Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.

Abstract: A manufacturing method of contact lenses includes a step of: hydrating a lens body. The strep of hydrating the lens body includes steps of: providing the lens body; preparing a hydration solution, wherein the hydration solution is a 5-95 v/v % alcohol ether aqueous solution; soaking the lens body in the hydration solution for at least 30 minutes; and soaking the lens body in water for at least 15 minutes to form a contact lens.

Abstract: A heat dissipation device includes a base, a fin assembly mounted on a top surface of the base, and a heat absorber arranged at a bottom surface of the base. The bottom surface of the base defines a recess corresponding to the heat absorber. The heat absorber is embedded in the recess. A fixing plate is positioned at the bottom surface of the base to cover the recess and define a sealed/airtight cavity between the fixing plate and the base. A top end of the heat absorber is received in the sealed/airtight cavity. A top end of the heat absorber extends through the fixing plate to expose out of the sealed/airtight cavity. A flexible sheet is totally received in the sealed/airtight cavity to buffer a stress generated by assembling the heat dissipation device with external elements.

Abstract: A heat dissipation device includes a base, a fin assembly mounted on a top surface of the base, and a heat absorber arranged at a bottom surface of the base. The bottom surface of the base defines a recess corresponding to the heat absorber. The heat absorber is embedded in the recess. A fixing plate is positioned at the bottom surface of the base to cover the recess and define a sealed/airtight cavity between the fixing plate and the base. A top end of the heat absorber is received in the sealed/airtight cavity. A top end of the heat absorber extends through the fixing plate to expose out of the sealed/airtight cavity. A flexible sheet is totally received in the sealed/airtight cavity to buffer a stress generated by assembling the heat dissipation device with external elements.

Abstract: A liquid cooling system includes a liquid cooling radiator, a circulation device, and a plurality of circulation pipes coupling the circulation device with the liquid cooling radiator. A liquid circulation channel is defined in the liquid cooling radiator. A plurality of heat dissipation fins are arranged in the liquid circulation channel. The circulation device drives a liquid coolant through the liquid cooling radiator via the liquid circulation channel to make a heat exchange circulation.

Abstract: An exemplary protective device is for protecting an electronic component mounted on a printed circuit board. The protective device includes a protective board covering the electronic component, and a hard carbon film coated on an outer periphery of the protective board. The protective board is made of anti-EMI materials.

Abstract: A heat dissipation device includes a plurality of fins connected to each other. Each fin includes a plate and a pair of flanges extending from the plate. Each flange includes a first section extending perpendicularly away from the plate, a third section extending perpendicularly towards the plate and a second section interconnecting the first section and the third section. The first section is parallel to the third section and the second section is parallel to the plate. Three channels are defined by the first flange, the second flange and the plate for allowing airflow to flow through the fins.