Abstract: A signal transmission module includes a shell and a connector. The shell includes a box and a mating portion. The connector includes an insulative housing received in the box and a set of contacts. Each contact includes a middle portion, a contacting portion extending into the mating portion and a tail portion. A gap is formed between the insulative housing and the box for sealant being injected. The signal transmission module further includes a horizontal channel located between the insulative housing and the box for the sealant entering into and a vertical channel connecting the horizontal channel.

Abstract: A method and apparatus are provided for monitoring resource utilization within a connection oriented switch. An operator defines a utilization threshold in terms of percentage of maximum capacity, and a connection resource tracker determines whether utilization of specified resources within the switch have exceeded this threshold. The switch then either sends a report to the operator identifying all such resources, or generates an alarm, revealing sources of congestion within the switch without requiring the operator to manually query each resource. The method and apparatus can alternatively be used to monitor for underutilization of resources. The method and apparatus allow rapid diagnostic and simplified monitoring of connection oriented switches.

Abstract: A high-power LED lamp cooling device and its manufacturing method, which includes: manufacturing a semiconductor crystal bar in advance into cone-shaped crystal bar with one end having large diameter and the other having small diameter, making color mark on each wafer as the large-diameter end surface of the tail end when the cone-shaped semiconductor crystal bar is cut into slices; cutting and pelletizing the conical surface to obtain polygonal cylindrical N-type or P-type semiconductor elements, arranging them in a matrix form between two beryllium-oxide ceramic chips provided with conductive circuits, connecting head end of N-type semiconductor elements to tail end of the P-type semiconductor elements in series to manufacture high-power LED lamp cooling device. The high-power LED lamp cooling device can achieve: good cooling effect, high working efficiency, low energy consumption and capable of reducing light failure of LED lamp, and prolonging service life of the high-power LED lamp.

Abstract: A high-power LED lamp cooling device and its manufacturing method, which includes: manufacturing a semiconductor crystal bar in advance into cone-shaped crystal bar with one end having large diameter and the other having small diameter, making color mark on each wafer as the large-diameter end surface of the tail end when the cone-shaped semiconductor crystal bar is cut into slices; cutting and pelletizing the conical surface to obtain polygonal cylindrical N-type or P-type semiconductor elements, arranging them in a matrix form between two beryllium-oxide ceramic chips provided with conductive circuits, connecting head end of N-type semiconductor elements to tail end of the P-type semiconductor elements in series to manufacture high-power LED lamp cooling device. The high-power LED lamp cooling device can achieve: good cooling effect, high working efficiency, low energy consumption and capable of reducing light failure of LED lamp, and prolonging service life of the high-power LED lamp.

Abstract: Disclosed is a method for manufacturing N-type semiconductor element for cooling or heating device, the N-type semiconductor element is made of tellurium, bismuth and selenium material, firstly, smashing and grinding the tellurium, bismuth and selenium material to be 2000 meshes or more; and then, according to the proportion of each material in parts by weight, proportioning the materials to obtain a mixture, the proportion thereof is: 40 to 44 parts of tellurium, 53 to 57 parts of bismuth and 28 to 32 parts of selenium. During operation, the temperature difference between the two ends thereof is larger, and through a test, the temperature difference between the cold end and the hot end reaches about 73° C. to 78° C. Therefore, the N-type semiconductor element has the advantages of high operation efficiency and lower energy consumption. The N-type semiconductor element is particularly suitable for manufacturing a semiconductor cooling or heating device.

Abstract: A low light failure high power LED street lamp and a manufacturing method therefor. Color mark is made on tail end of N-type semiconductor element (6) or P-type semiconductor element (7); then N-type and P-type semiconductor element (6, 7) are arranged in matrix manner between upper beryllium-oxide ceramic wafer (8) and lower beryllium-oxide ceramic wafer (9), so that head end of N-type semiconductor element (6) is connected with tail end of P-type semiconductor element (7) or tail end of N-type semiconductor element (6) is connected with head end of P-type semiconductor element (7), then lower beryllium-oxide ceramic wafer (9) is attached, through graphene thermal conductive greaseon layer (4), on backside of circuit board (2) which is mounted with LED bulbs (3), and heat sink (15) is mounted on upper beryllium-oxide ceramic wafer (8), then circuit board (2) together with heat sink (15) are mounted into street lamp housing (1).

Abstract: A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.

Abstract: The invention provides a non-invasive technique for the differential detection of multiple genotypes and/or mutations for a plurality of target genes in a biological sample containing genetic material from different genomic sources. Methods are conducted using multiplex amplification of a plurality of target sequences from the biological sample, and sequencing is used to detect and enumerate genetic mutations and chromosomal abnormalities at the single nucleotide level.

Abstract: A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.

