Patents by Inventor Wei-Heng Lin
Wei-Heng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250189720Abstract: An optical waveguide includes a first portion, a second portion, and a third portion. The first portion includes an input port configured to allow an input optical signal of a first propagation direction entering therefrom. The second portion includes a taper waveguide portion configured to expanding the input optical signal and a rectangular waveguide portion configure to split the input optical signal, where the rectangular waveguide portion is connected to the taper waveguide portion. The third portion includes at least one output port configured to allow an output optical signal of an output propagation direction exiting therefrom, where the output propagation direction is different from the first propagation direction. The second portion is sandwiched between the first portion and the third portion.Type: ApplicationFiled: December 7, 2023Publication date: June 12, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Hao Fann, Wei-Heng Lin, Hsing-Kuo Hsia, Chen-Hua Yu, Tien-Lin Shen
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Publication number: 20250110360Abstract: An embodiment photonic device may include a first terminal including silicon and a second terminal including polysilicon. The first terminal may be configured as a first three-dimensional structure extending along a first direction and having a first U-shaped portion in a first cross-sectional plane perpendicular to the first direction. Similarly, the second terminal may be configured as a second three-dimensional structure extending along the first direction and having a second U-shaped portion in the first cross-sectional plane. The photonic device may further include a capacitor dielectric layer disposed between the first terminal and the second terminal and a cladding dielectric layer surrounding the first terminal and the second terminal. The first U-shaped portion and the second U-shaped portion may be arranged in an interlocking configuration having an overlapping region that is configured as an optical transmission line in which the first direction is an optical propagation direction.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Inventors: Tien-Lin Shen, Ming Lee, Wei-Heng Lin, Hsing-Kuo Hsia, Chen-Hua Yu
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Publication number: 20250085474Abstract: An optical beam splitter includes a multi-stage nested network of waveguide bifurcation branches, which includes: first-stage waveguide bifurcation branches each including a pair of first-stage waveguide segments, and second-stage waveguide bifurcation branches each including a pair of second-stage waveguide segments. Each pair of first-stage waveguide segments includes a first common end and a pair of first split ends and a pair of first interconnection portions. Each first common end points toward a first widthwise direction. Each pair of second-stage waveguide segments includes a second common end and a pair of second split ends and a pair of second interconnection portions. Each second common end and each second split end of the optical beam splitter point toward a second widthwise direction which is an opposite direction of the first widthwise direction.Type: ApplicationFiled: September 8, 2023Publication date: March 13, 2025Inventors: Chun-Hao Fann, Ming Lee, Wei-Heng Lin, Hsing-Kuo Hsia, Chen-Hua Yu
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Publication number: 20240377660Abstract: An optical device and method of manufacture is presented. In embodiments a method includes forming a first layer of optical material, patterning the first layer into a stair-step pattern, depositing a dielectric material onto the stair-step pattern, and forming a second layer of optical material over the dielectric material and at least partially within the stair-step pattern.Type: ApplicationFiled: January 2, 2024Publication date: November 14, 2024Inventors: Ming Lee, Tien-Lin Shen, Wei-Heng Lin, Hsing-Kuo Hsia, Chen-Hua Yu
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Publication number: 20240377662Abstract: An optical device and methods of manufacturing such optical devices are presented. In embodiments the optical device is a tunable beam splitter which is made by forming a first dopant region over a substrate, the first dopant region comprising a first waveguide and a second waveguide, depositing a cladding material over the first waveguide and the second waveguide, and forming a second dopant region overlying the first waveguide and the second waveguide, wherein the forming the second dopant region comprises forming a first region extending over both the first waveguide and the second waveguide, the first region having a constant concentration of a first dopant.Type: ApplicationFiled: January 17, 2024Publication date: November 14, 2024Inventors: Ming Lee, Tien-Lin Shen, Wei-Heng Lin, Hsing-Kuo Hsia, Chen-Hua Yu
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Publication number: 20240332807Abstract: An antenna device includes a radio frequency die, a molding compound, a feeding line, and a radiating element. The molding compound laterally surrounds the radio frequency die. The feeding line is over the radio frequency die. The radiating element is over the feeding line and electrically coupled to the RF die.Type: ApplicationFiled: June 12, 2024Publication date: October 3, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chuei-Tang WANG, Chung-Hao TSAI, Jeng-Shien HSIEH, Wei-Heng LIN, Kuo-Chung YEE, Chen-Hua YU
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Patent number: 12040566Abstract: An antenna device includes a radio frequency (RF) die, a first dielectric layer, a feeding line, a ground line, a second dielectric layer, and a radiating element. The first dielectric layer is over the RF die. The feeding line is in the first dielectric layer and is connected to the RF die. The ground line is in the first dielectric layer and is spaced apart from the feeding line. The second dielectric layer covers the first dielectric layer. The radiating element is over the second dielectric layer and is not in physically contact with the feeding line.Type: GrantFiled: August 10, 2022Date of Patent: July 16, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu
