Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.

Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.

Abstract: The present invention discloses an optical bandpass filter structure targeting an arbitrary combination of the spectral ranges of R (red), G (green), B (blue) and IR (infrared) light, which comprises a substrate that is a wafer-based semiconductor sensing element, and a filter layer that is formed on one side of the substrate. The filter layer includes a plurality of basic units organized as a two-dimensional array, in which each of the basic units is composed of a plurality of pixel filter films fabricated by a vacuum coating method.

Abstract: An optical filter structure of an arbitrary combination of UV, R, G, B, and IR includes a substrate and a filter layer. The substrate is a wafer semiconductor sensor device and a product of light-transmitting device. The filter layer is formed on a surface of the substrate and is formed of a plurality of basic units arranged in an array. Each of the basic units includes a plurality of pixel filter films formed through vacuum coating, and the plurality of pixel filter films include an arbitrary combination of multiple ones of a UV pixel filter film, an R pixel filter film, a G pixel filter film, a B pixel filter film, and an IR pixel filter film, such that the plurality of pixel filter films allow light of corresponding wavelengths to pass therethrough.

Abstract: An infrared-cut filter structure is disclosed. The infrared-cut filter structure uses a glass substrate having an upper side and a lower side, with a first multilayer film formed on the upper side and a second multilayer film formed on the lower side so that the infrared-cut filter can effectively filter out infrared light and transmit visible light to produce normal colored images.

Abstract: An infrared-cut filter structure is disclosed. The infrared-cut filter structure uses a glass substrate having an upper side and a lower side, with a first multilayer film formed on the upper side and a second multilayer film formed on the lower side so that the infrared-cut filter can effectively filter out infrared light and transmit visible light to produce normal colored images.

Abstract: An infrared-cut filter structure is disclosed. The infrared-cut filter structure uses a glass substrate having an upper side and a lower side, with a first multilayer film formed on the upper side and a second multilayer film formed on the lower side so that the infrared-cut filter can effectively filter out infrared light and transmit visible light to produce normal colored images.

Abstract: The present invention discloses an optical bandpass filter structure targeting an arbitrary combination of the spectral ranges of R (red), G (green), B (blue) and IR (infrared) light, which comprises a substrate that is a wafer-based semiconductor sensing element, and a filter layer that is formed on one side of the substrate. The filter layer includes a plurality of basic units organized as a two-dimensional array, in which each of the basic units is composed of a plurality of pixel filter films fabricated by a vacuum coating method.

Abstract: An infrared bandpass filter structure is formed by alternately stacking a plurality of silicon aluminum hydride layers and a plurality of low-refractive-index layers. The plurality of low-refractive-index layers include oxide. The infrared bandpass filter structure has a pass band that at least partly overlaps the wavelength range of 800 nm-1600 nm. The pass band have a center wavelength, and the center wavelength has a magnitude of shift that is less than 11 nm when an incident angle changes from 0° to 30. An infrared bandpass filter includes the infrared bandpass filter structure formed on a first side surface of a substrate and an antireflection layer formed on a second side surface of the substrate that is at a side opposite to the first side surface.

Abstract: An infrared bandpass filter structure is formed by alternately stacking a plurality of silicon aluminum hydride layers and a plurality of low-refractive-index layers. The plurality of low-refractive-index layers include oxide. The infrared bandpass filter structure has a pass band that at least partly overlaps the wavelength range of 800 nm-1600 nm. The pass band have a center wavelength, and the center wavelength has a magnitude of shift that is less than 11 nm when an incident angle changes from 0° to 30. An infrared bandpass filter includes the infrared bandpass filter structure formed on a first side surface of a substrate and an antireflection layer formed on a second side surface of the substrate that is at a side opposite to the first side surface.

Abstract: A backlight module for light-emitting keyboard includes light guide plate having reflective surface, opposing light-emitting surface and plurality of recessed dots located on reflective surface to create optical path of continuous wave-like reflecting portion for facing toward key switch unit in light-emitting keyboard. The spacing between the centers of each two adjacent recessed dots is smaller than or equal to diameter of one single recessed dot. The continuous wave-like reflecting portion exhibits a continuous ring-shaped pattern formed of a series of ring-shaped square waves, triangular waves, sawtooth waves or sine waves and consisting of at least one different cycle waveforms having varying cycle periods, amplitudes or peak-to-peak values that are interleaved in regular or irregular manner.

Abstract: A backlight module for light-emitting keyboard includes light guide plate having reflective surface, opposing light-emitting surface and plurality of recessed dots located on reflective surface to create optical path of continuous wave-like reflecting portion for facing toward key witch unit in light-emitting keyboard. The spacing between the centers of each two adjacent recessed dots is smaller than or equal to diameter of one single recessed dot. The continuous wave-like reflecting portion exhibits a continuous ring-shaped pattern formed of a series of ring-shaped square waves, triangular waves, sawtooth waves or sine waves and consisting of at least one different cycle waveforms having varying cycle periods, amplitudes or peak-to-peak values that are interleaved in regular or irregular manner.