Patents by Inventor Wei-Hsiang Tseng
Wei-Hsiang Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220384174Abstract: A method includes providing a first plate including a first surface, a second surface opposite to the first surface, and a first recess indented from the first surface towards the second surface; providing a semiconductor structure including a third surface, a fourth surface opposite to the third surface, and a first sidewall extending between the third surface and the fourth surface; placing the semiconductor structure over the first plate; and disposing a priming material over the third surface of the semiconductor structure, wherein a peripheral portion of the fourth surface of the semiconductor structure is in contact with the first surface of the first plate upon the disposing of the priming material.Type: ApplicationFiled: August 9, 2022Publication date: December 1, 2022Inventors: YUNG-YAO LEE, CHEN YI HSU, WEI-HSIANG TSENG
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Publication number: 20220365435Abstract: A method for manufacturing a semiconductor device includes obtaining a first image of a fluid dispense nozzle using a first camera, the fluid dispense nozzle configured to dispense fluid on a semiconductor substrate, obtaining a second image of the fluid dispense nozzle using a second camera, the second image having a higher resolution than the first image, determining a width of the fluid dispense nozzle at multiple intervals along the fluid dispense nozzle and a width of a spray pattern of a fluid being dispensed from the fluid dispense nozzle at multiple intervals along the spray pattern, fitting a first straight line to a series of data points representing a plurality of widths of the intervals along the fluid dispense nozzle and a plurality of widths of the intervals along the spray pattern, determining a first slope of the first straight line, and determining a condition of the spray pattern and the fluid dispense nozzle based on the first slope.Type: ApplicationFiled: December 21, 2021Publication date: November 17, 2022Inventors: Jing CHANG, Ching-Hai YANG, Wei-Hsiang TSENG
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Patent number: 11482417Abstract: A method includes providing a first plate including a first surface, a second surface opposite to the first surface, and a first recess indented from the first surface towards the second surface; providing a semiconductor structure including a third surface, a fourth surface opposite to the third surface, and a first sidewall extending between the third surface and the fourth surface; placing the semiconductor structure over the first plate; and disposing a priming material over the third surface of the semiconductor structure, wherein a peripheral portion of the fourth surface of the semiconductor structure is in contact with the first surface of the first plate upon the disposing of the priming material.Type: GrantFiled: August 23, 2019Date of Patent: October 25, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yung-Yao Lee, Chen Yi Hsu, Wei-Hsiang Tseng
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Patent number: 11379714Abstract: An in-memory computing memory device is disclosed. The memory device comprises an array of memory cells, a plurality of word lines, a plurality of bit lines, (M+1) input circuits, a wordline driver and an evaluation circuitry. The array is divided into (M+1) lanes and each lane comprises P memory cell columns and an input circuit. The input circuit in each lane charges a predefined bit line with a default amount of charge proportional to an input synapse value and then distributes the default amount of charge to the other second bit lines with a predefined ratio based on a constant current. The evaluation circuitry couples a selected number of the bit lines to an accumulate line and convert an average voltage at the accumulate line into a digital value in response to a set of (M+1) input synapse values and the activated word line.Type: GrantFiled: May 29, 2019Date of Patent: July 5, 2022Assignee: BRITISH CAYMAN ISLANDS INTELLIGO TECHNOLOGY INC.Inventors: Chi-Wei Peng, Wei-Hsiang Tseng, Hong-Ching Chen, Shen-Jui Huang, Meng-Hsun Wen, Yu-Pao Tsai, Hsuan-Yi Hou, Ching-Hao Yu, Tsung-Liang Chen
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Patent number: 11162777Abstract: A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide a light directed to the wafer. The light detection device is configured to detect reflected light intensity from the wafer to locate at least one wafer alignment mark of wafer alignment marks separated by a plurality of angles. At least two of those angles are equal.Type: GrantFiled: December 23, 2019Date of Patent: November 2, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Hsiang Tseng, Chin-Hsiang Lin, Heng-Hsin Liu, Jui-Chun Peng, Ho-Ping Chen
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Patent number: 11014103Abstract: Present disclosure provides a substrate processing apparatus, including a rotatable pedestal configured to hold a substrate, a driving mechanism connected to the rotatable pedestal, a liquid pouring nozzle over the pedestal, a temperature sensor configured to probe a temperature of the substrate processing apparatus, and a controller communicating with the temperature sensor and the driving mechanism. Present disclosure also provides a method for processing a substrate, including providing a substrate on a pedestal of a processing chamber, probing a temperature of the processing chamber, calculating a temperature difference between the temperature of the processing chamber and a predetermined temperature, and determining a rotational speed difference with respect to a predetermined rotational speed of the pedestal according to the temperature difference.Type: GrantFiled: July 26, 2017Date of Patent: May 25, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yung-Yao Lee, Wei-Hsiang Tseng
