Abstract: The present disclosure provides an electronic package. The electronic package includes a substrate, a first component disposed on the substrate and configured to detect an external signal, and an encapsulant disposed on the substrate. The electronic package also includes a protection element disposed on the substrate and physically separating the first device from the encapsulant and exposing the first device. The present disclosure also provides an electronic device.

Abstract: An electronic device package and a method for manufacturing the electronic device are provided. The electronic device includes a charging element, a housing covering the charging element and a sensing element electrically connected to the housing. The sensing element is configured to detect an external device and to drive the charging element.

Abstract: Electronic design automation (EDA) of the present disclosure logically places components of the electronic circuitry onto an electronic design real estate to determine an architectural design placement for the electronic circuitry. The EDA evaluates a metaheuristic algorithm starting with an initial placement of components of the electronic circuitry onto the electronic design real estate to provide multiple possible placements for placing these components of the electronic circuitry onto the electronic design real estate. The EDA utilizes the multiple possible placements of the metaheuristic algorithm to train one or more probabilistic functions of a model-based reinforcement learning (RL) algorithm. The EDA evaluates the model-based RL algorithm utilizing the one or more probabilistic functions to determine the architectural design placement.

Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate disposed over the first substrate and having a first surface facing away from the first substrate and a second surface facing the first substrate, a first component disposed on the first surface of the second substrate, a second component disposed on the second surface of the second substrate; and a support member covering the first component.

Abstract: The disclosure provides an eye state assessment method and an electronic device. The method includes: obtaining an optic disc image area from a first fundus photography and generating multiple optic cup-to-disc ratio assessment results by multiple first models based on the optic disc image area; obtaining a first assessment result of an eye based on the optic cup-to-disc ratio assessment results; performing multiple data augmentation operations on the first fundus photography to generate multiple second fundus photographies; generating multiple retinal nerve fiber layer (RNFL) defect assessment results by multiple second models based on the second fundus photographies; obtaining a second assessment result of the eye based on the RNFL defect assessment results; and obtaining an optic nerve assessment result of the eye based on the first assessment result and the second assessment result.

Abstract: An electronic device and a method for determining the intensity of a low-frequency current are provided. The method includes: individually applying a corresponding first current to a body part of a user in N consecutive time intervals, wherein the time intervals include an i-th time interval to an (i+N)-th time interval; obtaining electromyography values of the body part in each time interval; determining a second current corresponding to an (i+N+1)-th time interval based on the first current corresponding to each time interval, the body part, personal information of the user, and the electromyography values of each time interval; and applying a second current to the body part of the user in the (i+N+1)-th time interval.

Abstract: An electronic device package includes a substrate, at least one first electronic component and at least one electrical element. The substrate includes a first surface. The first surface comprises a plurality of electrical terminals including a first region and a second region, and a pitch of the electrical terminals of the first region is smaller than a pitch of the electrical terminals of the second region. The at least one first electronic component is electrically connected to the substrate and at least over the first region. The at least one electrical element is disposed above the first electronic component and farther from the substrate than the first electronic component. A number of the at least one electrical element under the first region is less than a number of the at least one electrical element under the second region.

Abstract: A substrate, a semiconductor package, and a method of manufacturing the same are provided. The substrate includes an interposer element. The interposer element has a first surface and a second surface opposite to the first surface. At least two rows of pads are disposed adjacent to the first surface of the interposer element. The interposer element includes at least one slot disposed between the two rows of pads and extending from the first surface to the second surface, wherein a projection area extending from an edge of the slot to an edge of the first surface of the interpose element is nonoverlapping at least one pad.

Abstract: A substrate, a semiconductor package, and a method of manufacturing the same are provided. The substrate includes an interposer element. The interposer element has a first surface and a second surface opposite to the first surface. At least two rows of pads are disposed adjacent to the first surface of the interposer element. The interposer element includes at least one slot disposed between the two rows of pads and extending from the first surface to the second surface, wherein a projection area extending from an edge of the slot to an edge of the first surface of the interpose element is nonoverlapping at least one pad.

Abstract: A process of manufacturing a foam molded article includes opening an open-closed molding system; applying a release agent into a female cavity section of the molding system; injecting PU into the female cavity section; closing the molding system; placing the closed molding system in a foaming device; activating the foaming device to heat the PU; forming a plurality of interconnecting first air pockets in an air permeable foam core of a foam molded article to be formed; forming a plurality of interconnecting second air pockets in each of a top surface and a bottom surface of the foam molded article respectively by involving a chemical reaction with the release agent wherein the second air pockets are in air communication with the first air pockets; opening the molding system; and removing the finished foam molded article from the molding system.

Abstract: A ladder includes: a ladder frame with a plurality of side rails and a plurality of ladder steps connected to the side rails; a plurality of legs mounted on the side rails, respectively, and adjustable for adjusting the overall length of each of the side rails and the respective one of the legs, each of the legs having a lower end; a plurality of shoes, each of which is pivoted to the lower end of a respective one of the legs, each of which has a bottom plate spaced apart from and disposed below the lower end of the respective one of the legs, and each of which is pivotable relative to the respective one of the legs; and a plurality of fasteners for retaining each of the shoes at a desired angular position relative to the respective one of the legs.