Abstract: A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.

Abstract: A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.

Abstract: A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.

Abstract: A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.

Abstract: A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.

Abstract: A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.

Abstract: A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.

Abstract: A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.

Abstract: A manufacturing method for a liquid crystal display panel is provided. After providing a substrate having an insulation layer thereon, a first metal composite layer is formed on the insulation layer and then patterned to form at least one first opening through the first metal composite layer. A first intermediate dielectric layer is formed within the at least one first opening and a second intermediate dielectric layer is formed on the patterned first metal composite layer. The second intermediate dielectric layer is patterned to form second openings through the second intermediate dielectric layer. A second metal composite layer is formed on the patterned second intermediate dielectric layer and then patterned to form at least one third opening. Then, a third intermediate dielectric layer is formed within the at least one third opening.

Abstract: A color filter including a substrate, a plurality of first single-layer filter units and a plurality of first multilayer filter units is provided. The substrate has a plurality of first regions and a plurality of second regions. The first single-layer filter units is disposed on the substrate and located in the first regions respectively. The first multilayer filter units is disposed on the substrate and located in the second regions respectively. A manufacturing method for a color filter is also provided.

Abstract: A color filter including a substrate, a plurality of first single-layer filter units and a plurality of first multilayer filter units is provided. The substrate has a plurality of first regions and a plurality of second regions. The first single-layer filter units is disposed on the substrate and located in the first regions respectively. The first multilayer filter units is disposed on the substrate and located in the second regions respectively. A manufacturing method for a color filter is also provided.

Abstract: Residual direct-current charges may be accumulated and distributed non-uniformly on the built-in color filters in a displaying panel such as the liquid-crystal-on-silicon displaying device, and thus results in the non-uniformity of the internal electric field that controls the arrangement of liquid crystal molecules. To reduce residual direct-current charges so as to cause the internal electric field to be substantially uniform, the present invention provides a structure of the display panel including a plurality of shields for respectively enclosing a plurality of color filters, wherein each shield is connected to a corresponding pixel electrode by a conductive wire.

Abstract: A liquid crystal on silicon integrated circuit (LCOS IC) and electronic device using the same is provided. The electronic device comprises an LCOS IC, a processor and a cooler. The LCOS IC comprising a temperature sensor embedded in the LCOS IC for sensing a temperature and outputting a temperature sensing signal according to the temperature. The processor is coupled to the LCOS IC for receiving the temperature sensing signal and outputting a cooler control signal according to the temperature sensing signal. The cooler is coupled to the processor for receiving the cooler control signal and adjusting the cooler accordingly.

Abstract: Residual direct-current charges may be accumulated and distributed non-uniformly on the built-in color filters in a displaying panel such as the liquid-crystal-on-silicon displaying device, and thus results in the non-uniformity of the internal electric field that controls the arrangement of liquid crystal molecules. To reduce residual direct-current charges so as to cause the internal electric field to be substantially uniform, the present invention provides a structure of the display panel including a plurality of shields for respectively enclosing a plurality of color filters, wherein each shield is connected to a corresponding pixel electrode by a conductive wire.

Abstract: A reflective type liquid crystal panel including a substrate, an array of transistors, capacitors, metal patterns, conductive walls, reflective pixel electrodes, an opposite substrate, and a liquid crystal layer is provided. The transistors and the capacitors are disposed on the substrate, and the capacitors are surrounding drain terminals of the corresponding transistors respectively. The metal patterns cover the corresponding transistors and overlap the corresponding capacitors respectively, and the metal patterns are electrically connected to the corresponding drain terminals respectively. The conductive walls surround the corresponding transistors and are connected between the corresponding metal patterns and the corresponding capacitors respectively. The reflective pixel electrodes are disposed over the corresponding metal patterns and electrically connected to the corresponding drain terminals respectively.

Abstract: The invention relates to a method for manufacturing a mirror device with anti-reflective coating layer. The method of the invention comprises: (a) forming an anti-reflective metal film on a first surface of a mirror material to be a mirror device; (b) defining a plurality of mirror units from the mirror device, each mirror unit having a mirror layer and an anti-reflective metal film unit, the anti-reflective metal film unit formed on a first surface of the mirror layer; and (c) defining an anti-reflective coating layer from the anti-reflective metal film unit, the anti-reflective coating layer formed on edges of the first surface of the mirror layer. According to the invention, the anti-reflective coating layer on the mirror layer can shield a bright area caused by fringe effect so as to minimize the bad influence of the fringe effect. In manufacture, the method of the invention follows the semiconductor manufacturing process, and has high precision and simple process.

Abstract: A liquid crystal display apparatus having a lower substrate, an upper substrate, a liquid crystal layer and a protection configuration is provided. The lower substrate includes a first substrate, a pixel array and a patterned circuit. The first substrate has a display area and a peripheral circuit area. The pixel array is disposed in the display area on the first substrate. The patterned circuit is disposed in the peripheral circuit area on the first substrate and are electrically connected to the pixel array. The upper substrate is disposed over the lower substrate. The liquid crystal layer is disposed between the lower substrate and the upper substrate. The protection configuration partially covers the patterned circuit. Accordingly, a liquid crystal display apparatus that can prevent the patterned circuit from being damaged during a breaking process is provided.

Abstract: An LCOS IC and electronic device using the same is provided. The electronic device comprises an LCOS IC, a processor and a cooler. The LCOS IC comprising a temperature sensor embedded in the LCOS IC for sensing a temperature and outputting a temperature sensing signal according to the temperature. The processor is coupled to the LCOS IC for receiving the temperature sensing signal and outputting a cooler control signal according to the temperature sensing signal. The cooler is coupled to the processor for receiving the cooler control signal and adjusting the cooler accordingly.

Abstract: A reflective type liquid crystal panel including a substrate, an array of transistors, capacitors, metal patterns, conductive walls, reflective pixel electrodes, an opposite substrate, and a liquid crystal layer is provided. The transistors and the capacitors are disposed on the substrate, and the capacitors are surrounding drain terminals of the corresponding transistors respectively. The metal patterns cover the corresponding transistors and overlap the corresponding capacitors respectively, and the metal patterns are electrically connected to the corresponding drain terminals respectively. The conductive walls surround the corresponding transistors and are connected between the corresponding metal patterns and the corresponding capacitors respectively. The reflective pixel electrodes are disposed over the corresponding metal patterns and electrically connected to the corresponding drain terminals respectively.

Abstract: The invention relates to a method for manufacturing a mirror device with anti-reflective coating layer. The method of the invention comprises: (a) forming an anti-reflective metal film on a first surface of a mirror material to be a mirror device; (b) defining a plurality of mirror units from the mirror device, each mirror unit having a mirror layer and an anti-reflective metal film unit, the anti-reflective metal film unit formed on a first surface of the mirror layer; and (c) defining an anti-reflective coating layer from the anti-reflective metal film unit, the anti-reflective coating layer formed on edges of the first surface of the mirror layer. According to the invention, the anti-reflective coating layer on the mirror layer can shield a bright area caused by fringe effect so as to minimize the bad influence of the fringe effect. In manufacture, the method of the invention follows the semiconductor manufacturing process, and has high precision and simple process.