Abstract: Microelectronic integrated circuit package structures include a package substrate and an integrated heat solution (IHS) over the package substrate. The IHS comprises a lid and a foot proximal an opening in the HIS. A support structure is spaced apart from the foot and comprises a first interface material in contact with the package substrate. The lid is in contact with the support structure and a second interface material is directly between the foot of the IHS and the package substrate. A die is on the package substrate adjacent to the support structure, the die having an optical interface proximal to the opening.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a substrate having a surface with an edge; a photonic integrated circuit (PIC), having a first surface and an opposing second surface, including a first portion within a footprint of the substrate and a second portion that extends beyond the edge of the substrate; a heat transfer structure; a first material on the second surface of the second portion of the PIC adjacent to the edge of the substrate, wherein the first material includes a low modulus, elastic polymer composite, an adhesive tape, or a foam tape; and a second material including a thermal interface material (TIM) between the second surface of the second portion of the PIC and the heat transfer structure, wherein the first material is between the second material and the edge of the substrate.

Abstract: A heat dissipation film, a display module and a display device, which relate to the technical field of displays. The heat dissipation film includes a foam adhesive layer, and a metal layer, which is laminated on a side of the foam adhesive layer, where an orthographic projection of the metal layer on a plane where the foam adhesive layer is located is located in an area where the foam adhesive layer is located, and at least some of edges of the orthographic projection of the metal layer are located at inner sides of edges of the foam adhesive layer.

Abstract: An electronic gaming system is capable of forming a multi-player group to play a game; receiving, from a first gaming device, first game play information for a first game played by a first player member of the multi-player group on the first gaming device; determining that the first game play information comprises a first winning outcome corresponding to a first winning outcome; in response, allocating the first winning outcome among the first and second player members; and notifying a second gaming device of the second player member that the second player member has received the second portion of the first winning outcome.

Abstract: An electronic gaming system is capable of forming a multi-player group to play a game; receiving, from a first gaming device, first game play information for a first game played by a first player member of the multi-player group on the first gaming device; determining that the first game play information comprises a first winning outcome corresponding to a first winning outcome; in response, allocating the first winning outcome among the first and second player members; and notifying a second gaming device of the second player member that the second player member has received the second portion of the first winning outcome.

Abstract: A module for an electric circuit and method of fabricating the module in which the module includes a substrate including electric circuitry, and a Direct Current (DC) power package arranged for providing DC power to the electric circuitry by being electrically connected to the substrate, the DC power package includes a first DC terminal and a second DC terminal, the second DC terminal being electrically isolated from the first DC terminal, the first DC terminal includes two planar electrical conductors and the second DC terminal includes one planar electrical conductor. The two planar electrical conductors of the first DC terminal and the one planar electrical conductor of the second DC terminal are planarly stacked with gaps between them, so that the one planar electrical conductor of the second DC terminal is sandwiched between the two planar electrical conductors of the first DC terminal reducing stray inductance in the module.

Abstract: A hydraulic fracture fluid is provided. The fluid can include a liquid solvent, one or more surfactants, a proppant-forming compound, and one or more curing agents. The liquid reacts to form proppant in-situ under downhole conditions.

Abstract: A waste heat recovery system is provided and relates to the technical field of servers. The waste heat recovery system includes an immersion box body, an evaporation box body, a heat exchanger, a circulating pipe and a first driving assembly, wherein the immersion box body is filled with a single-phase coolant; the evaporation box body is filled with a two-phase coolant and is provided with an extending portion that extends into the immersion box body and is in contact with the single-phase coolant; a water inlet and a water outlet of the heat exchanger are respectively communicated to different positions of the immersion box body. Based on that the pumpless driven cold and heat circulation flow of a coolant are achieved, the energy consumption of the system is reduced, and the energy utilization efficiency and the environmental protection performance are improved.

Abstract: An electronic gaming system is capable of forming a multi-player group to play a game; receiving, from a first gaming device, first game play information for a first game played by a first player member of the multi-player group on the first gaming device; determining that the first game play information comprises a first winning outcome corresponding to a first winning outcome; in response, allocating the first winning outcome among the first and second player members; and notifying a second gaming device of the second player member that the second player member has received the second portion of the first winning outcome.

Abstract: A waste heat recovery system is provided and relates to the technical field of servers. The waste heat recovery system includes an immersion box body, an evaporation box body, a heat exchanger, a circulating pipe and a first driving assembly, wherein the immersion box body is filled with a single-phase coolant; the evaporation box body is filled with a two-phase coolant and is provided with an extending portion that extends into the immersion box body and is in contact with the single-phase coolant; a water inlet and a water outlet of the heat exchanger are respectively communicated to different positions of the immersion box body. Based on that the pumpless driven cold and heat circulation flow of a coolant are achieved, the energy consumption of the system is reduced, and the energy utilization efficiency and the environmental protection performance are improved.

Abstract: A module structure, a touch module, a display module and a display apparatus are provided. The module structure includes: a substrate including a base substrate, wherein the base substrate includes a functional area and a bonding area on one side of the functional area; a plurality of bonding terminals are provided in the bonding area and arranged along a first direction and each bonding terminal extends along a second direction, and at least one floating terminal is provided in the bonding area and on at least one side of the plurality of bonding terminals in the first direction; the module structure further includes a flexible circuit board, including: a plurality of first connection terminals provided corresponding to the plurality of bonding terminals, and at least one second connection terminal provided corresponding to the at least one floating terminal.

