Patents by Inventor Wei Hing Tan

Wei Hing Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220173020
    Abstract: An electrical connection structure includes a first metallic lead having a first contact area, a second metallic lead having a second contact area, and a connection region connecting the first and second leads with each other. The connection region includes a trench. The trench includes a planar rectangular horizontal floor surface and vertical walls adjacent to the planar rectangular floor surface.
    Type: Application
    Filed: December 1, 2021
    Publication date: June 2, 2022
    Inventors: Wee Boon Tay, Wei Hing Tan, Hooi Boon Teoh
  • Patent number: 10147703
    Abstract: In some examples, a device includes a power supply element and a reference voltage element, wherein the reference voltage element is electrically isolated from the power supply element. The device further includes a high-side semiconductor die including at least two high-side transistors, wherein each high-side transistor of the at least two high-side transistors is electrically connected to the power supply element. The device also includes a low-side semiconductor die including at least two low-side transistors, wherein each low-side transistor of the at least two low-side transistors is electrically connected to the reference voltage element. The device includes at least two switching elements, wherein each switching element of the at least two switching elements is electrically connected to a respective high-side transistor of the at least two high-side transistors and to a respective low-side transistor of the at least two low-side transistors.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: December 4, 2018
    Assignee: Infineon Technologies AG
    Inventors: Stefan Macheiner, Amirul Afiq Hud, Teck Sim Lee, Thomas Stoek, Lee Shuang Wang, Chooi Mei Chong, Wei Hing Tan
  • Publication number: 20180277513
    Abstract: In some examples, a device includes a power supply element and a reference voltage element, wherein the reference voltage element is electrically isolated from the power supply element. The device further includes a high-side semiconductor die including at least two high-side transistors, wherein each high-side transistor of the at least two high-side transistors is electrically connected to the power supply element. The device also includes a low-side semiconductor die including at least two low-side transistors, wherein each low-side transistor of the at least two low-side transistors is electrically connected to the reference voltage element. The device includes at least two switching elements, wherein each switching element of the at least two switching elements is electrically connected to a respective high-side transistor of the at least two high-side transistors and to a respective low-side transistor of the at least two low-side transistors.
    Type: Application
    Filed: March 24, 2017
    Publication date: September 27, 2018
    Inventors: Stefan Macheiner, Amirul Afiq Hud, Teck Sim Lee, Thomas Stoek, Lee Shuang Wang, Chooi Mei Chong, Wei Hing Tan