Patents by Inventor WEI-HSIANG HSIAO

WEI-HSIANG HSIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Immersion cooling system and server system having the same
    Patent number: 11547021
    Abstract: An immersion cooling system includes a receiving member, a heat dissipation channel, and a heat sink. The receiving member is filled with coolant. The receiving member is connected to an end of the heat sink, and heat-generating entities such as one or more servers are positioned in a cavity of the receiving member. The heat dissipation channel is connected to the cavity and is connected to the heat sink. The heat dissipation channel communicates with the cavity and allows circulation of the coolant in the channel, the heat sink cooling down the coolant flowing into heat dissipation channel from the cavity. The immersion cooling system is compact, occupies very little space, and is easily installed, maintained, and moved. A server system having the immersion cooling system is also disclosed.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: January 3, 2023
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Wei-Hsiang Hsiao, Ying-Tso Lai
  • IMMERSION COOLING SYSTEM AND SERVER SYSTEM HAVING THE SAME
    Publication number: 20220151111
    Abstract: An immersion cooling system includes a receiving member, a heat dissipation channel, and a heat sink. The receiving member is filled with coolant. The receiving member is connected to an end of the heat sink, and heat-generating entities such as one or more servers are positioned in a cavity of the receiving member. The heat dissipation channel is connected to the cavity and is connected to the heat sink. The heat dissipation channel communicates with the cavity and allows circulation of the coolant in the channel, the heat sink cooling down the coolant flowing into heat dissipation channel from the cavity. The immersion cooling system is compact, occupies very little space, and is easily installed, maintained, and moved. A server system having the immersion cooling system is also disclosed.
    Type: Application
    Filed: April 29, 2021
    Publication date: May 12, 2022
    Inventors: WEI-HSIANG HSIAO, YING-TSO LAI