Patents by Inventor Wei-Heng Lin

Wei-Heng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250189720
    Abstract: An optical waveguide includes a first portion, a second portion, and a third portion. The first portion includes an input port configured to allow an input optical signal of a first propagation direction entering therefrom. The second portion includes a taper waveguide portion configured to expanding the input optical signal and a rectangular waveguide portion configure to split the input optical signal, where the rectangular waveguide portion is connected to the taper waveguide portion. The third portion includes at least one output port configured to allow an output optical signal of an output propagation direction exiting therefrom, where the output propagation direction is different from the first propagation direction. The second portion is sandwiched between the first portion and the third portion.
    Type: Application
    Filed: December 7, 2023
    Publication date: June 12, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hao Fann, Wei-Heng Lin, Hsing-Kuo Hsia, Chen-Hua Yu, Tien-Lin Shen
  • Publication number: 20250110360
    Abstract: An embodiment photonic device may include a first terminal including silicon and a second terminal including polysilicon. The first terminal may be configured as a first three-dimensional structure extending along a first direction and having a first U-shaped portion in a first cross-sectional plane perpendicular to the first direction. Similarly, the second terminal may be configured as a second three-dimensional structure extending along the first direction and having a second U-shaped portion in the first cross-sectional plane. The photonic device may further include a capacitor dielectric layer disposed between the first terminal and the second terminal and a cladding dielectric layer surrounding the first terminal and the second terminal. The first U-shaped portion and the second U-shaped portion may be arranged in an interlocking configuration having an overlapping region that is configured as an optical transmission line in which the first direction is an optical propagation direction.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Inventors: Tien-Lin Shen, Ming Lee, Wei-Heng Lin, Hsing-Kuo Hsia, Chen-Hua Yu
  • Publication number: 20250085474
    Abstract: An optical beam splitter includes a multi-stage nested network of waveguide bifurcation branches, which includes: first-stage waveguide bifurcation branches each including a pair of first-stage waveguide segments, and second-stage waveguide bifurcation branches each including a pair of second-stage waveguide segments. Each pair of first-stage waveguide segments includes a first common end and a pair of first split ends and a pair of first interconnection portions. Each first common end points toward a first widthwise direction. Each pair of second-stage waveguide segments includes a second common end and a pair of second split ends and a pair of second interconnection portions. Each second common end and each second split end of the optical beam splitter point toward a second widthwise direction which is an opposite direction of the first widthwise direction.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 13, 2025
    Inventors: Chun-Hao Fann, Ming Lee, Wei-Heng Lin, Hsing-Kuo Hsia, Chen-Hua Yu
  • Publication number: 20240377660
    Abstract: An optical device and method of manufacture is presented. In embodiments a method includes forming a first layer of optical material, patterning the first layer into a stair-step pattern, depositing a dielectric material onto the stair-step pattern, and forming a second layer of optical material over the dielectric material and at least partially within the stair-step pattern.
    Type: Application
    Filed: January 2, 2024
    Publication date: November 14, 2024
    Inventors: Ming Lee, Tien-Lin Shen, Wei-Heng Lin, Hsing-Kuo Hsia, Chen-Hua Yu
  • Publication number: 20240377662
    Abstract: An optical device and methods of manufacturing such optical devices are presented. In embodiments the optical device is a tunable beam splitter which is made by forming a first dopant region over a substrate, the first dopant region comprising a first waveguide and a second waveguide, depositing a cladding material over the first waveguide and the second waveguide, and forming a second dopant region overlying the first waveguide and the second waveguide, wherein the forming the second dopant region comprises forming a first region extending over both the first waveguide and the second waveguide, the first region having a constant concentration of a first dopant.
    Type: Application
    Filed: January 17, 2024
    Publication date: November 14, 2024
    Inventors: Ming Lee, Tien-Lin Shen, Wei-Heng Lin, Hsing-Kuo Hsia, Chen-Hua Yu
  • Publication number: 20240332807
    Abstract: An antenna device includes a radio frequency die, a molding compound, a feeding line, and a radiating element. The molding compound laterally surrounds the radio frequency die. The feeding line is over the radio frequency die. The radiating element is over the feeding line and electrically coupled to the RF die.
