Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.

Abstract: Various embodiments of the present application are directed to an IC, and associated forming methods. In some embodiments, the IC comprises a memory region and a logic region integrated in a substrate. A plurality of memory cell structures is disposed on the memory region. Each memory cell structure of the plurality of memory cell structures comprises a control gate electrode disposed over the substrate, a select gate electrode disposed on one side of the control gate electrode, and a spacer between the control gate electrode and the select gate electrode. A contact etch stop layer (CESL) is disposed along an upper surface of the substrate, extending upwardly along and in direct contact with a sidewall surface of the select gate electrode within the memory region. A lower inter-layer dielectric layer is disposed on the CESL between the plurality of memory cell structures within the memory region.

Abstract: A method includes planarizing a protective layer over gate materials overlying a recessed region in a substrate. The planarizing includes forming a first planarized surface by planarizing a sacrificial layer over the protective layer, and forming a second planarized surface of the protective layer by etching the first planarized surface of the sacrificial layer at an even rate across the recessed region. An etch mask layer is formed over the second planarized surface, and control gate stacks are formed in the recessed region by etching the gate materials.

Abstract: A method and apparatus for forming tungsten features in semiconductor devices is provided. The method includes exposing a top opening of a feature formed in a substrate to a physical vapor deposition (PVD) process to deposit a tungsten liner layer within the feature. The PVD process is performed in a first processing region of a first processing chamber and the tungsten liner layer forms an overhang portion, which partially obstructs the top opening of the feature. The substrate is transferred from the first processing region of the first processing chamber to a second processing region of a second processing chamber without breaking vacuum. The overhang portion is exposed to nitrogen-containing radicals in the second processing region to inhibit subsequent growth of tungsten along the overhang portion. The feature is exposed to a tungsten-containing precursor gas to form a tungsten fill layer over the tungsten liner layer within the feature.

Abstract: A semiconductor device includes a semiconductor substrate, a control gate, a select gate, a charge trapping structure, and a dielectric structure. The semiconductor substrate has a drain region, a source region, and a channel region between the drain region and the source region. The control gate is over the channel region of the semiconductor substrate. The select gate is over the channel region of the semiconductor substrate and separated from the control gate. The charge trapping structure is between the control gate and the semiconductor substrate. The dielectric structure is between the select gate and the semiconductor substrate. The dielectric structure has a first part and a second part, the first part is between the charge trapping structure and the second part, and the second part is thicker than the first part.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A method, system, and article provide image processing with power reduction while using universal serial bus cameras.

Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.

Abstract: An intelligent platform integrates with an intelligent portable device or intelligent core to provide a dynamic computer that may serve as any of: a pad, a tablet computing device, a netbook computer, and a notebook computer. The operations of the integrated device are determined by the connected intelligent core's CPU architecture and its installed operating system. The intelligent platform includes a housing and a core slot located behind a display for accommodating the intelligent core. A core connector is provided on an inner wall of the core slot for interconnecting with a compatible connector of the inserted intelligent core. A control unit continually communicates with the intelligent core through signals carried by the connector, refreshes image received from the intelligent core on its touch-sensitive display, and sends touch-input commands from the touchable panel of the touch-sensitive display to the intelligent core.

Abstract: A crop frame adjusting method includes displaying an image; displaying a crop frame on the image; and in response to touches within a virtual frame corresponding to the crop frame are detected, resizing the crop frame according to movements of the touches, wherein the virtual frame is extended from the crop frame.

Abstract: An enclosure design facilitates heat dissipation from a space-limited computer core device. An external computer platform is provided to connect the computer core device, the external computer platform including a fan that provides an air flow to the connected computer core device. The computer core device and the computing platform may be tightly connected by connectors located on their respective enclosure walls. Both the computer core device and the external computing platform are provided air inlets and outlets on their respective enclosures. When connected, an air inlet of the computer core device faces an air outlet of the external computing platform such that a single cooling air flow flows through the external computing platform and the computer core device. The external computing platform may include a built-in fan to blow air into or draw air from the matching air inlets and outlets.

Abstract: A dynamic dual displays system is coupled with a computing device to provide at least two display panels for single user or multiple user applications. In one embodiment, two display panels are provided in a back-to-back configuration connected by a hinge to allow rotation motion of the display panels relative to each other. Depending on the relative positions of the display panels and the computing device, the combined system provides a hybrid device that may dynamically serve as a notebook or a tablet computer. The multiple display panels may present the same or different contents simultaneously, depending on application. In a multi-user application, the display panels may be presented to different users, one of which accepts input data through a touch-sensitive surface on the corresponding display panel.

Abstract: A crop frame adjusting method includes displaying an image; displaying a crop frame on the image; and in response to touches within a virtual frame corresponding to the crop frame are detected, resizing the crop frame according to movements of the touches, wherein the virtual frame is extended from the crop frame.

Abstract: An enclosure design facilitates heat dissipation from a space-limited computer core device. An external computer platform is provided to connect the computer core device, the external computer platform including a fan that provides an air flow to the connected computer core device. The computer core device and the computing platform may be tightly connected by connectors located on their respective enclosure walls. Both the computer core device and the external computing platform are provided air inlets and outlets on their respective enclosures. When connected, an air inlet of the computer core device faces an air outlet of the external computing platform such that a single cooling air flow flows through the external computing platform and the computer core device. The external computing platform may include a built-in fan to blow air into or draw air from the matching air inlets and outlets.

Abstract: A dynamic dual displays system is coupled with a computing device to provide at least two display panels for single user or multiple user applications. In one embodiment, two display panels are provided in a back-to-back configuration connected by a hinge to allow rotation motion of the display panels relative to each other. Depending on the relative positions of the display panels and the computing device, the combined system provides a hybrid device that may dynamically serve as a notebook or a tablet computer. The multiple display panels may present the same or different contents simultaneously, depending on application. In a multi-user application, the display panels may be presented to different users, one of which accepts input data through a touch-sensitive surface on the corresponding display panel.

Abstract: An intelligent platform integrates with an intelligent portable device or intelligent core to provide a dynamic computer that may serve as any of: a pad, a tablet computing device, a netbook computer, and a notebook computer. The operations of the integrated device are determined by the connected intelligent core's CPU architecture and its installed operating system. The intelligent platform includes a housing and a core slot located behind a display for accommodating the intelligent core. A core connector is provided on an inner wall of the core slot for interconnecting with a compatible connector of the inserted intelligent core. A control unit continually communicates with the intelligent core through signals carried by the connector, refreshes image received from the intelligent core on its touch-sensitive display, and sends touch-input commands from the touchable panel of the touch-sensitive display to the intelligent core.