Patents by Inventor Wei-Fu Lin

Wei-Fu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163768
    Abstract: A packet transmission method is provided. The packet transmission method may be applied to an apparatus. The packet transmission method may include the following steps. A path engine circuit of the apparatus may receive a packet from a modem circuit of the apparatus or from a Wi-Fi chip of the apparatus. Then, the path engine circuit may transmit the packet from the modem circuit to the Wi-Fi chip, or transmit the packet from the Wi-Fi chip to the modem circuit or a central processing unit (CPU) of the apparatus.
    Type: Application
    Filed: November 8, 2023
    Publication date: May 16, 2024
    Inventors: Yen-Hsiung TSENG, Wei-Wen LIN, Chi-Fu KOH, Jyh-Ding HU, Hui-Ping TSENG
  • Patent number: 11978740
    Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Harry-Hak-Lay Chuang, Kuo-Ching Huang, Wei-Cheng Wu, Hsin Fu Lin, Henry Wang, Chien Hung Liu, Tsung-Hao Yeh, Hsien Jung Chen
  • Patent number: 11972363
    Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for obtaining a plurality of model representations of predictive models, each model representation associated with a respective user and expresses a respective predictive model, and selecting a model implementation for each of the model representations based on one or more system usage properties associated with the user associated with the corresponding model representation.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: April 30, 2024
    Assignee: Google LLC
    Inventors: Wei-Hao Lin, Travis H. K. Green, Robert Kaplow, Gang Fu, Gideon S. Mann
  • Patent number: 11967563
    Abstract: A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen
  • Publication number: 20240128139
    Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate along a predetermined direction for being electrically coupled to each other, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer is formed with at least one type of a buffering cavity, wave-shaped slots, and rectangular slots, which penetrate therethrough along the predetermined direction. The buffering cavity can be located in the adhesive layer, and any one type of the wave-shaped slots and the rectangular slots can be respectively recessed in an inner side and an outer side of the adhesive layer. A minimum width of the adhesive layer is greater than or equal to 50% of a predetermined width between the inner side and the outer side.
    Type: Application
    Filed: June 6, 2023
    Publication date: April 18, 2024
    Inventors: WEI-LI WANG, JYUN-HUEI JIANG, WEN-FU YU, BAE-YINN HWANG, CHIEN-HUNG LIN
  • Publication number: 20240128291
    Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.
    Type: Application
    Filed: June 6, 2023
    Publication date: April 18, 2024
    Inventors: CHIA-SHUAI CHANG, CHIEN-HUNG LIN, WEI-LI WANG, WEN-FU YU, BAE-YINN HWANG
  • Publication number: 20240128233
    Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.
    Type: Application
    Filed: June 6, 2023
    Publication date: April 18, 2024
    Inventors: CHIA-SHUAI CHANG, WEN-FU YU, BAE-YINN HWANG, WEI-LI WANG, CHIEN-HUNG LIN
  • Publication number: 20240083555
    Abstract: A waste collection apparatus for collecting waste in water is provided. The waste collection apparatus includes a floating device and a waste collection device coupled to the floating device. The waste collection device includes a fluid ejection element, and the flow out of the fluid ejection element flows toward a space where waste is collected.
    Type: Application
    Filed: May 12, 2023
    Publication date: March 14, 2024
    Inventors: Wei-Chun LIU, Ching-Fu WANG, Cheng-Che HO, Huan-Fu LIN
  • Publication number: 20240072115
    Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.
    Type: Application
    Filed: February 13, 2023
    Publication date: February 29, 2024
    Inventors: Wei-Xiang You, Wei-De Ho, Hsin Yang Hung, Meng-Yu Lin, Hsiang-Hung Huang, Chun-Fu Cheng, Kuan-Kan Hu, Szu-Hua Chen, Ting-Yun Wu, Wei-Cheng Tzeng, Wei-Cheng Lin, Cheng-Yin Wang, Jui-Chien Huang, Szuya Liao
  • Publication number: 20240071888
    Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.
