Abstract: Provided herein are safe harbor loci that can be utilized as sites for genetic modification. Safe harbor loci of the disclosure are shown to support sustained transgene expression with minimal silencing, and minimal impact on local or global gene expression. Safe harbor loci disclosed herein can be used in various genetic and cell engineering applications.

Abstract: The present invention relates to a method for carbon dioxide capture and concentration by partitioned multistage circulation based on mass transfer-reaction regulation. In the present invention, multiple means such as multistage circulating absorption, intelligent multi-factor regulation, pre-washing and cooling, inter-stage cooling, post-stage washing, slurry cleaning, cooling water waste heat utilization, small-particle-size and high-density spraying, external strengthening field such as a thermal field/ultrasonic field/electric field, and catalysis by composite catalyst are adopted, so that the target for low cost, low energy consumption, stability and high efficiency is realized. The secondary pollutants are effectively inhibited while carbon dioxide is efficiently captured; meanwhile, high-efficiency capture, low-energy desorption, and high-purity concentration of carbon dioxide are implemented.

Abstract: A method in which connectivity tests of integrated circuit structures in a die are performed. The connectivity tests are performed at a first level of the die. Potential defect locations are identified in the die indicating via locations susceptible to systematic failure due to via opens or via shorts. The potential defect locations are translated to via locations for a second level of the die. The second level is below the first level. After translating the hot spot, the second level is inspected for defects. The via locations on the first level are inspected for defects. All defects for the second level are translated to the via locations for the first level. A net trace of defects is created using prior level subtraction of the translated defects for the second level and the defects for the first level.

Abstract: A method and apparatus for separating real DVC via defects from nuisance based on Net Tracing Classification of eBeam VC die comparison inspection results are provided. Embodiments include performing an eBeam VC die comparison inspection on each via of a plurality of dies; determining DVC vias based on the comparison; performing a Net Tracing Classification on the DVC vias; determining S/D DVC vias based on the Net Tracing Classification; and performing a die repeater analysis on the S/D DVC vias to determine systematic design-related DVC via defects.

Abstract: A method in which connectivity tests of integrated circuit structures in a die are performed. The connectivity tests are performed at a first level of the die. Potential defect locations are identified in the die indicating via locations susceptible to systematic failure due to via opens or via shorts. The potential defect locations are translated to via locations for a second level of the die. The second level is below the first level. After translating the hot spot, the second level is inspected for defects. The via locations on the first level are inspected for defects. All defects for the second level are translated to the via locations for the first level. A net trace of defects is created using prior level subtraction of the translated defects for the second level and the defects for the first level.

Abstract: A method and apparatus for separating real DVC via defects from nuisance based on Net Tracing Classification of eBeam VC die comparison inspection results are provided. Embodiments include performing an eBeam VC die comparison inspection on each via of a plurality of dies; determining DVC vias based on the comparison; performing a Net Tracing Classification on the DVC vias; determining S/D DVC vias based on the Net Tracing Classification; and performing a die repeater analysis on the S/D DVC vias to determine systematic design-related DVC via defects.