Abstract: A semiconductor structure includes a source/drain feature in the semiconductor layer. The semiconductor structure includes a dielectric layer over the source/drain feature. The semiconductor structure includes a silicide layer over the source/drain feature. The semiconductor structure includes a barrier layer over the silicide layer. The semiconductor structure includes a seed layer over the barrier layer. The semiconductor structure includes a metal layer between a sidewall of the seed layer and a sidewall of the dielectric layer, a sidewall of each of the silicide layer, the barrier layer, and the metal layer directly contacting the sidewall of the dielectric layer. The semiconductor structure includes a source/drain contact over the seed layer.

Abstract: An optical element driving mechanism is provided, including a fixed part, a movable part, a metallic member and a driving assembly. The fixed part includes a base. The movable part is movably connected to the fixed part, and carries an optical element, the optical element has an optical axis. The metallic member is disposed on the base, and includes an inner electrical connection part and an outer electrical connection part, the inner electrical connection part and the outer electrical connection part are connected to each other. The driving assembly includes at least one driving magnetic element and drives the movable part to move relative to the fixed part.

Abstract: Provided are a silicon carbide crystal growth device and a quality control method. The device includes: an annealing unit, a crystal growth unit, an atmosphere control unit, and a transport system; the atmosphere control unit provides a gas environment with low water, oxygen and nitrogen; the transport system transports a plurality of target objects after high-temperature purification by the annealing unit to the atmosphere control unit; after assembling silicon carbide seed crystal and silicon carbide powder in a graphite crucible and covering with thermal insulation material to form a container inside the atmosphere control unit, the transport system transports the container to the crystal growth unit. The method uses a weighing system in a chamber of the crystal growth unit to detect a weight change of silicon carbide seed crystal and silicon carbide powder during a crystal growth process through a plurality of weight sensors of the weighing system.

Abstract: A system includes a cooler, a concentration meter, a first pump and a second pump. The cooler is configured to cool first liquid by second liquid in the cooler. The concentration meter is configured to measure a concentration of the first liquid. The first pump is configured to move the first liquid according to the concentration. The second pump is coupled to the cooler, disposed with the first pump in a parallel manner, and configured to move the second liquid.

Abstract: A system includes a cooler, a concentration meter, a first pump and a second pump. The cooler is configured to cool first liquid by second liquid in the cooler. The concentration meter is configured to measure a concentration of the first liquid. The first pump is configured to move the first liquid according to the concentration. The second pump is coupled to the cooler, disposed with the first pump in a parallel manner, and configured to move the second liquid.

Abstract: A system includes a cleaning device and a concentration measuring device. The cleaning device includes a first pipe and a first pump. The first pump is configured to move first liquid in the first pipe. Two terminals of the first pump are respectively coupled to the first pipe. The concentration measuring device includes a tube, a cooler, a concentration meter and a second pump. The tube is coupled to the first pipe, and is configured to retrieve the first liquid. The cooler covers the tube to cool the first liquid. The concentration meter is configured to measure a concentration of the first liquid cooled by the cooler. The second pump is coupled to the tube, and is configured to move the first liquid according to the concentration.

Abstract: A communication device includes a wireless communication module, a frame element, and a fixing assembly. The frame element includes a bottom plate and a side plate connected to the bottom plate, and the side plate includes a fixing hole. The fixing assembly includes a first fixing element. The first fixing element includes a first connection portion and a first fixing portion. The first connection portion is adapted to be fixed to the wireless communication module, and the first fixing portion includes a first neck portion and a first protruding portion. The first neck portion is adapted to be in the fixing hole, and the first neck portion is connected between the first connection portion and the first protruding portion. Hence, the fixing component fixes the wireless communication module with the frame element.

Abstract: A system includes a cleaning device and a concentration measuring device. The cleaning device includes a first pipe and a first pump. The first pump is configured to move first liquid in the first pipe. Two terminals of the first pump are respectively coupled to the first pipe. The concentration measuring device includes a tube, a cooler, a concentration meter and a second pump. The tube is coupled to the first pipe, and is configured to retrieve the first liquid. The cooler covers the tube to cool the first liquid. The concentration meter is configured to measure a concentration of the first liquid cooled by the cooler. The second pump is coupled to the tube, and is configured to move the first liquid according to the concentration.

Abstract: A system is disclosed herein. The system includes a tank, a tube, a cooler, and a concentration meter. The tank is configured to contain first liquid. The tube is coupled to the tank and configured to convey the first liquid from the tank. The cooler covers the tube to cool the first liquid conveyed by the tube. The concentration meter is configured to measure a concentration of the first liquid cooled by the cooler.