    Type: Application
    Filed: August 28, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Chang Lin, Yen-Fu Su, Chin-Liang Chen, Wei-Yu Chen, Hsin-Yu Pan, Yu-Min Liang, Hao-Cheng Hou, Chi-Yang Yu
  • Patent number: 7161076
    Abstract: A button structure of saxophone comprising of a treble E button, a side C linking rod button and a side B linking rod button; the bottom of the treble E button and the top of the side C linking rod button oblique upward 25° from left to right, the intersection and the horizontal direction of the finger hook form an upward 25° angle; the highest curve point of the side C linking rod button and the side B linking rod button are on the ¾ of the side C linking rod button and the side B linking rod button respectively, then declines from the high points downward on both sides to the rims of both buttons; players fell the reduction of the height difference and increase the contact area while playing that offers smoother play with less errors.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: January 9, 2007
    Assignee: Chia-Chun HSU
    Inventor: Wei-Fu Lin
  • Publication number: 20060283307
    Abstract: A saxophone key primarily consisting of a connected key fine-tuning structure for a saxophone, which is used to fine-tune the gaps between two connected keys of the saxophone, the fine-tuning structure is characterized in that: the fine-tuning structure consists of a tuning screw and a felt, wherein the tuning screw is fitted within a screw hole of a key surface of a connected key, moreover, the felt is affixed to a flat portion of one end of the tuning screw, the flat portion of the tuning screw being aligned with a tail end of a connecting rod of another connected key, lo and another end of the tuning screw is provided with an tuning groove. The fine-tuning structure can quickly and conveniently fine-tune the gap between the two connected keys. Moreover, the fine-tuning structure is able to reduce noise resulting from the keys colliding when being played.
    Type: Application
    Filed: June 21, 2005
    Publication date: December 21, 2006
    Inventor: Wei-Fu Lin
  • Publication number: 20060191397
    Abstract: An Improved Button of Wind Instruments is a kind of round button, which can be used for various wind instruments, such as soprano saxophones, alto saxophones, tenor saxophones, baritone saxophones and trumpets etc.; its characteristics contain: a bulge formed taking the center of button as the vertex, and the interface falls slowly from the vertex towards peripheral edge and forms a curved surface seeing from the side; According to the abovementioned structure, it not only would be handled easily, and the adjustment of fingering and the button's height would not be required, but also would be touched easily. And its extended area can increase the control speed and sensitivity.
    Type: Application
    Filed: February 25, 2005
    Publication date: August 31, 2006
    Inventor: Wei-Fu Lin
  • Publication number: 20060180001
    Abstract: A button structure of saxophone comprising of a treble E button, a side C linking rod button and a side B linking rod button; the bottom of the treble E button and the top of the side C linking rod button oblique upward 25° from left to right, the intersection and the horizontal direction of the finger hook form an upward 25° angle; the highest curve point of the side C linking rod button and the side B linking rod button are on the ¾ of the side C linking rod button and the side B linking rod button respectively, then declines from the high points downward on both sides to the rims of both buttons; players fell the reduction of the height difference and increase the contact area while playing that offers smoother play with less errors.
    Type: Application
    Filed: February 16, 2005
    Publication date: August 17, 2006
    Inventor: Wei-Fu Lin
  • Publication number: 20060180002
    Abstract: A button structure of saxophone modifying the shapes of the G? button, the bass B button, the bass C? button and the tongue shape Bb button; in order to match up the curve of the long round bar above the tongue shape Bb button, the centers of the surface of the G? button, the bass B button and the bass C? button are made to be the highest point then descend smoothly to the rim in curve shape; based on above description, the surfaces of these buttons are in curve shape to increase the contact area between finger and buttons, reduce the level and distant difference, and offers better performance to the players, the outlook of buttons are more harmonious with the whole saxophone.
