Abstract: Embodiments of this application disclose a method for processing a floating point number and a related device, which may be used in the fields of general-purpose computing, high performance computing, artificial intelligence training and inference, and the like. The method includes: obtaining a first floating point number, where the first floating point number includes a first sign field, an exponent bit width field, a first exponent field, and a first mantissa field, and the exponent bit width field is used for indicating a bit width D occupied by the first exponent field in a total bit width N of the first floating point number; and obtaining normalized data corresponding to the first floating point number based on the first sign field, the exponent bit width field, the first exponent field, and the first mantissa field.

Abstract: Systems, methods, and computer-readable media for determining long binary sequences having low autocorrelation functions using evolutionary processes are disclosed. Biphase sequences are found with low peak sidelobe values meeting a predetermined criterion, e.g., threshold low auto-correlation function, including application of semidefinite programming in connection with determining an initial population, and evolving the population with an evolutionary algorithm to bits of the biphase sequences including bit flipping. The found biphase sequences can be communicated to a variety of applications, including wireless communications technologies.

Abstract: Sequence generation in wireless communication is provided for sequences having good aperiodic correlation properties. In particular, dual window quasi-Barker sequences are generated that possess at least some properties of Barker sequences. In addition, the sequences can be orthogonal to mitigate multiple access interference. Dual windowing allows the sequences even after being phase modulated by data to be recognized, provided that delay in transmission is large as compared to the correlation zone. In this regard, the sequences can be utilized in quasi-synchronous spread spectrum and/or code division multiple access (CDMA) signal communication to provide orthogonality while substantially eliminating inter-user and inter-symbol interference. In addition, unlike the single window low periodic correlation sequences, system overheads, such as cyclic prefix, need not be utilized in transmission as the data modulation effect can be accounted for by the dual windowing.

Abstract: A method for inhibiting electromigration-induced phase segregation suitable for solder joint configurations used in a chip package is described as following. First, a chip package including a wiring board, a chip and numbers of solder joints is provided, wherein the chip is disposed on the wiring board, and the solder joints are disposed between the chip and the wiring board to electrically connect the chip to the wiring board. Next, a first current and a second current are alternately applied to a side of the solder joints, wherein flowing directions of the first current and the second current are opposite. The current density of the first current is 103˜105 A/cm2, and the current density of the second current is 103˜105 A/cm2.

Abstract: Systems, methods, and computer-readable media for determining long binary sequences having low autocorrelation functions using evolutionary processes are disclosed. Biphase sequences are found with low peak sidelobe values meeting a predetermined criterion, e.g., threshold low auto-correlation function, including application of semidefinite programming in connection with determining an initial population, and evolving the population with an evolutionary algorithm to bits of the biphase sequences including bit flipping. The found biphase sequences can be communicated to a variety of applications, including wireless communications technologies.

Abstract: A method of inhibiting a formation of palladium-nickel-tin (Pd—Ni—Sn) intermetallic in solder joints is described as follows. Firstly, a solder alloy is provided. Then, at least one of a trace of copper and a trace of zinc is doped into the solder alloy. Afterward, the solder alloy is disposed on the Pd-bearing surface finish, such as a Pd/Ni bi-layer or a Au/Pd/Ni tri-layer. Next, the solder alloy is soldered with the surface finish as solder joints. During the soldering, the Cu and Zn will incorporate into the soldering reaction, forming copper-palladium-nickel-tin intermetallic and zinc-palladium-nickel-tin intermetallic, replacing the Pd—Ni—Sn respectively. Consequently, the addition of Cu and/or Zn into solders will inhibit the undesirable Pd—Ni—Sn intermetallic to form in the solder joints.

Abstract: Sequence generation in wireless communication is provided for sequences having good aperiodic correlation properties. In particular, dual window quasi-Barker sequences are generated that possess at least some properties of Barker sequences. In addition, the sequences can be orthogonal to mitigate multiple access interference. Dual windowing allows the sequences even after being phase modulated by data to be recognized, provided that delay in transmission is large as compared to the correlation zone. In this regard, the sequences can be utilized in quasi-synchronous spread spectrum and/or code division multiple access (CDMA) signal communication to provide orthogonality while substantially eliminating inter-user and inter-symbol interference. In addition, unlike the single window low periodic correlation sequences, system overheads, such as cyclic prefix, need not be utilized in transmission as the data modulation effect can be accounted for by the dual windowing.

Abstract: A method for inhibiting electromigration-induced phase segregation suitable for solder joint configurations used in a chip package is described as following. First, a chip package including a wiring board, a chip and numbers of solder joints is provided, wherein the chip is disposed on the wiring board, and the solder joints are disposed between the chip and the wiring board to electrically connect the chip to the wiring board. Next, a first current and a second current are alternately applied to a side of the solder joints, wherein flowing directions of the first current and the second current are opposite. The current density of the first current is 103˜105 A/cm2, and the current density of the second current is 103˜105 A/cm2.