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Publication number: 20220384958Abstract: An antenna device includes a radio frequency (RF) die, a first dielectric layer, a feeding line, a ground line, a second dielectric layer, and a radiating element. The first dielectric layer is over the RF die. The feeding line is in the first dielectric layer and is connected to the RF die. The ground line is in the first dielectric layer and is spaced apart from the feeding line. The second dielectric layer covers the first dielectric layer. The radiating element is over the second dielectric layer and is not in physically contact with the feeding line.Type: ApplicationFiled: August 10, 2022Publication date: December 1, 2022Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chuei-Tang WANG, Chung-Hao TSAI, Jeng-Shien HSIEH, Wei-Heng LIN, Kuo-Chung YEE, Chen-Hua YU
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Patent number: 11482788Abstract: An antenna device includes a package, a radiating element, and a director. The package includes a radio frequency (RF) die and a molding compound in contact with a sidewall of the RF die. The radiating element is in the molding compound and electrically coupled to the RF die. The director is in the molding compound, wherein the radiating element is between the director and the RF die, and a top of the radiating element is substantially coplanar with a top of the director.Type: GrantFiled: September 4, 2020Date of Patent: October 25, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu
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Publication number: 20200411996Abstract: An antenna device includes a package, a radiating element, and a director. The package includes a radio frequency (RF) die and a molding compound in contact with a sidewall of the RF die. The radiating element is in the molding compound and electrically coupled to the RF die. The director is in the molding compound, wherein the radiating element is between the director and the RF die, and a top of the radiating element is substantially coplanar with a top of the director.Type: ApplicationFiled: September 4, 2020Publication date: December 31, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chuei-Tang WANG, Chung-Hao TSAI, Jeng-Shien HSIEH, Wei-Heng LIN, Kuo-Chung YEE, Chen-Hua YU
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Patent number: 10854580Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.Type: GrantFiled: September 9, 2019Date of Patent: December 1, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wei-Heng Lin, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
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Patent number: 10770795Abstract: An antenna device includes a package and at least one antenna. The package includes at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die. The antenna has at least one conductor at least partially in the molding compound and operatively connected to the RF die.Type: GrantFiled: August 23, 2016Date of Patent: September 8, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu
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Publication number: 20190393197Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.Type: ApplicationFiled: September 9, 2019Publication date: December 26, 2019Inventors: WEI-HENG LIN, TUNG-LIANG SHAO, CHIH-HANG TUNG, CHEN-HUA YU
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Patent number: 10468385Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.Type: GrantFiled: November 29, 2017Date of Patent: November 5, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wei-Heng Lin, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
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Publication number: 20190164937Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.Type: ApplicationFiled: November 29, 2017Publication date: May 30, 2019Inventors: WEI-HENG LIN, TUNG-LIANG SHAO, CHIH-HANG TUNG, CHEN-HUA YU
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Patent number: 10153239Abstract: A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.Type: GrantFiled: August 4, 2017Date of Patent: December 11, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Jeng-Shien Hsieh, Wei-Heng Lin
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Publication number: 20170346185Abstract: An antenna device includes a package and at least one antenna. The package includes at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die. The antenna has at least one conductor at least partially in the molding compound and operatively connected to the RF die.Type: ApplicationFiled: August 23, 2016Publication date: November 30, 2017Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chuei-Tang WANG, Chung-Hao TSAI, Jeng-Shien HSIEH, Wei-Heng LIN, Kuo-Chung YEE, Chen-Hua YU
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Publication number: 20170338195Abstract: A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.Type: ApplicationFiled: August 4, 2017Publication date: November 23, 2017Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Jeng-Shien Hsieh, Wei-Heng Lin
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Patent number: 9735118Abstract: A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.Type: GrantFiled: December 4, 2015Date of Patent: August 15, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Jeng-Shien Hsieh, Wei-Heng Lin
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Publication number: 20170162524Abstract: A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.Type: ApplicationFiled: December 4, 2015Publication date: June 8, 2017Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Jeng-Shien Hsieh, Wei-Heng Lin