Patents by Inventor Wei-Hsiang Lin
Wei-Hsiang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240148301Abstract: The present invention provides a smart wearable device, which is held on an upper body of a wearer by a plurality of contact pad sets, and has a connection unit, a first sensing module, a second sensing module, and an extension unit.Type: ApplicationFiled: November 7, 2022Publication date: May 9, 2024Inventors: Chien-Hsiang Chang, Yang-Cheng Lin, Wei-Chih Lien, Tseng-Ping Chiu, Pei-Yun Wu, Bo Liu
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Patent number: 11977251Abstract: A backlight module including a light guide plate, a light source, an upper prism sheet, and a lower prism sheet is provided. The light guide plate has a light incident surface and a light emitting surface. The upper prism sheet is disposed at a side of the light emitting surface of the light guide plate. The upper prism sheet includes an upper substrate and first prism microstructures. Cross-sections of the first prism microstructures are isosceles triangles, and apex angles thereof fall within a range of 80 to 90 degrees. The lower prism sheet is disposed between the light guide plate and the upper prism sheet. The lower prism sheet includes a lower substrate and second prism microstructures. Cross-sections of the second prism microstructures are isosceles triangles, and apex angles thereof fall within a range of 100 to 130 degrees.Type: GrantFiled: February 6, 2023Date of Patent: May 7, 2024Assignee: Coretronic CorporationInventors: Chun-Hsiang Hsu, Yen-Hao Lin, Wei-Hsuan Cheng
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Publication number: 20240145379Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.Type: ApplicationFiled: February 23, 2023Publication date: May 2, 2024Inventors: Yen-Kun Lai, Wei-Hsiang Tu, Ching-Ho Cheng, Cheng-Nan Lin, Chiang-Jui Chu, Chien Hao Hsu, Kuo-Chin Chang, Mirng-Ji Lii
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Patent number: 11972537Abstract: A method for flattening a three-dimensional shoe upper template is provided. The method includes providing a three-dimensional last model, obtaining a three-dimensional grid model, obtaining a three-dimensional thickened grid model, obtaining a two-dimensional initial-value grid model, and obtaining a two-dimensional grid model with the smallest energy value. A system and a non-transitory computer-readable medium for performing the method are also provided. The method makes it possible to precisely flatten a three-dimensional last model with a non-developable surface and thereby convert the three-dimensional last model into a two-dimensional grid model.Type: GrantFiled: August 19, 2022Date of Patent: April 30, 2024Assignee: YU JUNG CHANG TECHNOLOGY CO., LTD.Inventors: Chih-Chuan Chen, Wei-Hsiang Tsai, Chin-Yu Chen, Ching-Cherng Sun, Jann-Long Chern, Yu-Kai Lin
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Patent number: 11968293Abstract: Context information of a handshake between a source entity and a target entity is obtained at a security proxy. The context information is transmitted from the security proxy to a key manager. The key manager maintains a first private key of the security proxy. A first handshake message is received from the key manager. The first handshake message is generated at least based on the context information and signed with the first private key. The first handshake message is then transmitted to the target entity.Type: GrantFiled: November 18, 2020Date of Patent: April 23, 2024Assignee: International Business Machines CorporationInventors: Wei-Hsiang Hsiung, Chun-Shuo Lin, Wei-Jie Liau, Cheng-Ta Lee
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Patent number: 11962239Abstract: A control circuit of a power converter and a control method thereof are provided. The control circuit includes an error amplifier, a controller, a digital filter, and a digital pulse width signal modulator. The error amplifying circuit is coupled to an output terminal of the power converter and provides a digital error signal. The controller provides a first working parameter corresponding to the first external control command when receiving a first external control command. The digital filter generates a current digital compensation value. The digital pulse width signal modulator generates a pulse width modulation signal. The controller provides a second working parameter corresponding to the second external control command when receiving a second external control command. The controller calculates a transition value according to the second working parameter and the current digital compensation value. The controller provides the second working parameter and the transition value to the digital filter.Type: GrantFiled: September 16, 2022Date of Patent: April 16, 2024Assignee: uPI Semiconductor Corp.Inventors: Yun-Kuo Lee, Wei-Hsiang Wang, Yen-Chih Lin, Wei-Hsiu Hung
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Patent number: 11955460Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.Type: GrantFiled: October 5, 2020Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