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Publication number: 20210057206Abstract: A method includes providing a first plate including a first surface, a second surface opposite to the first surface, and a first recess indented from the first surface towards the second surface; providing a semiconductor structure including a third surface, a fourth surface opposite to the third surface, and a first sidewall extending between the third surface and the fourth surface; placing the semiconductor structure over the first plate; and disposing a priming material over the third surface of the semiconductor structure, wherein a peripheral portion of the fourth surface of the semiconductor structure is in contact with the first surface of the first plate upon the disposing of the priming material.Type: ApplicationFiled: August 23, 2019Publication date: February 25, 2021Inventors: YUNG-YAO LEE, CHEN YI HSU, WEI-HSIANG TSENG
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Patent number: 10867872Abstract: A method for manufacturing a semiconductor structure is provided. The method includes the following operations. A first semiconductor substrate is provided on a spin chuck. A first humidity factor near the first semiconductor substrate is obtained. A resist material is dispensed on the first semiconductor substrate. The spin chuck is rotated at a first speed. The first speed is determined based on the first humidity factor.Type: GrantFiled: April 29, 2019Date of Patent: December 15, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yung-Yao Lee, Wei-Hsiang Tseng
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Publication number: 20200132436Abstract: A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide a light directed to the wafer. The light detection device is configured to detect reflected light intensity from the wafer to locate at least one wafer alignment mark of wafer alignment marks separated by a plurality of angles. At least two of those angles are equal.Type: ApplicationFiled: December 23, 2019Publication date: April 30, 2020Inventors: Wei-Hsiang Tseng, Chin-Hsiang Lin, Heng-Hsin Liu, Jui-Chun Peng, Ho-Ping Chen
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Publication number: 20200090030Abstract: An integrated circuit applied in a deep neural network is disclosed. The integrated circuit comprises at least one processor, a first internal memory, a second internal memory, at least one MAC circuit, a compressor and a decompressor. The processor performs a cuboid convolution over decompression data for each cuboid of an input image fed to any one of multiple convolution layers. The MAC circuit performs multiplication and accumulation operations associated with the cuboid convolution to output a convoluted cuboid. The compressor compresses the convoluted cuboid into one compressed segment and store it in the second internal memory. The decompressor decompresses data from the second internal memory segment by segment to store the decompression data in the first internal memory. The input image is horizontally divided into multiple cuboids with an overlap of at least one row for each channel between any two adjacent cuboids.Type: ApplicationFiled: September 17, 2019Publication date: March 19, 2020Inventors: Shen-Jui HUANG, Meng-Hsun WEN, Yu-Pao TSAI, Hsuan-Yi HOU, Ching-Hao YU, Wei-Hsiang TSENG, Chi-Wei PENG, Hong-Ching CHEN, Tsung-Liang CHEN
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Publication number: 20200035570Abstract: A method for manufacturing a semiconductor structure is provided. The method includes the following operations. A first semiconductor substrate is provided on a spin chuck. A first humidity factor near the first semiconductor substrate is obtained. A resist material is dispensed on the first semiconductor substrate. The spin chuck is rotated at a first speed. The first speed is determined based on the first humidity factor.Type: ApplicationFiled: April 29, 2019Publication date: January 30, 2020Inventors: YUNG-YAO LEE, WEI-HSIANG TSENG
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Patent number: 10514247Abstract: A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide a light directed to the wafer. The light detection device is configured to detect reflected light intensity from the wafer to locate at least one wafer alignment mark of wafer alignment marks separated by a plurality of angles. At least two of those angles are equal.Type: GrantFiled: January 8, 2018Date of Patent: December 24, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Hsiang Tseng, Chin-Hsiang Lin, Heng-Hsin Liu, Jui-Chun Peng, Ho-Ping Chen
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Publication number: 20190370640Abstract: An in-memory computing memory device is disclosed. The memory device comprises an array of memory cells, a plurality of word lines, a plurality of bit lines, (M+1) input circuits, a wordline driver and an evaluation circuitry. The array is divided into (M+1) lanes and each lane comprises P memory cell columns and an input circuit. The input circuit in each lane charges a predefined bit line with a default amount of charge proportional to an input synapse value and then distributes the default amount of charge to the other second bit lines with a predefined ratio based on a constant current. The evaluation circuitry couples a selected number of the bit lines to an accumulate line and convert an average voltage at the accumulate line into a digital value in response to a set of (M+1) input synapse values and the activated word line.Type: ApplicationFiled: May 29, 2019Publication date: December 5, 2019Inventors: Chi-Wei PENG, Wei-Hsiang TSENG, Hong-Ching CHEN, Shen-Jui HUANG, Meng-Hsun WEN, Yu-Pao TSAI, Hsuan-Yi HOU, Ching-Hao YU, Tsung-Liang CHEN