Abstract: The present application relates to the technical field of computers. Disclosed are a starting method and apparatus for an Advanced RISC Machine (ARM) server, an ARM server, and a non-volatile computer-readable storage medium. The method includes: after a Basic Input Output System (BIOS) is started, setting a clock frequency of an Inter-Integrated Circuit (I2C) bus to a preset clock frequency by using the BIOS, where the preset clock frequency is a clock frequency at which a baseboard management controller (BMC) reads real-time clock (RTC) time through the I2C bus; initializing the I2C bus by using the BIOS, and starting and entering an operating system; reading the RTC time through the I2C bus by using the BIOS, and determining whether the BIOS successfully reads the RTC time; and if the BIOS successfully reads the RTC time, displaying, under the operating system, system time corresponding to the RTC time.

Abstract: The present disclosure has a substrate for power semiconductor packaging and a package containing such a substrate. The substrate includes: a first metal layer for contacting with a semiconductor device, a second metal layer for contacting with a heat dissipation device, an electrical insulation layer disposed between the first metal layer and the second metal layer, and a first graphene bulk layer disposed between the electrical insulation layer and the first metal layer, a first surface of the first graphene bulk layer is in contact with a first surface of the first metal layer, and a second surface of the first graphene bulk layer opposite to the first surface is in contact with a first surface of the electrical insulation layer. Compared to the conventional substrate, the novel substrate of the present disclosure exhibits much lower thermal resistance, higher mechanical strength, and enhanced corrosion resistance.

Abstract: The present application relates to the technical field of computers. Disclosed are a starting method and apparatus for an Advanced RISC Machine (ARM) server, an ARM server, and a non-volatile computer-readable storage medium. The method includes: after a Basic Input Output System (BIOS) is started, setting a clock frequency of an Inter-Integrated Circuit (I2C) bus to a preset clock frequency by using the BIOS, where the preset clock frequency is a clock frequency at which a baseboard management controller (BMC) reads real-time clock (RTC) time through the I2C bus; initializing the I2C bus by using the BIOS, and starting and entering an operating system; reading the RTC time through the I2C bus by using the BIOS, and determining whether the BIOS successfully reads the RTC time; and if the BIOS successfully reads the RTC time, displaying, under the operating system, system time corresponding to the RTC time.

Abstract: A display module, including: a protective cover, a flexible display panel, and a metal heat-dissipation layer. The protective cover includes a main body portion in the shape of a circular plate and a bending portion distributed around the main body portion. The bending portion is fixedly connected to an edge of the main body portion. A light-exit side of the flexible display panel is attached to the protective cover. An orthographic projection of an edge portion of the flexible display panel on the protective cover is within the bending portion. The metal heat-dissipation layer is attached to a side, going away from the protective cover, of the flexible display panel. An orthographic projection of an edge portion of the metal heat-dissipation layer on the protective cover is within the bending portion. The edge portion of the metal heat-dissipation layer has a plurality of hollowed-out grooves arranged in arrays.

Abstract: Provided is a display module. The display module includes a protective cover plate and a flexible display panel. The protective cover plate includes a body portion in a shape of a circular plate and a bent portion disposed around the body portion, the bent portion being fixedly connected to an edge of the body portion; and a light exit side of the flexible display panel faces the protective cover plate, and the flexible display panel includes a first panel portion attached to the body portion and a second panel portion disposed around the first panel portion, an orthographic projection of the second panel portion on the protective cover plate being within the bent portion.

Abstract: Systems and methods that employ a virtual chip purchase voucher to transfer an amount funds between one or more gaming establishment accounts associated with a user and one or more gaming table components associated with a gaming establishment gaming table.

Abstract: A module structure, a touch module, a display module and a display apparatus are provided. The module structure includes: a substrate including a base substrate, wherein the base substrate includes a functional area and a bonding area on one side of the functional area; a plurality of bonding terminals are provided in the bonding area and arranged along a first direction and each bonding terminal extends along a second direction, and at least one floating terminal is provided in the bonding area and on at least one side of the plurality of bonding terminals in the first direction; the module structure further includes a flexible circuit board, including: a plurality of first connection terminals provided corresponding to the plurality of bonding terminals, and at least one second connection terminal provided corresponding to the at least one floating terminal.

Abstract: A display module includes a flexible display panel including a display portion, a binding portion, and a bending portion; a first back film, a second back film fitted to the display portion and the binding portion, respectively, an auxiliary support layer located between the first and second back films, bonded with the back films through first and second adhesive layers, respectively, and provided with an elastic modulus greater than the first and second back films; orthographic projections of the back films are located in or overlaps with those of the display portion and the bind portion, respectively. Side edges of the first and second back films and the auxiliary support layer close to the bending portion are first, second and third side edges, respectively; a spacing between the third and first side edges and a spacing between the third and second side edges are 0-0.35 mm.

Abstract: Systems and methods that utilize service order identifiers to track the location of anonymous players whom have placed service orders.