    Type: Application
    Filed: February 16, 2005
    Publication date: August 17, 2006
    Inventor: Wei-Fu Lin
  • Patent number: 6977331
    Abstract: The present invention relates to a mouth-tube assembled to a tip of a saxophone wind tube, an operating rod is installed on an upper portion of the mouth-tube. The feature of the invention is that: a cover tube, having a spiral spring inserted therein, protruding downwards is installed on a lower end of the operating rod, furthermore, the spiral spring protrudes from the cover tube and is leaned on the mouth-tube. According to the aforesaid structure, the conventional spring plate is replaced with a spiral spring to reduce hole drilling and screwing process, whereby structure and production process is simplified, achieving a decrease in capital.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: December 20, 2005
    Inventor: Wei-Fu Lin
  • Publication number: 20050257662
    Abstract: The present invention relates to a mouth-tube assembled to a tip of a saxophone wind tube, an operating rod is installed on an upper portion of the mouth-tube. The feature of the invention is that: a cover tube, having a spiral spring inserted therein, protruding downwards is installed on a lower end of the operating rod, furthermore, the spiral spring protrudes from the cover tube and is leaned on the mouth-tube. According to the aforesaid structure, the conventional spring plate is replaced with a spiral spring to reduce hole drilling and screwing process, whereby structure and production process is simplified, achieving a decrease in capital.
    Type: Application
    Filed: May 21, 2004
    Publication date: November 24, 2005
    Inventor: Wei-Fu Lin
  • Patent number: 6153029
    Abstract: A production of tapered bent tube wherein a U-cup with a full opening is pressed to form from a brass plate by a primary mold. The two ends of the full opening of the U-cup are of different calibers. The U-cup is subjected to tempering treatment to eliminate its processing stress. An assembly forming mold is used to punch the fill opening of the U-cup to form a rough shape of tapered bent tube with two different calibers at two ends, and between the two ends with different calibers is a flattened part. The flattened part on the tapered bent tube is removed to form a tapered bent tube; then, the seam of the tapered bent tube is welded and smoothed by roller pressing process, to complete the two ends of different calibers.
    Type: Grant
    Filed: August 28, 1998
    Date of Patent: November 28, 2000
    Inventor: Wei-Fu Lin
  • Patent number: 6143969
    Abstract: A mouth-pipe of a saxophone is disclosed. A mouth-pipe is covered on a top of a saxophone wind tube. A high pitch hole is installed on the upper end of the mouth-pipe which is pivotally installed with an octave key. A key cover is installed at the inner surface of the upper end of the octave key, and the key cover presses against the high pitch hole of the mouth-pipe. A ring is formed at the lower end of the octave key. A push rod connected to a high pitch key is installed above the saxophone wind tube. If the high pitch key does not press the high pitch hole, a high pitch is emitted; while if the high pitch key is released, a low pitch is emitted; Two long ear seats facing with one another are installed at the pivotal position of the octave key, and a convex point is formed at a lower end of each long ear seat. Two opposite long pivotal seats are placed at the pivotal positions of the mouth-pipe.
    Type: Grant
    Filed: July 12, 1999
    Date of Patent: November 7, 2000
    Inventor: Wei-Fu Lin
  • Patent number: 5898116
    Abstract: An improved plate assembly of woodwinds comprising a body being longitudinally provided with a plurality of tone holes is provided. Each of the tone holes is provided with a pair of posts at both sides. A copper shaft is pivotally mounted within the posts. A plate which may cover the tone hole is pivotally mounted onto the copper shaft. The lower portion of one of the posts is disposed with a resilient pin. The copper shaft is disposed with a projected pin shaft and a depressing key rod. The resilient pin is disposed such that the projected pin shaft is biased. When the depressing key rod is depressed, the copper shaft is rotated and the tone hole can be opened or closed by the plate to generate a special tone. The upper portion of the post is provided with a ball socket and both ends of the copper shaft are provided with a mounting hole respectively. One of the mounting hole of the pipe is provided with a groove.
    Type: Grant
    Filed: September 3, 1997
    Date of Patent: April 27, 1999
    Inventor: Wei-Fu Lin