    Type: Application
    Filed: June 12, 2024
    Publication date: October 3, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chuei-Tang WANG, Chung-Hao TSAI, Jeng-Shien HSIEH, Wei-Heng LIN, Kuo-Chung YEE, Chen-Hua YU
  • Patent number: 12040566
    Abstract: An antenna device includes a radio frequency (RF) die, a first dielectric layer, a feeding line, a ground line, a second dielectric layer, and a radiating element. The first dielectric layer is over the RF die. The feeding line is in the first dielectric layer and is connected to the RF die. The ground line is in the first dielectric layer and is spaced apart from the feeding line. The second dielectric layer covers the first dielectric layer. The radiating element is over the second dielectric layer and is not in physically contact with the feeding line.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: July 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu
  • Publication number: 20220384958
    Abstract: An antenna device includes a radio frequency (RF) die, a first dielectric layer, a feeding line, a ground line, a second dielectric layer, and a radiating element. The first dielectric layer is over the RF die. The feeding line is in the first dielectric layer and is connected to the RF die. The ground line is in the first dielectric layer and is spaced apart from the feeding line. The second dielectric layer covers the first dielectric layer. The radiating element is over the second dielectric layer and is not in physically contact with the feeding line.
    Type: Application
    Filed: August 10, 2022
    Publication date: December 1, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chuei-Tang WANG, Chung-Hao TSAI, Jeng-Shien HSIEH, Wei-Heng LIN, Kuo-Chung YEE, Chen-Hua YU
  • Patent number: 11482788
    Abstract: An antenna device includes a package, a radiating element, and a director. The package includes a radio frequency (RF) die and a molding compound in contact with a sidewall of the RF die. The radiating element is in the molding compound and electrically coupled to the RF die. The director is in the molding compound, wherein the radiating element is between the director and the RF die, and a top of the radiating element is substantially coplanar with a top of the director.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: October 25, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu
  • Publication number: 20200411996
    Abstract: An antenna device includes a package, a radiating element, and a director. The package includes a radio frequency (RF) die and a molding compound in contact with a sidewall of the RF die. The radiating element is in the molding compound and electrically coupled to the RF die. The director is in the molding compound, wherein the radiating element is between the director and the RF die, and a top of the radiating element is substantially coplanar with a top of the director.
    Type: Application
    Filed: September 4, 2020
    Publication date: December 31, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chuei-Tang WANG, Chung-Hao TSAI, Jeng-Shien HSIEH, Wei-Heng LIN, Kuo-Chung YEE, Chen-Hua YU
  • Patent number: 10854580
    Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: December 1, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Wei-Heng Lin, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
  • Patent number: 10770795
    Abstract: An antenna device includes a package and at least one antenna. The package includes at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die. The antenna has at least one conductor at least partially in the molding compound and operatively connected to the RF die.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: September 8, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu
  • Publication number: 20190393197
    Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.
    Type: Application
    Filed: September 9, 2019
    Publication date: December 26, 2019
    Inventors: WEI-HENG LIN, TUNG-LIANG SHAO, CHIH-HANG TUNG, CHEN-HUA YU
  • Patent number: 10468385
    Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: November 5, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Wei-Heng Lin, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
  • Publication number: 20190164937
    Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.
    Type: Application
    Filed: November 29, 2017
    Publication date: May 30, 2019
    Inventors: WEI-HENG LIN, TUNG-LIANG SHAO, CHIH-HANG TUNG, CHEN-HUA YU
  • Patent number: 10153239
    Abstract: A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: December 11, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Jeng-Shien Hsieh, Wei-Heng Lin
  • Publication number: 20170346185
    Abstract: An antenna device includes a package and at least one antenna. The package includes at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die. The antenna has at least one conductor at least partially in the molding compound and operatively connected to the RF die.
    Type: Application
    Filed: August 23, 2016
    Publication date: November 30, 2017
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chuei-Tang WANG, Chung-Hao TSAI, Jeng-Shien HSIEH, Wei-Heng LIN, Kuo-Chung YEE, Chen-Hua YU
  • Publication number: 20170338195
    Abstract: A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.
    Type: Application
    Filed: August 4, 2017
    Publication date: November 23, 2017
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Jeng-Shien Hsieh, Wei-Heng Lin
  • Patent number: 9735118
    Abstract: A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: August 15, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Jeng-Shien Hsieh, Wei-Heng Lin
  • Publication number: 20170162524
    Abstract: A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.
    Type: Application
    Filed: December 4, 2015
    Publication date: June 8, 2017
    Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Jeng-Shien Hsieh, Wei-Heng Lin