Patents by Inventor Wei-Hsiang Tsai

Wei-Hsiang Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955460
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Publication number: 20240088293
    Abstract: An n-type metal oxide semiconductor transistor includes a gate structure, two source/drain regions, two amorphous portions and a silicide. The gate structure is disposed on a substrate. The two source/drain regions are disposed in the substrate and respectively located at two sides of the gate structure, wherein at least one of the source/drain regions is formed with a dislocation. The two amorphous portions are respectively disposed in the two source/drain regions. The silicide is disposed on the two source/drain regions, wherein at least one portion of the silicide overlaps the two amorphous portions.
    Type: Application
    Filed: October 5, 2022
    Publication date: March 14, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Ya Chiu, Ssu-I Fu, Chin-Hung Chen, Jin-Yan Chiou, Wei-Chuan Tsai, Yu-Hsiang Lin
  • Publication number: 20240020438
    Abstract: This invention provides a shoe upper design model generating method, system and non-transitory computer readable storage media, including steps of providing a 2D mapping boundary, providing a 3D upper, performing a flattening algorithm on the 3D upper with respect to the 2D mapping boundary, constructing a 2D upper boundary, creating an upper design drawing on the 2D upper boundary, intersecting the 2D upper boundary and the 2D mapping boundary to form a 2D upper design area and mapping grids in the 2D upper design area onto grids in the 3D upper, thereby obtaining an upper design model containing the mapping relation between the 2D upper design area and the 3D upper. Accordingly, the upper pattern making time and cost can be saved, and the distortion and deformation in the process of 2D-3D conversion can be reduced, thus the completed 2D upper design drawing can be used in production process directly.
    Type: Application
    Filed: April 20, 2023
    Publication date: January 18, 2024
    Inventors: Wei-Hsiang TSAI, CHIN-YU CHEN, CHUN-HENG LIN, CHIH-PENG CHEN, FONG-YI SYU
  • Publication number: 20230057550
    Abstract: A method for flattening a three-dimensional shoe upper template is provided. The method includes providing a three-dimensional last model, obtaining a three-dimensional grid model, obtaining a three-dimensional thickened grid model, obtaining a two-dimensional initial-value grid model, and obtaining a two-dimensional grid model with the smallest energy value. A system and a non-transitory computer-readable medium for performing the method are also provided. The method makes it possible to precisely flatten a three-dimensional last model with a non-developable surface and thereby convert the three-dimensional last model into a two-dimensional grid model.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 23, 2023
    Inventors: Chih-Chuan CHEN, Wei-Hsiang TSAI, Chin-Yu CHEN, Ching-Cherng SUN, Jann-Long CHERN, Yu-Kai LIN
  • Patent number: 10812505
    Abstract: A computer system includes an openflow switch, configured to receive a plurality of packets; a network controller, coupled to the openflow switch and configured to determine a route of each of the plurality of packets; and a detecting and defending system, configured to perform transformation of information formats of the plurality of packets, retrieve and label the plurality of packets to determine whether the plurality of packets are abnormal or not and generate a defending determination.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: October 20, 2020
    Assignee: National Chung-Shan Institute of Science and Technology
    Inventors: Li-Der Chou, Chia-Wei Tseng, Chia-Kuan Yen, Wei-Hsiang Tsai, Tsung-Fu Ou, Yi-Hsuan Chiu, Wei-Yu Chen, Meng-Sheng Lai
  • Publication number: 20200195661
    Abstract: A computer system includes an openflow switch, configured to receive a plurality of packets; a network controller, coupled to the openflow switch and configured to determine a route of each of the plurality of packets; and a detecting and defending system, configured to perform transformation of information formats of the plurality of packets, retrieve and label the plurality of packets to determine whether the plurality of packets are abnormal or not and generate a defending determination.
    Type: Application
    Filed: December 12, 2018
    Publication date: June 18, 2020
    Inventors: Li-Der Chou, Chia-Wei Tseng, Chia-Kuan Yen, Wei-Hsiang Tsai, Tsung-Fu Ou, Yi-Hsuan Chiu, Wei-Yu Chen, Meng-Sheng Lai
  • Publication number: 20150010716
    Abstract: A sheetless backlight module and a light guide plate thereof are provided. The light guide plate includes a body and a plurality of light scattering units. The body has a bottom and a plurality of microstructures formed on the bottom and recessed in the body from the bottom. The pluralities of light scattering units are disposed in a plurality of spaces formed due to the plurality of microstructures recessed in the body. A manufacturing method of the light guide plate mentioned above includes forming the plurality of microstructures on the bottom of the body; preparing a fluid solution containing at least a diffusive reflective material; distributing the fluid solution on the bottom; driving the fluid solution to flow into the microstructures; removing the part of the fluid solution outside the microstructures; and solidifying the fluid solution to form the plurality of light scattering units.
    Type: Application
    Filed: September 26, 2014
    Publication date: January 8, 2015
    Inventors: Yu-Ping Wu, Fu-Cheng Fan, Wei-Hsiang Tsai, Wei-Hung Lo
  • Patent number: 8870432
    Abstract: A sheetless backlight module and a light guide plate thereof are provided. The light guide plate includes a body and a plurality of light scattering units. The body has a bottom and a plurality of microstructures formed on the bottom and recessed in the body from the bottom. The pluralities of light scattering units are disposed in a plurality of spaces formed due to the plurality of microstructures recessed in the body. A manufacturing method of the light guide plate mentioned above includes forming the plurality of microstructures on the bottom of the body; preparing a fluid solution containing at least a diffusive reflective material; distributing the fluid solution on the bottom; driving the fluid solution to flow into the microstructures; removing the part of the fluid solution outside the microstructures; and solidifying the fluid solution to form the plurality of light scattering units.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: October 28, 2014
    Assignee: Au Optronics Corporation
    Inventors: Yu-Ping Wu, Fu-Cheng Fan, Wei-Hsiang Tsai, Wei-Hung Lo
  • Publication number: 20130094243
    Abstract: A sheetless backlight module and a light guide plate thereof are provided. The light guide plate includes a body and a plurality of light scattering units. The body has a bottom and a plurality of microstructures formed on the bottom and recessed in the body from the bottom. The pluralities of light scattering units are disposed in a plurality of spaces formed due to the plurality of microstructures recessed in the body. A manufacturing method of the light guide plate mentioned above includes forming the plurality of microstructures on the bottom of the body; preparing a fluid solution containing at least a diffusive reflective material; distributing the fluid solution on the bottom; driving the fluid solution to flow into the microstructures; removing the part of the fluid solution outside the microstructures; and solidifying the fluid solution to form the plurality of light scattering units.
    Type: Application
    Filed: May 18, 2012
    Publication date: April 18, 2013
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Yu-Ping Wu, Fu-Cheng Fan, Wei-Hsiang Tsai, Wei-Hung Lo