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Patent number: 10305427Abstract: A digital modulating device includes an oscillator that generates an oscillation signal, and a frequency doubling modulator that includes: a single-ended to differential converter converting the oscillation signal into two periodic signals; two inductors respectively receiving the periodic signals and respectively providing two input signals; a switching circuit; and two amplifier circuits. When the switching circuit operates in a first state, the amplifier circuits respectively amplify the input signals to respectively generate two amplified signals that are combined into a combined signal at a common node thereof. When the switching circuit operates in a second state, the amplifier circuits do not perform amplification.Type: GrantFiled: July 13, 2017Date of Patent: May 28, 2019Assignee: NATIONAL CHI NAN UNIVERSITYInventors: Yo-Sheng Lin, Wei-Hsiang Tseng
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Publication number: 20190030550Abstract: Present disclosure provides a substrate processing apparatus, including a rotatable pedestal configured to hold a substrate, a driving mechanism connected to the rotatable pedestal, a liquid pouring nozzle over the pedestal, a temperature sensor configured to probe a temperature of the substrate processing apparatus, and a controller communicating with the temperature sensor and the driving mechanism. Present disclosure also provides a method for processing a substrate, including providing a substrate on a pedestal of a processing chamber, probing a temperature of the processing chamber, calculating a temperature difference between the temperature of the processing chamber and a predetermined temperature, and determining a rotational speed difference with respect to a predetermined rotational speed of the pedestal according to the temperature difference.Type: ApplicationFiled: July 26, 2017Publication date: January 31, 2019Inventors: YUNG-YAO LEE, WEI-HSIANG TSENG
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Publication number: 20180254743Abstract: A digital modulating device includes an oscillator that generates an oscillation signal, and a frequency doubling modulator that includes: a single-ended to differential converter converting the oscillation signal into two periodic signals; two inductors respectively receiving the periodic signals and respectively providing two input signals; a switching circuit; and two amplifier circuits. When the switching circuit operates in a first state, the amplifier circuits respectively amplify the input signals to respectively generate two amplified signals that are combined into a combined signal at a common node thereof. When the switching circuit operates in a second state, the amplifier circuits do not perform amplification.Type: ApplicationFiled: July 13, 2017Publication date: September 6, 2018Inventors: Yo-Sheng LIN, Wei-Hsiang TSENG
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Publication number: 20180128597Abstract: A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide a light directed to the wafer. The light detection device is configured to detect reflected light intensity from the wafer to locate at least one wafer alignment mark of wafer alignment marks separated by a plurality of angles. At least two of those angles are equal.Type: ApplicationFiled: January 8, 2018Publication date: May 10, 2018Inventors: Wei-Hsiang Tseng, Chin-Hsiang Lin, Heng-Hsin Liu, Jui-Chun Peng, Ho-Ping Chen
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Patent number: 9863754Abstract: A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide light directed to the wafer. The light detection device is configured to detect reflected light intensity from the wafer to locate at least one wafer alignment mark of wafer alignment marks separated by a plurality of angles. At least two of those angles are equal.Type: GrantFiled: September 15, 2014Date of Patent: January 9, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Hsiang Tseng, Chin-Hsiang Lin, Heng-Hsin Liu, Jui-Chun Peng, Ho-Ping Cheng
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Patent number: 9640487Abstract: A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a first wafer and a second wafer. The light source is configured to provide a first light directed to the first wafer and a second light directed to the second wafer. The light detection device is configured to detect reflected light intensity from the first wafer to find a position of at least one wafer alignment mark of the first wafer and to detect reflected light intensity from the second wafer to find a position of at least one wafer alignment mark of the second wafer.Type: GrantFiled: April 16, 2015Date of Patent: May 2, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Hsiang Tseng, Chao-Hsiung Wang, Chin-Hsiang Lin, Heng-Hsin Liu, Ho-Ping Chen, Jui-Chun Peng
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Publication number: 20150219448Abstract: A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a first wafer and a second wafer. The light source is configured to provide a first light directed to the first wafer and a second light directed to the second wafer. The light detection device is configured to detect reflected light intensity from the first wafer to find a position of at least one wafer alignment mark of the first wafer and to detect reflected light intensity from the second wafer to find a position of at least one wafer alignment mark of the second wafer.Type: ApplicationFiled: April 16, 2015Publication date: August 6, 2015Inventors: Wei-Hsiang TSENG, Chao-Hsiung WANG, Chin-Hsiang LIN, Heng-Hsin LIU, Ho-Ping CHEN, Jui-Chun PENG