Patents by Inventor Wei-Hsien Fang

Wei-Hsien Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210225769
    Abstract: The invention provides an integrated circuit (IC) structure including a function circuit and a power ground (P/G) mesh electrically connected with the function circuit. The P/G mesh includes a first metal layer and a second metal layer. The first metal layer and the second metal layer are respectively disposed with a plurality of ground wires and a plurality of power wires. The power wires of the first metal layer are electrically connected with the power wires of the second metal layer through a plurality of first vias, and the ground wires of the first metal layer are electrically connected with the ground wires of the second metal layer through a plurality of second vias. A wire impedance of the first metal layer is different from a wire impedance of the second metal layer. The IC structure can achieve reduction of an IR-drop.
    Type: Application
    Filed: January 20, 2021
    Publication date: July 22, 2021
    Applicant: ALi Corporation
    Inventors: Hsin-Ying Tsai, Tzu-Wei Lan, Meng-Che Li, Wei-Hsien Fang
  • Patent number: 10249705
    Abstract: A capacitor array structure which includes N capacitor units is provided. Each capacitor unit includes a first metal layer, a second metal layer, and a third metal layer to form an upper electrode and a lower electrode. The second metal layer is disposed between the first metal layer and the third metal layer, and includes a second patterned metal portion of the lower electrode and a first patterned metal portion of the upper electrode. disposed above. The second patterned metal portion of the lower electrode has an opening, and a side of the first patterned metal portion of the upper electrode is exposed in the opening, such that the side of the first patterned metal portion of the upper electrode is adjacent to the lower electrode of another capacitor unit.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: April 2, 2019
    Assignee: ALi Corporation
    Inventors: Tzu-Wei Lan, Wei-Hsien Fang, Chih-Yu Chuang
  • Publication number: 20180358427
    Abstract: A capacitor array structure which includes N capacitor units is provided. Each capacitor unit includes a first metal layer, a second metal layer, and a third metal layer to form an upper electrode and a lower electrode. The second metal layer is disposed between the first metal layer and the third metal layer, and includes a second patterned metal portion of the lower electrode and a first patterned metal portion of the upper electrode. disposed above. The second patterned metal portion of the lower electrode has an opening, and a side of the first patterned metal portion of the upper electrode is exposed in the opening, such that the side of the first patterned metal portion of the upper electrode is adjacent to the lower electrode of another capacitor unit.
    Type: Application
    Filed: November 7, 2017
    Publication date: December 13, 2018
    Applicant: ALi Corporation
    Inventors: Tzu-Wei Lan, Wei-Hsien Fang, Chih-Yu Chuang
  • Publication number: 20140181775
    Abstract: A unit capacitor module for automatic capacitor-layout, includes a capacitor unit; at least one first connecting port, coupled to a first side of the capacitor unit; at least one second connecting port, coupled to a second side of the capacitor unit; at least one third connecting port, coupled to a third side of the capacitor unit; and at least one fourth connecting port, coupled to a fourth side of the capacitor unit; wherein the number of first connecting ports equals the number of second connecting ports, and the first connecting port and the second connecting port are symmetrical; and the number of third connecting ports equals the number of fourth connecting ports, and the third connecting port and the fourth connecting port are symmetrical.
    Type: Application
    Filed: March 13, 2013
    Publication date: June 26, 2014
    Applicant: ALI CORPORATION
    Inventors: Wei-Hsien Fang, Ping-Ying Kang