Abstract: A signal processing system includes an analog-to-digital converter (ADC) that is used to convert a first analog value into a first digital value and convert a second analog value into a second digital value. The ADC includes a first digital-to-analog converter (DAC) circuit and a second DAC circuit operating in different voltage domains. A first bit segment and a second bit segment of each digital value are determined via the first DAC circuit and the second DAC circuit, respectively. An analog injection value is injected to the second analog value, the analog injection value is converted from a digital injection value formed by a subset of bits of the second bit segment of the first digital value, and the second bit segment of the second digital value is derived from injecting the digital injection value to a digital value determined by the second DAC circuit.

Abstract: A positive and negative electrode material and a preparation method thereof are provided. The positive and negative electrode material includes a powder, a first seed growth layer and a second graft growth layer. A material of the powder includes graphite, silicon based material, lithium titanate, tin oxide, tin alloy, lithium nickel cobalt manganese oxide, lithium nickel cobalt aluminum oxide or lithium iron phosphate. The first seed growth layer is formed radially on a surface of the powder, and the second graft growth layer is radially connected to the first seed growth layer.

Abstract: An electronic device and a connection mechanism thereof are provided. The connection mechanism includes a first assembly and a second assembly. The first assembly has a first body, a first pivot portion and a limiting portion. The first body is connected to the first pivot portion and the limiting portion. The limiting portion has an accommodation slot and a notch. The second assembly has a second body, a second pivot portion and a blocker. The second body is connected to the second pivot portion and the blocker. The first assembly and the second assembly are pivotally connected with each other by the first pivot portion and the second pivot portion. The first assembly and the second assembly are engagable with each other by the blocker and the notch.

Abstract: A signal processing system includes an analog-to-digital converter (ADC) that is used to convert a first analog value into a first digital value and convert a second analog value into a second digital value. The ADC includes a first digital-to-analog converter (DAC) circuit and a second DAC circuit operating in different voltage domains. A first bit segment and a second bit segment of each digital value are determined via the first DAC circuit and the second DAC circuit, respectively. An analog injection value is injected to the second analog value, the analog injection value is converted from a digital injection value formed by a subset of bits of the second bit segment of the first digital value, and the second bit segment of the second digital value is derived from injecting the digital injection value to a digital value determined by the second DAC circuit.

Abstract: A system is disclosed herein. The system includes a tank, a tube, a cooler, and a concentration meter. The tank is configured to contain first liquid. The tube is coupled to the tank and configured to convey the first liquid from the tank. The cooler covers the tube to cool the first liquid conveyed by the tube. The concentration meter is configured to measure a concentration of the first liquid cooled by the cooler.

Abstract: An electronic device and a connection mechanism thereof are provided. The connection mechanism includes a first assembly and a second assembly. The first assembly has a first body, a first pivot portion and a limiting portion. The first body is connected to the first pivot portion and the limiting portion. The limiting portion has an accommodation slot and a notch. The second assembly has a second body, a second pivot portion and a blocker. The second body is connected to the second pivot portion and the blocker. The first assembly and the second assembly are pivotally connected with each other by the first pivot portion and the second pivot portion. The first assembly and the second assembly are engagable with each other by the blocker and the notch.

Abstract: A wafer includes a first set of dies and a second set of dies. The wafer further includes a scribe line separating the first set of dies from the second set of dies, wherein the scribe line has a first width. The wafer further includes a plurality of trenches between adjacent dies of the first set of dies and connected to the scribe line, wherein the plurality of trenches has a second width less than the first width, and a depth of each trench of the plurality of trenches is less than a thickness of the wafer.

Abstract: A storage structure includes a cover, a main body, and a movable element. The main body includes a first board and a cavity. The first board has a first opening. The cover connects to the main body. The movable element is accommodated in the cavity and selectively disposed in the first opening.

Abstract: Multiple slots are disposed on a chassis, and a fabric card is disposed in one of the slots. The fabric card includes following units. A first baseboard management controller (BMC) includes multiple pins. A first processor is coupled to the first BMC and obtains a first BMC identification (ID) of the first BMC by at least one pin of the first BMC. A second BMC also includes multiple pins. A second processor is coupled to the second BMC and obtains a second BMC ID of the second BMC by at least one pin of the second BMC. The first BMC ID is different from the second BMC ID.

Abstract: A wafer includes a first set of dies and a second set of dies. The wafer further includes a scribe line separating the first set of dies from the second set of dies, wherein the scribe line has a first width. The wafer further includes a plurality of trenches between adjacent dies of the first set of dies and connected to the scribe line, wherein the plurality of trenches has a second width less than the first width, and a depth of each trench of the plurality of trenches is less than a thickness of the wafer.

Abstract: A method of partitioning a wafer includes defining a scribe line surrounding a set of dies. The method further includes etching a plurality of trenches into the wafer, wherein each trench of the plurality of trenches is located between adjacent dies of the set of dies, and a width of each trench of the plurality of trenches is less than a width of the scribe line. The method further includes thinning the wafer to expose a bottom surface of the plurality of trenches. The method further includes cutting along the scribe line to separate the set of dies from another portion of the wafer.