Abstract: The present disclosure discloses a transparency-based image processing method, device, and terminal. The method includes steps of: acquiring first simulated pixel information representing a first pixel, and acquiring first transparency information; acquiring second simulated pixel information representing a second pixel, and acquiring second transparency information; calculating third simulated pixel information representing a third pixel as a sum of a product of the first simulated pixel information times the first transparency information and a product of the second simulated pixel information times the second transparency information; and acquiring a third actual pixel by narrowing the third simulated pixel information.

Abstract: A method, device and system for transmitting packet service data are provided. The method includes the steps of: receiving the packet service data transmitted by a user equipment; determining the packet service data to be uninstalled in the packet service data according to the service uninstall strategy of the user equipment; and transmitting the packet service data to be uninstalled to the packet data network via a metropolitan-area network and an internet protocol (IP) backbone network. By applying this method, the problem in the prior art is overcome, thereby saving the operation and maintenance cost of the packet network.

Abstract: Methods and systems for improved matching of on-chip capacitors may comprise a semiconductor die with an on-chip capacitor comprising one or more metal layers. The on-chip capacitor may comprise interdigitated electrically coupled metal fingers. The electrically coupled metal fingers may be arranged symmetrically in the semiconductor die to compensate for non-uniformities in the one or more metal layers. The metal fingers may be arranged with radial symmetry. Metal fingers in a first metal layer may be electrically coupled to metal fingers in a second metal layer. An orientation of metal fingers may be alternated when coupling metal fingers in a plurality of metal layers. The metal fingers may be coupled at the center or the outer edge of the on-chip capacitor. The on-chip capacitor may be configured in a plurality of symmetric sections wherein a boundary between each of the plurality of sections is configured in a zig-zag pattern.

Abstract: The present invention relates to a method for improving IP fragmentation and transmission of user payload between a User Equipment, UE (10), and a Peer Node, PN (14). The payload is transmitted through a transmission path enabled by at least a first (17,18) and a second (17,18) established tunnel, said tunnels connecting a first (11), (13) and a second (11, 13) node in a Packet Core Network, PCN. The method comprises the steps of: The first node (11,13) fragments (19) at least one received payload packet (15) into fragments (16) on the basis of a minimum Maximum Transmission Unit, MTU, for an upper IP layer of the transmission path. The first node (11,13) encapsulates (20) said fragments at the entry of the first tunnel (17, 18).

Abstract: A signal transmission module includes a shell and a connector. The shell includes a box and a mating portion. The connector includes an insulative housing received in the box and a set of contacts. Each contact includes a middle portion, a contacting portion extending into the mating portion and a tail portion. A gap is formed between the insulative housing and the box for sealant being injected. The signal transmission module further includes a horizontal channel located between the insulative housing and the box for the sealant entering into and a vertical channel connecting the horizontal channel.

Abstract: A system and method are disclosed for applying a die attach epoxy to substrates on a panel of substrates. The system includes a window clamp having one or more windows through which the epoxy may be applied onto the substrate panel. The size and shape of the one or more windows correspond to the size and shape of the area on the substrate to receive the die attach epoxy. Once the die attach epoxy is sprayed onto the substrate through the windows of the window clamp, the die may be affixed to the substrate and the epoxy cured in one or more curing steps. The system may further include a clean-up follower for cleaning epoxy off of the window clamp, and a window cleaning mechanism for cleaning epoxy off of the sidewalls of the windows of the window clamp.

Abstract: A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.

Abstract: A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.

Abstract: A health monitoring system for complex networked apparatus includes a number of neuro-fuzzy inference apparatuses feeding inference results into a data fusion hierarchy. At each level in the hierarchy, fuzzy inference is applied to generate a desired output signal by processing selected input signals in accordance with a knowledge base defining fuzzy membership functions and fuzzy inference rules defined in advance. The knowledge base includes alternative definitions of membership functions and/or inference rules. The apparatus selects which definition to use according to environmental or other conditions, and predetermined selection criteria.

Abstract: A health monitoring system for complex networked apparatus includes a number of neuro-fuzzy inference apparatuses feeding inference results into a data fusion hierarchy. At each level in the hierarchy, fuzzy inference is applied to generate a desired output signal by processing selected input signals in accordance with a knowledge base defining fuzzy membership functions and fuzzy inference rules defined in advance. The knowledge base includes alternative definitions of membership functions and/or inference rules. The apparatus selects which definition to use according to environmental or other conditions, and predetermined selection criteria.

Abstract: The present disclosure discloses a transparency-based image processing method, device, and terminal. The method includes steps of: acquiring first simulated pixel information representing a first pixel, and acquiring first transparency information; acquiring second simulated pixel information representing a second pixel, and acquiring second transparency information; calculating third simulated pixel information representing a third pixel as a sum of a product of the first simulated pixel information times the first transparency information and a product of the second simulated pixel information times the second transparency information; and acquiring a third actual pixel by narrowing the third simulated pixel information.