Patents by Inventor Wei-Hsiang Wu
Wei-Hsiang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240148301Abstract: The present invention provides a smart wearable device, which is held on an upper body of a wearer by a plurality of contact pad sets, and has a connection unit, a first sensing module, a second sensing module, and an extension unit.Type: ApplicationFiled: November 7, 2022Publication date: May 9, 2024Inventors: Chien-Hsiang Chang, Yang-Cheng Lin, Wei-Chih Lien, Tseng-Ping Chiu, Pei-Yun Wu, Bo Liu
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Publication number: 20240146085Abstract: The present disclosure provides a battery charging system and method. The battery charging method includes: determining a degree of healthy of a battery module according to an evaluation mechanism; setting a charging standard according to the degree of healthy; by handshaking with a charger, setting a charging voltage for the charger according to the charging standard to charge the battery module; and by the charger, perform a charging operation on the battery module until a fully charged condition is satisfied.Type: ApplicationFiled: October 31, 2023Publication date: May 2, 2024Inventors: Tsung-Nan WU, Chih-Hsiang HSU, Wei-Cheng CHEN
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Patent number: 11973148Abstract: A semiconductor device and a method of forming the same is disclosed. The semiconductor device includes a substrate, a first well region disposed within the substrate, a second well region disposed adjacent to the first well region and within the substrate, and an array of well regions disposed within the first well region. The first well region includes a first type of dopants, the second well region includes a second type of dopants that is different from the first type of dopants, and the array of well regions include the second type of dopants. The semiconductor device further includes a metal silicide layer disposed on the array of well regions and within the substrate, a metal silicide nitride layer disposed on the metal silicide layer and within the substrate, and a contact structure disposed on the metal silicide nitride layer.Type: GrantFiled: November 18, 2021Date of Patent: April 30, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ting-Ying Wu, Yung-Hsiang Chen, Yu-Lung Yeh, Yen-Hsiu Chen, Wei-Liang Chen, Ying-Tsang Ho
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Publication number: 20240127767Abstract: A display device and a projector are provided. The display device includes a pixel light-emitting panel and multiple color conversion panels. The pixel light-emitting panel includes an N1 number of light-emitting pixel units distributed in an array, and the light-emitting pixel units are driven to emit light through a driver. A first color conversion panel includes an N2 number of first color pixels and an N3 number of first transparent pixels. The first color pixels and the first transparent pixels are disposed relative to the light-emitting pixel units. A second color conversion panel includes an N4 number of second color pixels and an N5 number of second transparent pixels. The second color pixels and the second transparent pixels are disposed relative to the light-emitting pixel units. The lights generated by at least part of the light-emitting pixel units sequentially pass through the first color pixels and the second transparent pixels to achieve the color conversion.Type: ApplicationFiled: December 15, 2022Publication date: April 18, 2024Applicant: Industrial Technology Research InstituteInventors: Hui-Tang Shen, Wei-Hung Kuo, Kai-Ling Liang, Chun-I Wu, Yu-Hsiang Chang
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Publication number: 20230305803Abstract: Embodiments of this application disclose a method for processing a floating point number and a related device, which may be used in the fields of general-purpose computing, high performance computing, artificial intelligence training and inference, and the like. The method includes: obtaining a first floating point number, where the first floating point number includes a first sign field, an exponent bit width field, a first exponent field, and a first mantissa field, and the exponent bit width field is used for indicating a bit width D occupied by the first exponent field in a total bit width N of the first floating point number; and obtaining normalized data corresponding to the first floating point number based on the first sign field, the exponent bit width field, the first exponent field, and the first mantissa field.Type: ApplicationFiled: March 23, 2023Publication date: September 28, 2023Inventors: Yuanyong Luo, Wei Hsiang Wu, Zhongxing Zhang
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Patent number: 8493245Abstract: Systems, methods, and computer-readable media for determining long binary sequences having low autocorrelation functions using evolutionary processes are disclosed. Biphase sequences are found with low peak sidelobe values meeting a predetermined criterion, e.g., threshold low auto-correlation function, including application of semidefinite programming in connection with determining an initial population, and evolving the population with an evolutionary algorithm to bits of the biphase sequences including bit flipping. The found biphase sequences can be communicated to a variety of applications, including wireless communications technologies.Type: GrantFiled: August 11, 2011Date of Patent: July 23, 2013Assignee: Dynamic Invention LLCInventors: Ke Lin Du, Wei Hsiang Wu, Wai Ho Mow
