Patents by Inventor Wei-Han Liu

Wei-Han Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240111597
    Abstract: A present invention embodiment requests resources for a set of tasks from different resource providers. The set of tasks includes first tasks and second tasks of longer duration than the first tasks. The resources are revocable by the different resource providers based on processing demand. Performance of the first tasks is initiated on the resources, and stable resources are identified based on revocation of the resources during performance of the first tasks. Performance of the second tasks are initiated on the identified stable resources. Requests for the resources to the different resource providers are adjusted based on resource provider information collected in response to completion of the set of tasks.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Guang Han Sui, Wei Ge, Lan Zhe Liu, Guo Liang Wang
  • Patent number: 11923205
    Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: March 5, 2024
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: Kun-Ju Li, Ang Chan, Hsin-Jung Liu, Wei-Xin Gao, Jhih-Yuan Chen, Chun-Han Chen, Zong-Sian Wu, Chau-Chung Hou, I-Ming Lai, Fu-Shou Tsai
  • Patent number: 11923409
    Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Yu Lin, Wei-Yang Lee, Chia-Pin Lin, Tzu-Hua Chiu, Kuan-Hao Cheng, Wei-Han Fan, Li-Li Su, Wei-Min Liu
  • Publication number: 20230051939
    Abstract: A physiological monitoring device is provided and includes a physiological sensing device, a first PPG sensor, a vital signs detector, and a PPG controller. The physiological sensing device senses at least one physiological feature of a subject to generate at least one sensing signal. The first PPG sensor senses pulses of a blood vessel of the subject to generate a first PPG signal when the first PPG sensor is activated. The vital signs detector obtains vital signs data according to the at least one sensing signal. The PPG controller detects whether a specific event is happening to the subject according to the vital signs data. In response to detecting that the specific event is happening to the subject, the PPG controller activates the first PPG sensor. The physiological monitoring apparatus obtains a blood oxygen level of the subject according to the first PPG signal.
    Type: Application
    Filed: August 11, 2021
    Publication date: February 16, 2023
    Inventors: Hung-Chih CHIU, Shu-Yu HSU, Wei-Han LIU
  • Patent number: 8855319
    Abstract: An audio signal processing apparatus and an audio signal processing method are provide. The audio signal processing apparatus comprises: a plurality of individual audio interfaces, an audio signal processing unit, and an audio channel splitting unit. The audio signal processing unit is utilized for determining a total number of audio channels corresponding to the individual audio interfaces and generating a first output audio signal with a first number of audio channels according to an input audio signal and the total number of audio channels when the audio signal processing apparatus is operated under a first operational mode. The audio channel splitting unit is coupled to the audio signal processing unit and the audio interfaces. When the audio signal processing apparatus is operated under the first operational mode, the audio channel splitting unit splits the first output audio signal with the first number of audio channels to the audio interfaces, respectively.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: October 7, 2014
    Assignee: Mediatek Inc.
    Inventors: Wei-Han Liu, Hsiao-Yu Han
  • Publication number: 20120300943
    Abstract: An audio signal processing apparatus and an audio signal processing method are provide. The audio signal processing apparatus comprises: a plurality of individual audio interfaces, an audio signal processing unit, and an audio channel splitting unit. The audio signal processing unit is utilized for determining a total number of audio channels corresponding to the individual audio interfaces and generating a first output audio signal with a first number of audio channels according to an input audio signal and the total number of audio channels when the audio signal processing apparatus is operated under a first operational mode. The audio channel splitting unit is coupled to the audio signal processing unit and the audio interfaces. When the audio signal processing apparatus is operated under the first operational mode, the audio channel splitting unit splits the first output audio signal with the first number of audio channels to the audio interfaces, respectively.
    Type: Application
    Filed: May 25, 2011
    Publication date: November 29, 2012
    Inventors: Wei-Han Liu, Hsiao-Yu Han