Abstract: The ionic liquid-based coating is a coating for both porous and nonporous materials. As non-limiting examples, a porous substrate coated with the ionic liquid-based coating may be used to disinfect and remove microorganisms from air and water, to provide an antimicrobial surface for preventing microbial contamination, or to enhance filtration efficiency of the porous material for airborne and waterborne particulate matter without increasing flow resistance. As a further non-limiting example, a nonporous substrate coated with the ionic liquid-based coating may be used to form a surface capable of self-disinfection from microorganisms contacting surface. The ionic liquid-based coating includes at least one ionic liquid, an adhesive, and at least one additive, which may be a disinfectant, a viscosity modifier, a pH buffer, a fragrance, or combinations thereof.

Abstract: Certain aspects relate to a semiconductor die. The semiconductor die includes a voltage-controlled oscillator (VCO), wherein the VCO includes a resonant capacitor, and a resonant inductor coupled in parallel with the resonant capacitor. The resonant inductor includes a first elongated portion and a second elongated portion that are parallel with each other. The semiconductor die also includes a voltage supply line configured to route a supply voltage to the VCO, wherein the voltage supply line includes a first portion that runs parallel with the first and second elongated portions of the resonant inductor and is located between the first and second elongated portions of the resonant inductor.

Abstract: A chip-to-chip communications circuit which is particularly well-suited for short range communication (less than a few inches) from one integrated circuit (chip) to another is presented. The circuits preferably utilize multi-frequency quadrature amplitude modulation (QAM) mechanisms for converting digital data bits from a parallel form into a serial analog stream for communication over a chip I/O connection. Differential current mode modulation in the transmitter, and demodulation in the receiver, are utilized which reduce latency and power-consumption while increasing manufacturing yields and resilience to process variations.

Abstract: A chip-to-chip communications circuit which is particularly well-suited for short range wired RF communication from one integrated circuit (chip) to another is presented. The circuits preferably utilize multi-frequency quadrature amplitude modulation (QAM) mechanisms for converting digital data bits from a parallel form into a serial analog stream for communication over a chip I/O connection. During a phase calibration cycle, a phase adjustment controller in the transmitter interoperates with a phase adjustment controller in the receiver, to adjust a phase locked-loop (PLL) circuit to correct for the phase delay arising in response to signal propagation between transmitter and receiver.

Abstract: A chip-to-chip communications circuit which is particularly well-suited for short range communication (less than a few inches) from one integrated circuit (chip) to another is presented. The circuits preferably utilize multi-frequency quadrature amplitude modulation (QAM) mechanisms for converting digital data bits from a parallel form into a serial analog stream for communication over a chip I/O connection. Differential current mode modulation in the transmitter, and demodulation in the receiver, are utilized which reduce latency and power-consumption while increasing manufacturing yields and resilience to process variations.

Abstract: The invention discloses an optical communication system using grounded coplanar waveguide, comprising a current buffer and a transimpedance amplifier (TIA). Transmission lines of the optical communication system have grounded coplanar waveguide (GCPW) structures. The current buffer receives a current signal from a signal source, and outputs the current signal after reducing capacitance effects of the signal source. The TIA converts the current signal to a voltage signal, wherein a first end of the TIA receives the current signal, a second end of the TIAn outputs the voltage signal, and a shunt-shunt feedback circuit is coupled between the first end and the second end. Therefore, the present invention can minimize the circuit area and lower the power consumption as well.

Abstract: The invention discloses an optical communication system using grounded coplanar waveguide, comprising a current buffer and a transimpedance amplifier (TIA). Transmission lines of the optical communication system have grounded coplanar waveguide (GCPW) structures. The current buffer receives a current signal from a signal source, and outputs the current signal after reducing capacitance effects of the signal source. The TIA converts the current signal to a voltage signal, wherein a first end of the TIA receives the current signal, a second end of the TIAn outputs the voltage signal, and a shunt-shunt feedback circuit is coupled between the first end and the second end. Therefore, the present invention can minimize the circuit area and lower the power consumption as well.