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Patent number: 8306092Abstract: Sequence generation in wireless communication is provided for sequences having good aperiodic correlation properties. In particular, dual window quasi-Barker sequences are generated that possess at least some properties of Barker sequences. In addition, the sequences can be orthogonal to mitigate multiple access interference. Dual windowing allows the sequences even after being phase modulated by data to be recognized, provided that delay in transmission is large as compared to the correlation zone. In this regard, the sequences can be utilized in quasi-synchronous spread spectrum and/or code division multiple access (CDMA) signal communication to provide orthogonality while substantially eliminating inter-user and inter-symbol interference. In addition, unlike the single window low periodic correlation sequences, system overheads, such as cyclic prefix, need not be utilized in transmission as the data modulation effect can be accounted for by the dual windowing.Type: GrantFiled: February 12, 2009Date of Patent: November 6, 2012Assignee: Kan Ling Capital, L.L.C.Inventors: Wei Hsiang Wu, Ho Yin Chan, Wai Ho Mow
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Patent number: 8207469Abstract: A method for inhibiting electromigration-induced phase segregation suitable for solder joint configurations used in a chip package is described as following. First, a chip package including a wiring board, a chip and numbers of solder joints is provided, wherein the chip is disposed on the wiring board, and the solder joints are disposed between the chip and the wiring board to electrically connect the chip to the wiring board. Next, a first current and a second current are alternately applied to a side of the solder joints, wherein flowing directions of the first current and the second current are opposite. The current density of the first current is 103˜105 A/cm2, and the current density of the second current is 103˜105 A/cm2.Type: GrantFiled: June 2, 2008Date of Patent: June 26, 2012Assignee: Yuan Ze UniversityInventors: Cheng-En Ho, Wei-Hsiang Wu
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Publication number: 20120062399Abstract: Systems, methods, and computer-readable media for determining long binary sequences having low autocorrelation functions using evolutionary processes are disclosed. Biphase sequences are found with low peak sidelobe values meeting a predetermined criterion, e.g., threshold low auto-correlation function, including application of semidefinite programming in connection with determining an initial population, and evolving the population with an evolutionary algorithm to bits of the biphase sequences including bit flipping. The found biphase sequences can be communicated to a variety of applications, including wireless communications technologies.Type: ApplicationFiled: August 11, 2011Publication date: March 15, 2012Applicant: THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Ke Lin DU, Wei Hsiang WU, Wai Ho MOW
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Publication number: 20100128757Abstract: Sequence generation in wireless communication is provided for sequences having good aperiodic correlation properties. In particular, dual window quasi-Barker sequences are generated that possess at least some properties of Barker sequences. In addition, the sequences can be orthogonal to mitigate multiple access interference. Dual windowing allows the sequences even after being phase modulated by data to be recognized, provided that delay in transmission is large as compared to the correlation zone. In this regard, the sequences can be utilized in quasi-synchronous spread spectrum and/or code division multiple access (CDMA) signal communication to provide orthogonality while substantially eliminating inter-user and inter-symbol interference. In addition, unlike the single window low periodic correlation sequences, system overheads, such as cyclic prefix, need not be utilized in transmission as the data modulation effect can be accounted for by the dual windowing.Type: ApplicationFiled: February 12, 2009Publication date: May 27, 2010Applicant: THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Wei Hsiang Wu, Ho Yin Chan, Wai Ho Mow
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Publication number: 20100127047Abstract: A method of inhibiting a formation of palladium-nickel-tin (Pd—Ni—Sn) intermetallic in solder joints is described as follows. Firstly, a solder alloy is provided. Then, at least one of a trace of copper and a trace of zinc is doped into the solder alloy. Afterward, the solder alloy is disposed on the Pd-bearing surface finish, such as a Pd/Ni bi-layer or a Au/Pd/Ni tri-layer. Next, the solder alloy is soldered with the surface finish as solder joints. During the soldering, the Cu and Zn will incorporate into the soldering reaction, forming copper-palladium-nickel-tin intermetallic and zinc-palladium-nickel-tin intermetallic, replacing the Pd—Ni—Sn respectively. Consequently, the addition of Cu and/or Zn into solders will inhibit the undesirable Pd—Ni—Sn intermetallic to form in the solder joints.Type: ApplicationFiled: January 13, 2009Publication date: May 27, 2010Applicant: Yuan Ze UniversityInventors: Cheng-En Ho, Wei-Hsiang Wu, Cheng-Shiuan Lin
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Publication number: 20090294409Abstract: A method for inhibiting electromigration-induced phase segregation suitable for solder joint configurations used in a chip package is described as following. First, a chip package including a wiring board, a chip and numbers of solder joints is provided, wherein the chip is disposed on the wiring board, and the solder joints are disposed between the chip and the wiring board to electrically connect the chip to the wiring board. Next, a first current and a second current are alternately applied to a side of the solder joints, wherein flowing directions of the first current and the second current are opposite. The current density of the first current is 103˜105 A/cm2, and the current density of the second current is 103˜105 A/cm2.Type: ApplicationFiled: June 2, 2008Publication date: December 3, 2009Applicant: Yuan Ze UniversityInventors: Cheng-En Ho, Wei-Hsiang Wu