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Patent number: 11955338Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.Type: GrantFiled: January 30, 2023Date of Patent: April 9, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shih-Chun Huang, Ya-Wen Yeh, Chien-Wen Lai, Wei-Liang Lin, Ya Hui Chang, Yung-Sung Yen, Ru-Gun Liu, Chin-Hsiang Lin, Yu-Tien Shen
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Publication number: 20240113552Abstract: Power supplies and methods of use thereof are provided, where a power supply includes an input configured to receive input AC power an output configured to provide output AC power to a load, at least one power converter coupled to the input and configured to convert the input AC power into the output AC power, a controller coupled the at least one power converter. The controller is configured to adjust at least one parameter of the output AC power provided by the at least one power converter, detect, in response to adjusting the at least one parameter of the output AC power, at least one of an adjusted input AC power or an adjusted output AC power, and determine that a fault has occurred based on the at least one of the adjusted input AC power or the adjusted output AC power.Type: ApplicationFiled: December 13, 2023Publication date: April 4, 2024Inventors: Kenneth A. Colby, JR., Wei-Hsiang Lin, Venkatraman Chennakesavan, Eyob Demissie, Luka Petrovic, Himamshu V Prasad, Yu Zhang
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Method for reducing UPS component stresses during transition from inverter to green/bypass operation
Patent number: 11947402Abstract: UPS systems, methods, and computer-readable mediums utilizing electromechanical bypass relays to switch from an on-line mode of operation to a green/bypass mode of operation include control logic to adaptively adjust the timing of when an inverter of a UPS turns off to prevent backfeeding a utility. After the UPS is instructed to transition from the on-line mode to the green mode, a monitoring period begins. During the monitoring period, a parameter related to the output current of the inverter is monitored and compared to a predetermined threshold. If the parameter exceeds the predetermined threshold before a fixed period time has elapsed, the inverter is turned off early. If the inverter current does not exceed the predetermined value within the fixed period of time, the inverter is turned off.Type: GrantFiled: March 7, 2023Date of Patent: April 2, 2024Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventors: Wei-Hsiang Lin, Adam Daniel Sanner -
Patent number: 11947694Abstract: A method, a computer program product, and a system for implementing a dynamic virtual database honeypot. The method includes relaying a query request received from a database client to a database and receiving, from the database, a response relating to the query request. The method also includes determining the query request is an attack on the database based on session information relating to the database and the database client, generating a honey token based on information contained within the response, generating an alternate response formatted in a same format as the response and containing artificial information that masks the information contained within the response. The method further includes inserting the honey token into the alternate response and transmitting the alternate response to the database client.Type: GrantFiled: June 29, 2021Date of Patent: April 2, 2024Assignee: International Business Machines CorporationInventors: Galia Diamant, Richard Ory Jerrell, Chun-Shuo Lin, Wei-Hsiang Hsiung, Cheng-Ta Lee, Wei-Jie Liau
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Publication number: 20240102207Abstract: A temperature-sensing and humidity-controlling fiber includes a hydrophilic material and a temperature-sensing material. The temperature-sensing material has a lower critical solution temperature (LCST) between 31.2° C. and 32.5° C. when a light transmittance thereof is in a range from 3% to 80%, in which a wavelength of the light is between 450 nm and 550 nm.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Inventors: Wen-Jung CHEN, Wei-Hsiang LIN, Chao-Huei LIU
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Publication number: 20240094626Abstract: A pellicle for an extreme ultraviolet (EUV) photomask includes a pellicle frame and a main membrane attached to the pellicle frame. The main membrane includes a plurality of nanotubes, and each of the plurality of nanotubes is covered by a coating layer containing Si and one or more metal elements.Type: ApplicationFiled: April 12, 2023Publication date: March 21, 2024Inventors: Pei-Cheng HSU, Wei-Hao LEE, Huan-Ling LEE, Hsin-Chang LEE, Chin-Hsiang LIN
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Patent number: 11935757Abstract: A method of manufacturing a semiconductor device includes forming a first layer of a first planarizing material over a patterned surface of a substrate, forming a second layer of a second planarizing material over the first planarizing layer, crosslinking a portion of the first planarizing material and a portion of the second planarizing material, and removing a portion of the second planarizing material that is not crosslinked. In an embodiment, the method further includes forming a third layer of a third planarizing material over the second planarizing material after removing the portion of the second planarizing material that is not crosslinked. The third planarizing material can include a bottom anti-reflective coating or a spin-on carbon, and an acid or an acid generator. The first planarizing material can include a spin-on carbon, and an acid, a thermal acid generator or a photoacid generator.Type: GrantFiled: April 10, 2023Date of Patent: March 19, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yen-Hao Chen, Wei-Han Lai, Ching-Yu Chang, Chin-Hsiang Lin
