Patents by Inventor WEI-HANG HSU

WEI-HANG HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240384089
    Abstract: A contact lens including at least one silicone monomer is provided, wherein the surface of the contact lens includes polyacrylic acid and/or sodium polyacrylate, and the molecular weight of the polyacrylic acid and/or the sodium polyacrylate is greater than 100 kDa. The present invention further provides a silicone hydrogel contact lens. The contact lens and the silicone hydrogel contact lens provided by the present invention have the advantages of good hydrophilicity and being suitable for consumers' long-time wearing.
    Type: Application
    Filed: May 13, 2024
    Publication date: November 21, 2024
    Inventors: WEI-HANG HSU, CHU-YI YU, YAO-TSUNG CHENG
  • Publication number: 20220250343
    Abstract: A manufacturing method of contact lenses includes a step of: hydrating a lens body. The strep of hydrating the lens body includes steps of: providing the lens body; preparing a hydration solution, wherein the hydration solution is a 5-95 v/v % alcohol ether aqueous solution; soaking the lens body in the hydration solution for at least 30 minutes; and soaking the lens body in water for at least 15 minutes to form a contact lens.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 11, 2022
    Inventors: CHU-YI YU, YAO-TSUNG CHENG, WEI-HANG HSU
  • Patent number: 9748161
    Abstract: A heat dissipation device includes a base, a fin assembly mounted on a top surface of the base, and a heat absorber arranged at a bottom surface of the base. The bottom surface of the base defines a recess corresponding to the heat absorber. The heat absorber is embedded in the recess. A fixing plate is positioned at the bottom surface of the base to cover the recess and define a sealed/airtight cavity between the fixing plate and the base. A top end of the heat absorber is received in the sealed/airtight cavity. A top end of the heat absorber extends through the fixing plate to expose out of the sealed/airtight cavity. A flexible sheet is totally received in the sealed/airtight cavity to buffer a stress generated by assembling the heat dissipation device with external elements.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: August 29, 2017
    Assignee: Foxconn Technology Co., Ltd.
    Inventor: Wei-Hang Hsu
  • Publication number: 20160227674
    Abstract: A heat dissipation device includes a base, a fin assembly mounted on a top surface of the base, and a heat absorber arranged at a bottom surface of the base. The bottom surface of the base defines a recess corresponding to the heat absorber. The heat absorber is embedded in the recess. A fixing plate is positioned at the bottom surface of the base to cover the recess and define a sealed/airtight cavity between the fixing plate and the base. A top end of the heat absorber is received in the sealed/airtight cavity. A top end of the heat absorber extends through the fixing plate to expose out of the sealed/airtight cavity. A flexible sheet is totally received in the sealed/airtight cavity to buffer a stress generated by assembling the heat dissipation device with external elements.
    Type: Application
    Filed: April 28, 2015
    Publication date: August 4, 2016
    Inventor: WEI-HANG HSU
  • Publication number: 20160120063
    Abstract: A liquid cooling system includes a liquid cooling radiator, a circulation device, and a plurality of circulation pipes coupling the circulation device with the liquid cooling radiator. A liquid circulation channel is defined in the liquid cooling radiator. A plurality of heat dissipation fins are arranged in the liquid circulation channel. The circulation device drives a liquid coolant through the liquid cooling radiator via the liquid circulation channel to make a heat exchange circulation.
    Type: Application
    Filed: December 12, 2014
    Publication date: April 28, 2016
    Inventors: NIEN-TIEN CHENG, WEI-HANG HSU
  • Publication number: 20140313668
    Abstract: An exemplary protective device is for protecting an electronic component mounted on a printed circuit board. The protective device includes a protective board covering the electronic component, and a hard carbon film coated on an outer periphery of the protective board. The protective board is made of anti-EMI materials.
    Type: Application
    Filed: April 29, 2013
    Publication date: October 23, 2014
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: WEI-HANG HSU, JUI-WEN HUNG
  • Publication number: 20120279696
    Abstract: A heat dissipation device includes a plurality of fins connected to each other. Each fin includes a plate and a pair of flanges extending from the plate. Each flange includes a first section extending perpendicularly away from the plate, a third section extending perpendicularly towards the plate and a second section interconnecting the first section and the third section. The first section is parallel to the third section and the second section is parallel to the plate. Three channels are defined by the first flange, the second flange and the plate for allowing airflow to flow through the fins.
    Type: Application
    Filed: August 23, 2011
    Publication date: November 8, 2012
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: WEI-HANG HSU