging processing operations is along a second direction different from the first direction, and the plurality of second imaging processing operations include a second scaling operation for increasing resolution.

Abstract: The present invention provides molybdenum and tungsten nanostructures, for example, nanosheets and nanoparticles, and methods of making and using same, including using such nanostructures as catalysts for hydrogen evolution reactions.

Abstract: The present invention provides molybdenum and tungsten nanostructures, for example, nanosheets and nanoparticles, and methods of making and using same, including using such nanostructures as catlysts for hydrogen evolution reactions.