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Patent number: 11935981Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.Type: GrantFiled: June 30, 2021Date of Patent: March 19, 2024Assignee: EPISTAR CORPORATIONInventors: Chu-Jih Su, Chia-Hsiang Chou, Wei-Chih Peng, Wen-Luh Liao, Chao-Shun Huang, Hsuan-Le Lin, Shih-Chang Lee, Mei Chun Liu, Chen Ou
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Publication number: 20240088293Abstract: An n-type metal oxide semiconductor transistor includes a gate structure, two source/drain regions, two amorphous portions and a silicide. The gate structure is disposed on a substrate. The two source/drain regions are disposed in the substrate and respectively located at two sides of the gate structure, wherein at least one of the source/drain regions is formed with a dislocation. The two amorphous portions are respectively disposed in the two source/drain regions. The silicide is disposed on the two source/drain regions, wherein at least one portion of the silicide overlaps the two amorphous portions.Type: ApplicationFiled: October 5, 2022Publication date: March 14, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chun-Ya Chiu, Ssu-I Fu, Chin-Hung Chen, Jin-Yan Chiou, Wei-Chuan Tsai, Yu-Hsiang Lin
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Patent number: 11925701Abstract: Provided is a method for skin conditioning comprising administering to a subject in need thereof a composition comprising a Dan Feng peony extract, where the Dan Feng peony extract is extracted from flowers of Dan Feng peony. The Dan Feng peony extract is used to increase the production of hyaluronic acid, maintain the structure of skin keratinocytes, and regulate the moisture content of skin cells.Type: GrantFiled: October 26, 2021Date of Patent: March 12, 2024Assignee: TCI CO., LTD.Inventors: Yung-Hsiang Lin, Wei-Chun Lee
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Patent number: 11909258Abstract: Power supplies and methods of use thereof are provided, where a power supply includes an input configured to receive input AC power an output configured to provide output AC power to a load, at least one power converter coupled to the input and configured to convert the input AC power into the output AC power, a controller coupled the at least one power converter. The controller is configured to adjust at least one parameter of the output AC power provided by the at least one power converter, detect, in response to adjusting the at least one parameter of the output AC power, at least one of an adjusted input AC power or an adjusted output AC power, and determine that a fault has occurred based on the at least one of the adjusted input AC power or the adjusted output AC power.Type: GrantFiled: March 18, 2022Date of Patent: February 20, 2024Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventors: Kenneth A. Colby, Jr., Wei-Hsiang Lin, Venkatraman Chennakesavan, Eyob Demissie, Luka Petrovic, Himamshu V Prasad, Yu Zhang
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Patent number: 11885045Abstract: A temperature-sensing and humidity-controlling fiber includes a hydrophilic material and a temperature-sensing material. The temperature-sensing material has a lower critical solution temperature (LCST) between 31.2° C. and 32.5° C. when a light transmittance thereof is in a range from 3% to 80%, in which a wavelength of the light is between 450 nm and 550 nm.Type: GrantFiled: March 9, 2022Date of Patent: January 30, 2024Assignee: TAIWAN TEXTILE RESEARCH INSTITUTEInventors: Wen-Jung Chen, Wei-Hsiang Lin, Chao-Huei Liu
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METHOD FOR REDUCING UPS COMPONENT STRESSES DURING TRANSITION FROM INVERTER TO GREEN/BYPASS OPERATION
Publication number: 20230266809Abstract: UPS systems, methods, and computer-readable mediums utilizing electromechanical bypass relays to switch from an on-line mode of operation to a green/bypass mode of operation include control logic to adaptively adjust the timing of when an inverter of a UPS turns off to prevent backfeeding a utility. After the UPS is instructed to transition from the on-line mode to the green mode, a monitoring period begins. During the monitoring period, a parameter related to the output current of the inverter is monitored and compared to a predetermined threshold. If the parameter exceeds the predetermined threshold before a fixed period time has elapsed, the inverter is turned off early. If the inverter current does not exceed the predetermined value within the fixed period of time, the inverter is turned off.Type: ApplicationFiled: March 7, 2023Publication date: August 24, 2023Inventors: Wei-Hsiang Lin, Adam Daniel Sanner